Aluminum Alloy Heat Sinks

Results: 722
Manufacturer
Assmann WSW ComponentsBoyd Laconia, LLCCTS Thermal Management ProductsCUI DevicesMalico Inc.OhmiteSeeed Technology Co., LtdTE Connectivity AMP ConnectorsWakefield-Vette
Series
-132133301302303621623AERAPRB60BG
Packaging
BagBoxBulkTray
Product Status
ActiveObsolete
Type
Board LevelBoard Level, VerticalBoard Level, Vertical, ExtrusionTop MountTop Mount, Extrusion
Package Cooled
-Aluminum Housed ResistorAssorted (BGA, LGA, CPU, ASIC...)BGABGA, CPU, GPUNvidia Jetson NanoRaspberry PiSOT-32, TO-220SOT-32, TO-220, TOP-3Stud Mounted Semiconductor CasesTO-101TO-126, TO-220
Attachment Method
2 Clips and PC Pin3 Clips and PC Pin-Adhesive (Not Included)AdhesiveBolt On and PC PinBolt On and Thermal Tape, Adhesive (Included)Bolt OnClip and PC PinClipClip, Solder FootClip, Thermal Tape, Adhesive (Not included)PC PinPress Fit
Shape
RectangularRectangular, Angled FinsRectangular, FinsRectangular, Pin FinsSquareSquare, Angled FinsSquare, FinsSquare, Pin Fins
Length
0.276" (7.00mm)0.335" (8.50mm)0.394" (10.00mm)0.472" (12.00mm)0.551" (14.00mm)0.591" (15.00mm)0.591" (15.01mm)0.669" (17.00mm)0.700" (17.78mm)0.709" (18.00mm)0.732" (18.60mm)0.740" (18.80mm)
Width
0.276" (7.00mm)0.335" (8.50mm)0.394" (10.00mm)0.472" (12.00mm)0.492" (12.50mm)0.500" (12.70mm)0.504" (12.80mm)0.512" (13.00mm)0.520" (13.21mm)0.551" (14.00mm)0.591" (15.00mm)0.625" (16.00mm)
Fin Height
0.079" (2.00mm)0.130" (3.30mm)0.157" (4.00mm)0.169" (4.30mm)0.177" (4.50mm)0.197" (5.00mm)0.211" (5.35mm)0.216" (5.50mm)0.236" (6.00mm)0.250" (6.35mm)0.256" (6.50mm)0.275" (7.00mm)
Power Dissipation @ Temperature Rise
1.9W @ 75°C1.93W @ 75°C1.94W @ 75°C1.95W @ 75°C2.0W @ 24°C2.0W @ 26°C2.0W @ 75°C2.1W @ 75°C2.4W @ 75°C2.47W @ 75°C2.5W @ 75°C2.7W @ 75°C
Thermal Resistance @ Forced Air Flow
0.08°C/W @ 500 LFM0.09°C/W @ 500 LFM0.10°C/W @ 500 LFM0.11°C/W @ 500 LFM0.12°C/W @ 500 LFM0.13°C/W @ 500 LFM0.17°C/W @ 500 LFM0.50°C/W @ 500 LFM1.00°C/W @ 400 LFM1.20°C/W @ 200 LFM1.26°C/W @ 200 LFM1.29°C/W @ 200 LFM
Thermal Resistance @ Natural
0.24°C/W0.26°C/W0.28°C/W0.37°C/W0.38°C/W0.44°C/W0.51°C/W0.55°C/W0.59°C/W0.61°C/W0.63°C/W0.67°C/W
Material Finish
-Black AnodizedBlue AnodizedClean FinishedDegreasedGold AnodizedHard AnodizedNatural AnodizedTinUnfinished
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
HSB05-171711
HSB05-171711
HEAT SINK, BGA, 17 X 17 X 11.5 M
CUI Devices
1,856
In Stock
1 : ¥8.87000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.453" (11.50mm)
3.1W @ 75°C
8.40°C/W @ 200 LFM
23.91°C/W
Aluminum Alloy
Black Anodized
114992686
114992686
ALUMINUM HEATSINK FOR JETSON NAN
Seeed Technology Co., Ltd
155
In Stock
1 : ¥87.18000
Bulk
-
Bulk
Active
Top Mount
Nvidia Jetson Nano
Bolt On
Rectangular, Fins
2.323" (59.00mm)
1.535" (39.00mm)
-
0.681" (17.30mm)
-
-
-
Aluminum Alloy
-
31,672
In Stock
4,800
Factory
1 : ¥3.20000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
-
-
32.00°C/W
Aluminum Alloy
Black Anodized
HSE-B2111-038
HSE-B2111-038
