CUI Devices Heat Sinks

Results: 188
Series
-HSBHSEHSS
Packaging
BagBoxCut Tape (CT)Digi-Reel®Tape & Reel (TR)Tray
Product Status
ActiveObsolete
Type
Board LevelBoard Level, VerticalTop Mount
Package Cooled
-BGAHalf Brick DC/DC ConverterTO-218TO-218, TO-220TO-220TO-252 (DPak)TO-263 (D²Pak)
Attachment Method
-Adhesive (Not Included)AdhesiveBolt On and Board MountsBolt On and PC PinBolt OnClip and Board MountsClip and PC PinClipPC PinPush PinThermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)
Shape
RectangularRectangular, Angled FinsRectangular, FinsSquareSquare, Angled FinsSquare, FinsSquare, Pin Fins
Length
0.211" (5.35mm)0.279" (7.10mm)0.303" (7.70mm)0.315" (8.00mm)0.335" (8.50mm)0.375" (9.53mm)0.394" (10.00mm)0.441" (11.20mm)0.472" (12.00mm)0.500" (12.70mm)0.512" (13.00mm)0.520" (13.20mm)
Width
0.250" (6.35mm)0.335" (8.50mm)0.375" (9.53mm)0.394" (10.00mm)0.472" (12.00mm)0.500" (12.70mm)0.504" (12.80mm)0.512" (13.00mm)0.520" (13.21mm)0.551" (14.00mm)0.625" (16.00mm)0.650" (16.50mm)
Fin Height
0.157" (4.00mm)0.177" (4.50mm)0.197" (5.00mm)0.211" (5.35mm)0.236" (6.00mm)0.256" (6.50mm)0.275" (7.00mm)0.295" (7.50mm)0.303" (7.70mm)0.315" (8.00mm)0.335" (8.50mm)0.354" (9.00mm)
Power Dissipation @ Temperature Rise
1.9W @ 75°C1.93W @ 75°C1.94W @ 75°C1.95W @ 75°C2.0W @ 75°C2.1W @ 75°C2.3W @ 75°C2.4W @ 75°C2.47W @ 75°C2.5W @ 75°C2.6W @ 75°C2.7W @ 75°C
Thermal Resistance @ Forced Air Flow
1.20°C/W @ 200 LFM1.40°C/W @ 200 LFM2.01°C/W @ 200 LFM2.10°C/W @ 200 LFM2.24°C/W @ 200 LFM2.29°C/W @ 200 LFM2.31°C/W @ 200 LFM2.38°C/W @ 200 LFM2.45°C/W @ 200 LFM2.50°C/W @ 200 LFM2.57°C/W @ 200 LFM2.60°C/W @ 200 LFM
Thermal Resistance @ Natural
3.45°C/W4.49°C/W4.70°C/W4.74°C/W4.85°C/W4.97°C/W5.47°C/W5.66°C/W5.77°C/W5.86°C/W6.25°C/W6.41°C/W
Material
Aluminum AlloyAluminumCopper AlloyCopper
Material Finish
Black AnodizedBlue AnodizedClean FinishedTin
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
HSB05-171711
HSB05-171711
HEAT SINK, BGA, 17 X 17 X 11.5 M
CUI Devices
1,436
In Stock
1 : ¥8.87000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.453" (11.50mm)
3.1W @ 75°C
8.40°C/W @ 200 LFM
23.91°C/W
Aluminum Alloy
Black Anodized
HSS-B20-NP-06
HSS-B20-NP-06
HEATSINK TO-220 2.9W ALUMINUM
CUI Devices
1,487
In Stock
1 : ¥2.96000
Bag
Bag
Active
Board Level
TO-220
Bolt On
Square, Fins
0.748" (19.00mm)
0.748" (19.00mm)
-
0.375" (9.52mm)
2.9W @ 75°C
7.51°C/W @ 200 LFM
26.32°C/W
Aluminum
Black Anodized
HSS-B20-NPR-02
HSS-B20-NPR-02
HEATSINK TO-220 5.1W ALUMINUM
CUI Devices
3,028
In Stock
1 : ¥3.78000
Bag
Bag
Active
Board Level, Vertical
TO-220
Bolt On and Board Mounts
Rectangular, Fins
0.500" (12.70mm)
1.000" (25.40mm)
-
1.180" (29.97mm)
5.1W @ 75°C
4.20°C/W @ 200 LFM
14.71°C/W
Aluminum
Black Anodized
HSE-B2111-038
HSE-B2111-038
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
14,350
In Stock
1 : ¥4.68000
Box
Box
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.984" (25.00mm)
0.625" (16.00mm)
-
0.354" (9.00mm)
3.8W @ 75°C
6.12°C/W @ 200 LFM
19.74°C/W
Aluminum Alloy
