Heat Sinks

Results: 45
Packaging
BoxTray
Attachment Method
Adhesive (Not Included)AdhesivePush Pin
Length
0.335" (8.50mm)0.394" (10.00mm)0.472" (12.00mm)0.551" (14.00mm)0.669" (17.00mm)0.709" (18.00mm)0.787" (20.00mm)0.827" (21.00mm)0.906" (23.00mm)0.984" (25.00mm)1.063" (27.00mm)1.102" (28.00mm)
Width
0.335" (8.50mm)0.394" (10.00mm)0.472" (12.00mm)0.551" (14.00mm)0.669" (17.00mm)0.709" (18.00mm)0.787" (20.00mm)0.827" (21.00mm)0.906" (23.00mm)0.984" (25.00mm)1.063" (27.00mm)1.102" (28.00mm)
Fin Height
0.197" (5.00mm)0.236" (6.00mm)0.275" (7.00mm)0.315" (8.00mm)0.354" (9.00mm)0.394" (10.00mm)0.441" (11.20mm)0.453" (11.50mm)0.551" (14.00mm)0.591" (15.00mm)0.650" (16.51mm)0.709" (18.00mm)0.748" (19.00mm)0.866" (22.00mm)
Power Dissipation @ Temperature Rise
1.9W @ 75°C2.0W @ 75°C2.1W @ 75°C2.5W @ 75°C3.0W @ 75°C3.1W @ 75°C3.2W @ 75°C3.7W @ 75°C3.8W @ 75°C4.14W @ 75°C4.2W @ 75°C4.3W @ 75°C
Thermal Resistance @ Forced Air Flow
1.20°C/W @ 200 LFM1.40°C/W @ 200 LFM2.10°C/W @ 200 LFM2.60°C/W @ 200 LFM2.70°C/W @ 200 LFM2.80°C/W @ 200 LFM2.90°C/W @ 200 LFM3.20°C/W @ 200 LFM3.60°C/W @ 200 LFM3.80°C/W @ 200 LFM3.90°C/W @ 200 LFM4°C/W @ 200 LFM
Thermal Resistance @ Natural
3.45°C/W4.74°C/W6.41°C/W6.43°C/W6.65°C/W7.56°C/W7.62°C/W7.77°C/W7.96°C/W8.35°C/W8.74°C/W8.97°C/W
Material
Aluminum AlloyAluminumCopper
Material Finish
Black AnodizedClean Finished
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
HSB05-171711
HSB05-171711
HEAT SINK, BGA, 17 X 17 X 11.5 M
CUI Devices
1,856
In Stock
1 : ¥8.87000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.453" (11.50mm)
3.1W @ 75°C
8.40°C/W @ 200 LFM
23.91°C/W
Aluminum Alloy
Black Anodized
HSB02-101007
HSB02-101007
HEAT SINK, BGA, 10 X 10 X 7 MM
CUI Devices
6,009
In Stock
1 : ¥5.50000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
2.0W @ 75°C
16.50°C/W @ 200 LFM
37.90°C/W
Aluminum Alloy
Black Anodized
HSB01-080808
HSB01-080808
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
CUI Devices
4,789
In Stock
1 : ¥5.99000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
1.9W @ 75°C
16.00°C/W @ 200 LFM
39.10°C/W
Aluminum Alloy
Black Anodized
HSB04-171706
HSB04-171706
HEAT SINK, BGA, 17 X 17 X 6 MM
CUI Devices
1,893
In Stock
1 : ¥6.65000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.236" (6.00mm)
2.5W @ 75°C
13.10°C/W @ 200 LFM
29.73°C/W
Aluminum Alloy
Black Anodized
HSB07-202009
HSB07-202009
HEAT SINK, BGA, 20 X 20 X 9 MM
CUI Devices
1,827
In Stock
1 : ¥6.90000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.787" (20.00mm)
0.787" (20.00mm)
-
0.354" (9.00mm)
3.1W @ 75°C
8.60°C/W @ 200 LFM
24.08°C/W
Aluminum Alloy
Black Anodized
HSB12-272706
HSB12-272706
HEAT SINK, BGA, 27 X 27 X 6 MM
CUI Devices
1,267
In Stock