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
14,414
In Stock
1 : ¥4.68000
Box
Box
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.984" (25.00mm)
0.625" (16.00mm)
-
0.354" (9.00mm)
3.8W @ 75°C
6.12°C/W @ 200 LFM
19.74°C/W
Aluminum Alloy
Black Anodized
4,742
In Stock
1 : ¥4.76000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
1.098" (27.90mm)
1.098" (27.90mm)
-
0.441" (11.20mm)
-
-
19.00°C/W
Aluminum Alloy
Black Anodized
5,253
In Stock
1 : ¥4.84000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.827" (21.00mm)
0.827" (21.00mm)
-
0.236" (6.00mm)
-
-
24.00°C/W
Aluminum Alloy
Black Anodized
2,496
In Stock
1 : ¥5.34000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.551" (14.00mm)
0.551" (14.00mm)
-
0.394" (10.00mm)
-
-
27.00°C/W
Aluminum Alloy
Black Anodized
HSB02-101007
HSB02-101007
HEAT SINK, BGA, 10 X 10 X 7 MM
CUI Devices
6,009
In Stock
1 : ¥5.50000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.394" (10.00mm)
0.394" (10.00mm)
-
0.275" (7.00mm)
2.0W @ 75°C
16.50°C/W @ 200 LFM
37.90°C/W
Aluminum Alloy
Black Anodized
HSB01-080808
HSB01-080808
HEAT SINK, BGA, 8.5 X 8.5 X 8 MM
CUI Devices
4,789
In Stock
1 : ¥5.99000
Box
Box
Active
Top Mount
BGA
Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
1.9W @ 75°C
16.00°C/W @ 200 LFM
39.10°C/W
Aluminum Alloy
Black Anodized
HSS23-B20-NP
HSS23-B20-NP
HEAT SINK, STAMPING, TO-218/TO-2
CUI Devices
2,518
In Stock
1 : ¥6.40000
Box
Box
Active
Top Mount
TO-218, TO-220
Bolt On
Rectangular, Fins
1.654" (42.00mm)
1.496" (38.00mm)
-
0.787" (20.00mm)
7.36W @ 75°C
5.00°C/W @ 200 LFM
10.19°C/W
Aluminum Alloy
Black Anodized
HSB04-171706
HSB04-171706
HEAT SINK, BGA, 17 X 17 X 6 MM
CUI Devices
1,883
In Stock
1 : ¥6.65000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.236" (6.00mm)
2.5W @ 75°C
13.10°C/W @ 200 LFM
29.73°C/W
Aluminum Alloy
Black Anodized
HSB07-202009
HSB07-202009
HEAT SINK, BGA, 20 X 20 X 9 MM
CUI Devices
1,821
In Stock
1 : ¥6.90000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.787" (20.00mm)
0.787" (20.00mm)
-
0.354" (9.00mm)
3.1W @ 75°C
8.60°C/W @ 200 LFM
24.08°C/W
Aluminum Alloy
Black Anodized
V2286B
V2286B
CPU HEATSINK, CROSS CUT, AL6063,
Assmann WSW Components
1,980
In Stock
3,672
Factory
1 : ¥7.31000
Bulk
-
Bulk
Active
Top Mount
-
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.551" (14.00mm)
0.551" (14.00mm)
-
0.236" (6.00mm)
-
-
32.00°C/W
Aluminum Alloy
Black Anodized
HSB12-272706
HSB12-272706
HEAT SINK, BGA, 27 X 27 X 6 MM
CUI Devices
1,267
In Stock
1 : ¥7.31000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.063" (27.00mm)
1.063" (27.00mm)
-
0.236" (6.00mm)
3.8W @ 75°C
7.80°C/W @ 200 LFM
19.59°C/W
Aluminum Alloy
Black Anodized
HSB09-212115
HSB09-212115
HEAT SINK, BGA, 21 X 21 X 15 MM
CUI Devices
2,096
In Stock
1 : ¥7.63000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.827" (21.00mm)
0.827" (21.00mm)
-
0.591" (15.00mm)
4.3W @ 75°C
6.00°C/W @ 200 LFM
17.39°C/W
Aluminum Alloy
Black Anodized
HSE-BX-02
HSE-B20254-035H
HEAT SINK, EXTRUSION, TO-220,25.