Black Anodized
HSS-B20-NP-04
HSS-B20-NP-04
HEATSINK TO-220 6.5W ALUMINUM
CUI Devices
5,583
In Stock
1 : ¥5.25000
Box
Box
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
1.450" (36.83mm)
1.750" (44.45mm)
-
0.370" (9.40mm)
6.5W @ 75°C
3.76°C/W @ 200 LFM
11.54°C/W
Aluminum
Black Anodized
HSB02-101007
HSB02-101007
HEAT SINK, BGA, 10 X 10 X 7 MM
CUI Devices
5,762
In Stock
1 : ¥5.50000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
2.0W @ 75°C
16.50°C/W @ 200 LFM
37.90°C/W
Aluminum Alloy
Black Anodized
HSS-B20-NP-12
HSS-B20-NP-12
HEATSINK TO-220 6.8W ALUMINUM
CUI Devices
1,928
In Stock
1 : ¥5.58000
Bag
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
1.450" (36.83mm)
0.700" (17.80mm)
-
0.850" (21.60mm)
6.8W @ 75°C
3.47°C/W @ 200 LFM
14.33°C/W
Aluminum
Black Anodized
HSB01-080808
HSB01-080808
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
CUI Devices
4,752
In Stock
1 : ¥5.99000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
1.9W @ 75°C
16.00°C/W @ 200 LFM
39.10°C/W
Aluminum Alloy
Black Anodized
HSS23-B20-NP
HSS23-B20-NP
HEAT SINK, STAMPING, TO-218/TO-2
CUI Devices
2,518
In Stock
1 : ¥6.40000
Box
Box
Active
Top Mount
TO-218, TO-220
Bolt On
Rectangular, Fins
1.654" (42.00mm)
1.496" (38.00mm)
-
0.787" (20.00mm)
7.36W @ 75°C
5.00°C/W @ 200 LFM
10.19°C/W
Aluminum Alloy
Black Anodized
HSB04-171706
HSB04-171706
HEAT SINK, BGA, 17 X 17 X 6 MM
CUI Devices
1,843
In Stock
1 : ¥6.65000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.236" (6.00mm)
2.5W @ 75°C
13.10°C/W @ 200 LFM
29.73°C/W
Aluminum Alloy
Black Anodized
HSB07-202009
HSB07-202009
HEAT SINK, BGA, 20 X 20 X 9 MM
CUI Devices
1,793
In Stock
1 : ¥6.90000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.787" (20.00mm)
0.787" (20.00mm)
-
0.354" (9.00mm)
3.1W @ 75°C
8.60°C/W @ 200 LFM
24.08°C/W
Aluminum Alloy
Black Anodized
HSS-B20-061H
HSS-B20-061H
HEATSINK TO-220 4W ALUMINUM
CUI Devices
1,986
In Stock
1 : ¥6.98000
Box
Box
Active
Board Level
TO-220
PC Pin
Rectangular, Fins
1.500" (38.10mm)
0.504" (12.80mm)
-
0.500" (12.70mm)
4.0W @ 75°C
5.01°C/W @ 200 LFM
18.63°C/W
Aluminum
Black Anodized
HSE04-251265-1
HSE04-251265-2
HEAT SINK, EXTRUSION, TO-218/TO-
CUI Devices
1,567
In Stock
1 : ¥7.14000
Bag
Bag
Active
Top Mount
TO-218, TO-220
Bolt On
Rectangular, Fins
0.984" (25.00mm)
0.472" (12.00mm)
-
0.256" (6.50mm)
2.47W @ 75°C
16.60°C/W @ 200 LFM
30.38°C/W
Aluminum Alloy
Black Anodized
HSB12-272706
HSB12-272706
HEAT SINK, BGA, 27 X 27 X 6 MM
CUI Devices
1,265
In Stock
1 : ¥7.31000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.063" (27.00mm)
1.063" (27.00mm)
-
0.236" (6.00mm)
3.8W @ 75°C
7.80°C/W @ 200 LFM
19.59°C/W
Aluminum Alloy
Black Anodized
HSB09-212115
HSB09-212115
HEAT SINK, BGA, 21 X 21 X 15 MM
CUI Devices
1,946
In Stock
1 : ¥7.63000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.827" (21.00mm)
0.827" (21.00mm)
-
0.591" (15.00mm)
4.3W @ 75°C
6.00°C/W @ 200 LFM
17.39°C/W
Aluminum Alloy
Black Anodized
HSE-BX-02
HSE-B20254-035H
HEAT SINK, EXTRUSION, TO-220,25.
