Adhesives, Epoxies, Greases, Pastes

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Size / Dimension	Usable Temperature Range	Color	Thermal Conductivity	Features	Shelf Life	Storage/Refrigeration Temperature

CW7270 HEAT SINK GREASE SILICONE FREE Chemtronics	466 In Stock	1 : ¥127.06000 Bulk	CircuitWorks®	Bulk	Active	Non-Silicone Grease	7 gram Syringe	-99.4°F ~ 392°F (-73°C ~ 200°C)	White	0.71W/m-K	-	60 Months	-
8329TFS-50ML SLOW CURE THERM COND ADH FLOW MG Chemicals	80 In Stock	1 : ¥473.15000 Bulk	8329TFS	Bulk	Active	Epoxy, 2 Part	45 ml Cartridge	-40°F ~ 302°F (-40°C ~ 150°C)	Black	1.20W/m-K	-	36 Months	50°F ~ 86°F (10°C ~ 30°C)
8349TFM-50ML THERMAL ADHESIVE 50ML MG Chemicals	350 In Stock	1 : ¥469.20000 Bulk	-	Bulk	Active	Epoxy, 2 Part	50 ml Cartridges	-67°F ~ 329°F (-50°C ~ 165°C)	White	0.90W/m-K	-	36 Months	50°F ~ 86°F (10°C ~ 30°C)
CW7100 CONDUCTIVE SILVER GREASE SYRINGE Chemtronics	417 In Stock	1 : ¥521.12000 Bulk	CircuitWorks®	Bulk	Active	Silicone Grease	6.5 gram Syringe	-70°F ~ 485°F (-57°C ~ 252°C)	Silver	5.60W/m-K	-	120 Months	-
9460TC-3ML THERMALLY CONDUCTIVE 1-PART EPOX MG Chemicals	114 In Stock	1 : ¥176.98000 Bulk	9460TC	Bulk	Active	Epoxy Adhesive	3 ml Syringe	-85°F ~ 302°F (-65°C ~ 150°C)	White	0.80W/m-K	-	14 Months	50°F ~ 86°F (10°C ~ 30°C)
EP770-1100 TWO-PART EPOXY THERMAL SEALING, Shiu Li Technology Co., Ltd.	296 In Stock	1 : ¥1,398.97000 Can	LiPOLY® EP770	Can	Active	Epoxy, 2 Part	1 kg Can	-76°F ~ 302°F (-60°C ~ 150°C)	Black	2.50W/m-K	-	60 Months	77°F (25°C) or Below
8349TFM-25ML THERMAL ADHESIVE 25ML MG Chemicals	78 In Stock	1 : ¥331.20000 Bulk	-	Bulk	Active	Epoxy, 2 Part	25 ml Syringe	-67°F ~ 329°F (-50°C ~ 165°C)	White	0.90W/m-K	-	36 Months	50°F ~ 86°F (10°C ~ 30°C)
1188118 STYCAST 2850FT BLK 3# 1.36KG LOCTITE	10 In Stock	1 : ¥1,126.85000 Bulk	LOCTITE® Stycast 2850FT	Bulk	Active	Epoxy, 2 Part (Order Catalyst Separately)	1.36 kg Container	-85°F ~ 221°F (-65°C ~ 105°C)	Black	-	-	12 Months	64.4°F ~ 77°F (18°C ~ 25°C)
1188124 STYCAST 2850FT BLU 3# INDIVIDUAL LOCTITE	7 In Stock	1 : ¥1,189.58000 Bulk	LOCTITE® Stycast 2850FT	Bulk	Active	Epoxy, 2 Part (Order Catalyst Separately)	3 lb Container	-85°F ~ 221°F (-65°C ~ 105°C)	Blue	-	-	12 Months	64.4°F ~ 77°F (18°C ~ 25°C)
1188134 STYCAST 2850KT BLU 3LB LOCTITE	8 In Stock	1 : ¥1,699.96000 Bulk	LOCTITE® Stycast 2850KT Catalyst 11	Bulk	Active	Epoxy, 2 Part (Order Catalyst Separately)	3 lb Container	-67°F ~ 311°F (-55°C ~ 155°C)	Blue	2.78W/m-K	-	12 Months	-
1188119 STYCAST 2850FT BLK18# 8.16KG LOCTITE	2 In Stock	1 : ¥2,201.26000 Bulk	LOCTITE® Stycast 2850FT	Bulk	Active	Epoxy, 2 Part (Order Catalyst Separately)	8.16 kg Container	-85°F ~ 221°F (-65°C ~ 105°C)	Black	-	-	18 Months	64.4°F ~ 77°F (18°C ~ 25°C)
TC2-10G HEAT SINK COMPOUND - GREY ULTRA Chip Quik Inc.	20 In Stock	1 : ¥184.82000 Bulk	-	Bulk	Active	Silicone Compound	10 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	4.30W/m-K	-	24 Months	37°F ~ 77°F (3°C ~ 25°C)
8329TFS-25ML SLOW CURE THERM COND ADH FLOW MG Chemicals	38 In Stock	1 : ¥330.63000 Bulk	8329TFS	Bulk	Active	Epoxy, 2 Part	25 ml Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Black	1.20W/m-K	-	36 Months	50°F ~ 86°F (10°C ~ 30°C)
8329TCS-50ML EPOXY MG Chemicals	20 In Stock	1 : ¥462.68000 Bulk	8329TCS	Bulk	Active	Epoxy, 2 Part	50 ml Jar	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	1.40W/m-K	Low Outgassing (ASTM E595)	36 Months	50°F ~ 86°F (10°C ~ 30°C)
1188135 STYCAST 2850KT BLU 20# LOCTITE	2 In Stock	1 : ¥3,245.48000 Bulk	LOCTITE® Stycast 2850KT Catalyst 11	Bulk	Active	Epoxy, 2 Part (Order Catalyst Separately)	20 lb Container	-67°F ~ 311°F (-55°C ~ 155°C)	Blue	2.78W/m-K	-	18 Months	-
1188100 STYCAST 2762FT (18LB), LOCTITE	0 In Stock Check Lead Time	4 : ¥3,947.98250 Bulk	LOCTITE® Stycast 2762FT	Bulk	Active	Epoxy, 2 Part (Order Catalyst Separately)	18 lb Container	-4°F ~ 446°F (-20°C ~ 230°C)	Black	1.34W/m-K	-	18 Months	64.4°F ~ 77°F (18°C ~ 25°C)

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Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.