1 : ¥7.31000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.063" (27.00mm)
1.063" (27.00mm)
-
0.236" (6.00mm)
3.8W @ 75°C
7.80°C/W @ 200 LFM
19.59°C/W
Aluminum Alloy
Black Anodized
HSB09-212115
HSB09-212115
HEAT SINK, BGA, 21 X 21 X 15 MM
CUI Devices
2,096
In Stock
1 : ¥7.63000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.827" (21.00mm)
0.827" (21.00mm)
-
0.591" (15.00mm)
4.3W @ 75°C
6.00°C/W @ 200 LFM
17.39°C/W
Aluminum Alloy
Black Anodized
HSB06-181810
HSB06-181810
HEAT SINK, BGA, 18 X 18 X 10 MM
CUI Devices
1,913
In Stock
1 : ¥8.37000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.709" (18.00mm)
0.709" (18.00mm)
-
0.394" (10.00mm)
3.2W @ 75°C
18.80°C/W @ 200 LFM
23.68°C/W
Aluminum Alloy
Black Anodized
HSB18-232310
HSB18-232310
HEAT SINK, BGA, 23 X 23 X 10 MM
CUI Devices
4,619
In Stock
1 : ¥8.54000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.906" (23.00mm)
0.906" (23.00mm)
-
0.394" (10.00mm)
3.7W @ 75°C
6.80°C/W @ 200 LFM
20.41°C/W
Aluminum Alloy
Black Anodized
HSB26-343408
HSB26-343408
HEAT SINK, BGA, 33.5 X 33.5 X 8
CUI Devices
781
In Stock
1 : ¥9.36000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.319" (33.50mm)
1.319" (33.50mm)
-
0.315" (8.00mm)
4.94W @ 75°C
5.30°C/W @ 200 LFM
15.19°C/W
Aluminum Alloy
Black Anodized
HSB11-252518
HSB11-252518
HEAT SINK, BGA, 25 X 25 X 18 MM
CUI Devices
2,916
In Stock
1 : ¥10.51000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.984" (25.00mm)
0.984" (25.00mm)
-
0.709" (18.00mm)
5.5W @ 75°C
4.50°C/W @ 200 LFM
13.70°C/W
Aluminum Alloy
Black Anodized
HSB25-282810
HSB25-282810
HEAT SINK, BGA, 28.5 X 28.5 X 10
CUI Devices
1,049
In Stock
1 : ¥10.67000
Box
Box
Active
Top Mount
BGA
Push Pin
Square, Pin Fins
1.122" (28.50mm)
1.122" (28.50mm)
-
0.394" (10.00mm)
4.87W @ 75°C
5.10°C/W @ 200 LFM
15.41°C/W
Aluminum Alloy
Black Anodized
HSB23-232325
HSB23-232325
HEAT SINK, BGA, 23 X 23 X 25 MM
CUI Devices
359
In Stock
1 : ¥11.25000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.906" (23.00mm)
0.906" (23.00mm)
-
0.984" (25.00mm)
6.13W @ 75°C
3.80°C/W @ 200 LFM
12.23°C/W
Aluminum Alloy
Black Anodized
HSB15-404010
HSB15-404010
HEAT SINK, BGA, 40 X 40 X 10 MM
CUI Devices
849
In Stock
1 : ¥12.97000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.575" (40.00mm)
1.575" (40.00mm)
-
0.394" (10.00mm)
6.3W @ 75°C
3.90°C/W @ 200 LFM
11.84°C/W
Aluminum Alloy
Black Anodized
HSB14-353518
HSB14-353518
HEAT SINK, BGA, 35 X 35 X 18 MM
CUI Devices
809
In Stock
1 : ¥13.53000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.378" (35.00mm)
1.378" (35.00mm)
-
0.709" (18.00mm)
8.4W @ 75°C
3.60°C/W @ 200 LFM
8.97°C/W
Aluminum Alloy
Black Anodized
HSB20-353525
HSB20-353525
HEAT SINK, BGA, 35 X 35 X 25 MM
CUI Devices
436
In Stock