CUI Devices
1,443
In Stock
1 : ¥7.80000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Angled Fins
1.000" (25.40mm)
1.375" (34.93mm)
-
0.500" (12.70mm)
5.8W @ 75°C
3.28°C/W @ 200 LFM
12.93°C/W
Aluminum Alloy
Black Anodized
HSE-B254-04H
HSE-B254-04H
HEAT SINK, EXTRUSION, TO-220/TO-
CUI Devices
1,183
In Stock
1 : ¥8.29000
Box
Box
Active
Board Level, Vertical
TO-218, TO-220
Bolt On and PC Pin
Rectangular, Fins
1.000" (25.40mm)
0.650" (16.50mm)
-
0.630" (16.00mm)
4.7W @ 75°C
4.93°C/W @ 200 LFM
15.96°C/W
Aluminum Alloy
Black Anodized
HSB06-181810
HSB06-181810
HEAT SINK, BGA, 18 X 18 X 10 MM
CUI Devices
1,875
In Stock
1 : ¥8.37000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.709" (18.00mm)
0.709" (18.00mm)
-
0.394" (10.00mm)
3.2W @ 75°C
18.80°C/W @ 200 LFM
23.68°C/W
Aluminum Alloy
Black Anodized
HSB18-232310
HSB18-232310
HEAT SINK, BGA, 23 X 23 X 10 MM
CUI Devices
4,619
In Stock
1 : ¥8.54000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.906" (23.00mm)
0.906" (23.00mm)
-
0.394" (10.00mm)
3.7W @ 75°C
6.80°C/W @ 200 LFM
20.41°C/W
Aluminum Alloy
Black Anodized
HSE-BX-035H-0x
HSE-B20254-035H-01
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
611
In Stock
1 : ¥8.62000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Angled Fins
1.000" (25.40mm)
1.378" (35.00mm)
-
0.500" (12.70mm)
5.2W @ 75°C
4.42°C/W @ 200 LFM
14.42°C/W
Aluminum Alloy
Black Anodized
HSE-BX-040H
HSE-B20254-040H
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
3,579
In Stock
1 : ¥9.19000
Bag
Bag
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.000" (25.40mm)
1.260" (32.00mm)
-
0.551" (14.00mm)
5.7W @ 75°C
7.74°C/W @ 200 LFM
13.16°C/W
Aluminum Alloy
Black Anodized
HSB26-343408
HSB26-343408
HEAT SINK, BGA, 33.5 X 33.5 X 8
CUI Devices
780
In Stock
1 : ¥9.36000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.319" (33.50mm)
1.319" (33.50mm)
-
0.315" (8.00mm)
4.94W @ 75°C
5.30°C/W @ 200 LFM
15.19°C/W
Aluminum Alloy
Black Anodized
HSE-BX-04H-01
HSE-B250-04H
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
2,219
In Stock
1 : ¥9.60000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.984" (25.00mm)
1.378" (35.00mm)
-
1.000" (25.40mm)
8.0W @ 75°C
3.26°C/W @ 200 LFM
13.60°C/W
Aluminum Alloy
Black Anodized
HSE-B20X
HSE-B20500-040H
HEAT SINK, EXTRUSION, TO-220, 50
CUI Devices
1,400
In Stock
1 : ¥9.93000
Tray
Tray
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Angled Fins
1.969" (50.00mm)
1.378" (35.00mm)
-
0.492" (12.50mm)
8.9W @ 75°C
4.85°C/W @ 200 LFM
8.43°C/W
Aluminum Alloy
Black Anodized
HSB11-252518
HSB11-252518
HEAT SINK, BGA, 25 X 25 X 18 MM
CUI Devices
2,914
In Stock
1 : ¥10.51000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.984" (25.00mm)
0.984" (25.00mm)
-
0.709" (18.00mm)
5.5W @ 75°C
4.50°C/W @ 200 LFM
13.70°C/W
Aluminum Alloy
Black Anodized
Showing
of 188

CUI Devices Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.