Heat Sinks

Results: 16
Manufacturer
Advanced Thermal Solutions Inc.Assmann WSW ComponentsBoyd Laconia, LLCOhmiteWakefield-Vette
Series
-CC40CRMax Clip System™OmniKlip™pushPIN™R
Packaging
BoxBulk
Type
Board Level, VerticalTop Mount
Package Cooled
14-DIP and 16-DIPAssorted (BGA, LGA, CPU, ASIC...)TO-101TO-126, TO-220, TO-247TO-201TO-218, TO-220, TO-247TO-220TO-220, TO-247, TO-264TO-247TO-247, TO-264, SOT-227TO-401
Attachment Method
2 Clips and PC Pin3 Clips and PC PinBolt On and PC PinClip and Board MountsClip and PC PinClip, Solder FootPress FitPush Pin
Shape
Rectangular, FinsSquare, Fins
Length
0.250" (6.35mm)0.984" (25.00mm)1.000" (25.40mm)1.500" (38.10mm)1.650" (41.91mm)1.654" (42.00mm)1.969" (50.00mm)2.283" (58.00mm)2.953" (75.00mm)
Width
0.640" (16.26mm)0.748" (19.00mm)0.985" (25.00mm)1.063" (27.00mm)1.181" (30.00mm)1.500" (38.10mm)1.650" (41.91mm)1.724" (43.79mm)1.969" (50.00mm)2.953" (75.00mm)
Fin Height
0.190" (4.83mm)0.640" (16.26mm)0.710" (18.03mm)0.984" (25.00mm)1.000" (25.40mm)1.260" (32.00mm)1.500" (38.10mm)1.969" (50.00mm)1.988" (50.50mm)-
Power Dissipation @ Temperature Rise
2.5W @ 30°C2.5W @ 50°C4.0W @ 30°C5.0W @ 60°C14.0W @ 70°C-
Thermal Resistance @ Forced Air Flow
1.00°C/W @ 400 LFM2.00°C/W @ 400 LFM3.18°C/W @ 100 LFM4.00°C/W @ 500 LFM5.00°C/W @ 200 LFM6.00°C/W @ 350 LFM-
Thermal Resistance @ Natural
2.60°C/W3.00°C/W3.30°C/W3.90°C/W4.20°C/W4.40°C/W7.60°C/W17.40°C/W48.00°C/W-
Material
AluminumAluminum Alloy
Material Finish
Black AnodizedBlue AnodizedDegreased
Stocking Options
Environmental Options
Media
Marketplace Product
16Results

Showing
of 16
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
581002B02500(G)
581002B02500G
HEATSINK TO-220 PWR BLK W/PINS
Boyd Laconia, LLC
7,566
In Stock
1 : ¥14.78000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.000" (25.40mm)
0.640" (16.26mm)
-
0.640" (16.26mm)
2.5W @ 50°C
4.00°C/W @ 500 LFM
17.40°C/W
Aluminum
Black Anodized
RA-T2X-38E
RA-T2X-38E
HEATSINK TO-220,TO-218,TO-247
Ohmite
2,862
In Stock
1 : ¥23.81000
Box
Box
Active
Board Level, Vertical
TO-218, TO-220, TO-247
Bolt On and PC Pin
Rectangular, Fins
1.654" (42.00mm)
0.985" (25.00mm)
-
1.500" (38.10mm)
14.0W @ 70°C
1.00°C/W @ 400 LFM
3.90°C/W
Aluminum
Black Anodized
C40-058-VE
C40-058-VE
HEATSINK FOR TO-247 TO-264
Ohmite
486
In Stock
1 : ¥34.81000
Box
Box
Active
Board Level, Vertical
TO-247, TO-264, SOT-227
Clip and Board Mounts
Rectangular, Fins
2.283" (58.00mm)
1.724" (43.79mm)
-
1.260" (32.00mm)
-
-
-
Aluminum
Degreased
OMNI-UNI-27-50
OMNI-UNI-27-50
HEATSINK TO-247 TO-264 TO-220
Wakefield-Vette
1,375
In Stock
1 : ¥36.04000
Bulk
Bulk
Active