CUI Devices
1,458
In Stock
1 : ¥7.80000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Angled Fins
1.000" (25.40mm)
1.375" (34.93mm)
-
0.500" (12.70mm)
5.8W @ 75°C
3.28°C/W @ 200 LFM
12.93°C/W
Aluminum Alloy
Black Anodized
HSE-B254-04H
HSE-B254-04H
HEAT SINK, EXTRUSION, TO-220/TO-
CUI Devices
1,183
In Stock
1 : ¥8.29000
Box
Box
Active
Board Level, Vertical
TO-218, TO-220
Bolt On and PC Pin
Rectangular, Fins
1.000" (25.40mm)
0.650" (16.50mm)
-
0.630" (16.00mm)
4.7W @ 75°C
4.93°C/W @ 200 LFM
15.96°C/W
Aluminum Alloy
Black Anodized
HSB06-181810
HSB06-181810
HEAT SINK, BGA, 18 X 18 X 10 MM
CUI Devices
1,913
In Stock
1 : ¥8.37000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.709" (18.00mm)
0.709" (18.00mm)
-
0.394" (10.00mm)
3.2W @ 75°C
18.80°C/W @ 200 LFM
23.68°C/W
Aluminum Alloy
Black Anodized
HSB18-232310
HSB18-232310
HEAT SINK, BGA, 23 X 23 X 10 MM
CUI Devices
4,619
In Stock
1 : ¥8.54000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.906" (23.00mm)
0.906" (23.00mm)
-
0.394" (10.00mm)
3.7W @ 75°C
6.80°C/W @ 200 LFM
20.41°C/W
Aluminum Alloy
Black Anodized
V2269E1
V2269E1
CPU HEATSINK, CROSS CUT, AL6063,
Assmann WSW Components
894
In Stock
1,404
Factory
1 : ¥8.54000
Bulk
-
Bulk
Active
Top Mount
-
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.787" (20.00mm)
0.787" (20.00mm)
-
0.354" (9.00mm)
-
-
27.00°C/W
Aluminum Alloy
Black Anodized
HSE-BX-035H-0x
HSE-B20254-035H-01
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
611
In Stock
1 : ¥8.62000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Angled Fins
1.000" (25.40mm)
1.378" (35.00mm)
-
0.500" (12.70mm)
5.2W @ 75°C
4.42°C/W @ 200 LFM
14.42°C/W
Aluminum Alloy
Black Anodized
HSE-BX-040H
HSE-B20254-040H
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
3,579
In Stock
1 : ¥9.19000
Bag
Bag
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.000" (25.40mm)
1.260" (32.00mm)
-
0.551" (14.00mm)
5.7W @ 75°C
7.74°C/W @ 200 LFM
13.16°C/W
Aluminum Alloy
Black Anodized
HSB26-343408
HSB26-343408
HEAT SINK, BGA, 33.5 X 33.5 X 8
CUI Devices
781
In Stock
1 : ¥9.36000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
1.319" (33.50mm)
1.319" (33.50mm)
-
0.315" (8.00mm)
4.94W @ 75°C
5.30°C/W @ 200 LFM
15.19°C/W
Aluminum Alloy
Black Anodized
HSE-BX-04H-01
HSE-B250-04H
HEAT SINK, EXTRUSION, TO-220, 25
CUI Devices
2,221
In Stock
1 : ¥9.60000
Box
Box
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
0.984" (25.00mm)
1.378" (35.00mm)
-
1.000" (25.40mm)
8.0W @ 75°C
3.26°C/W @ 200 LFM
13.60°C/W
Aluminum Alloy
Black Anodized
HSE-B20X
HSE-B20500-040H
HEAT SINK, EXTRUSION, TO-220, 50
CUI Devices
1,400
In Stock
1 : ¥9.93000
Tray
Tray
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Angled Fins
1.969" (50.00mm)
1.378" (35.00mm)
-
0.492" (12.50mm)
8.9W @ 75°C
4.85°C/W @ 200 LFM
8.43°C/W
Aluminum Alloy
Black Anodized
Showing
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Aluminum Alloy Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.