1 : ¥16.25000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.378" (35.00mm)
1.378" (35.00mm)
-
0.984" (25.00mm)
11.3W @ 75°C
2.70°C/W @ 200 LFM
6.65°C/W
Aluminum Alloy
Black Anodized
HSB21-454515
HSB21-454515
HEAT SINK, BGA, 45 X 45 X 15 MM
CUI Devices
961
In Stock
1 : ¥17.49000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.772" (45.00mm)
1.772" (45.00mm)
-
0.591" (15.00mm)
9.9W @ 75°C
2.80°C/W @ 200 LFM
7.56°C/W
Aluminum Alloy
Black Anodized
HSB16-404018
HSB16-404018
HEAT SINK, BGA, 40 X 40 X 18 MM
CUI Devices
1,122
In Stock
1 : ¥18.31000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.575" (40.00mm)
1.575" (40.00mm)
-
0.709" (18.00mm)
9.4W @ 75°C
2.60°C/W @ 200 LFM
7.96°C/W
Aluminum Alloy
Black Anodized
HSB17-404025
HSB17-404025
HEAT SINK, BGA, 40 X 40 X 25 MM
CUI Devices
1,371
In Stock
1 : ¥20.77000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.575" (40.00mm)
1.575" (40.00mm)
-
0.984" (25.00mm)
11.7W @ 75°C
2.10°C/W @ 200 LFM
6.41°C/W
Aluminum Alloy
Black Anodized
HSB13-303014
HSB13-303014
HEAT SINK, BGA, 30.7 X 30.7 X 14
CUI Devices
370
In Stock
1 : ¥11.08000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.209" (30.70mm)
1.209" (30.70mm)
-
0.551" (14.00mm)
6.1W @ 75°C
4.70°C/W @ 200 LFM
12.36°C/W
Aluminum Alloy
Black Anodized
HSB31-212105
HSB31-212105
HEAT SINK, BGA, 21 X 21 X 5 MM
CUI Devices
1,872
In Stock
1 : ¥7.23000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.827" (21.00mm)
0.827" (21.00mm)
-
0.197" (5.00mm)
3.0W @ 75°C
9.90°C/W @ 200 LFM
25.33°C/W
Aluminum Alloy
Black Anodized
HSB34-282811
HSB34-282811
HEAT SINK, BGA, 28 X 28 X 11.2 M
CUI Devices
1,110
In Stock
1 : ¥9.35000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.102" (28.00mm)
1.102" (28.00mm)
-
0.441" (11.20mm)
5.0W @ 75°C
5.10°C/W @ 200 LFM
15.05°C/W
Aluminum Alloy
Black Anodized
HSB32-232318
HSB32-232318
HEAT SINK, BGA, 23 X 23 X 18 MM,
CUI Devices
696
In Stock
1 : ¥10.97000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.906" (23.00mm)
0.906" (23.00mm)
-
0.709" (18.00mm)
5.9W @ 75°C
4.40°C/W @ 200 LFM
12.67°C/W
Aluminum Alloy
Black Anodized
HSB33-272710
HSB33-272710
HEAT SINK, BGA, 27 X 27 X 10 MM,
CUI Devices
1,120
In Stock
1 : ¥11.56000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.063" (27.00mm)
1.063" (27.00mm)
-
0.394" (10.00mm)
4.4W @ 75°C
5.30°C/W @ 200 LFM
17.22°C/W
Aluminum Alloy
Black Anodized
HSB36-353510
HSB36-353510
HEAT SINK, BGA, 35 X 35 X 10 MM,
CUI Devices
640
In Stock
1 : ¥15.73000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.378" (35.00mm)
1.378" (35.00mm)
-
0.394" (10.00mm)
5.9W @ 75°C
4.30°C/W @ 200 LFM
12.72°C/W
Aluminum Alloy
Black Anodized
Showing
of 45

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.