Board Level, Vertical
TO-220, TO-247, TO-264
Clip, Solder Foot
Rectangular, Fins
1.969" (50.00mm)
1.063" (27.00mm)
-
1.969" (50.00mm)
-
-
-
Aluminum
Black Anodized
C247-050-2AE
C247-050-2AE
HEATSINK FOR TO-247 WITH 2 CLIPS
Ohmite
633
In Stock
1 : ¥52.95000
Box
Box
Active
Board Level, Vertical
TO-247
2 Clips and PC Pin
Rectangular, Fins
1.969" (50.00mm)
1.500" (38.10mm)
-
0.710" (18.03mm)
2.5W @ 30°C
5.00°C/W @ 200 LFM
-
Aluminum
Black Anodized
6,970
In Stock
1 : ¥2.96000
Bulk
-
Bulk
Active
Top Mount
14-DIP and 16-DIP
Press Fit
Rectangular, Fins
0.250" (6.35mm)
0.748" (19.00mm)
-
0.190" (4.83mm)
-
-
48.00°C/W
Aluminum
Black Anodized
477
In Stock
1 : ¥34.48000
Bulk
Bulk
Active
Board Level, Vertical
TO-126, TO-220, TO-247
Clip and PC Pin
Rectangular, Fins
1.650" (41.91mm)
1.181" (30.00mm)
-
1.988" (50.50mm)
-
-
-
Aluminum
Black Anodized
2,826
In Stock
1 : ¥38.42000
Bulk
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Push Pin
Square, Fins
1.969" (50.00mm)
1.969" (50.00mm)
-
0.984" (25.00mm)
-
3.18°C/W @ 100 LFM
-
Aluminum
Blue Anodized
CR101-75AE
CR101-75AE
ALUMINUM HEATSINK 75MM BLK ANODI
Ohmite
895
In Stock
1 : ¥39.24000
Box
Box
Active
Board Level, Vertical
TO-101
3 Clips and PC Pin
Rectangular, Fins
2.953" (75.00mm)
1.969" (50.00mm)
-
-
-
-
4.20°C/W
Aluminum Alloy
Black Anodized
CR401-75AE
CR401-75AE
ALUMINUM HEATSINK 75MM BLK ANODI
Ohmite
173
In Stock
1 : ¥41.54000
Box
Box
Active
Board Level, Vertical
TO-401
2 Clips and PC Pin
Rectangular, Fins
2.953" (75.00mm)
2.953" (75.00mm)
-
-
-
-
3.00°C/W
Aluminum Alloy
Black Anodized
CR201-75AE
CR201-75AE
ALUMINUM HEATSINK 75MM BLK ANODI
Ohmite
102
In Stock
1 : ¥63.30000
Box
Box
Active
Board Level, Vertical
TO-201
3 Clips and PC Pin
Rectangular, Fins
2.953" (75.00mm)
2.953" (75.00mm)
-
-
-
-
2.60°C/W
Aluminum Alloy
Black Anodized
CR101-25AE
CR101-25AE
ALUMINUM HEATSINK 25MM BLK ANODI
Ohmite
212
In Stock
1 : ¥23.64000
Box
Box
Active
Board Level, Vertical
TO-101
3 Clips and PC Pin
Rectangular, Fins
0.984" (25.00mm)
1.969" (50.00mm)
-
-
-
-
7.60°C/W
Aluminum Alloy
Black Anodized
CR101-75VE
CR201-50VE
ALUMINUM HEATSINK 50MM DEGREASED
Ohmite
37
In Stock
1 : ¥41.79000
Box
Box
Active
Board Level, Vertical
TO-201
3 Clips and PC Pin
Rectangular, Fins
1.969" (50.00mm)
2.953" (75.00mm)
-
-
-
-
3.30°C/W
Aluminum Alloy
Degreased
CR201-50AE
CR201-50AE
ALUMINUM HEATSINK 50MM BLK ANODI
Ohmite
34
In Stock
1 : ¥46.22000
Box
Box
Active
Board Level, Vertical
TO-201
3 Clips and PC Pin
Rectangular, Fins
1.969" (50.00mm)
2.953" (75.00mm)
-
-
-
-
3.30°C/W
Aluminum Alloy
Black Anodized
C247-025-1AE
C247-025-1AE
HEATSINK FOR TO-247 WITH 1 CLIP
Ohmite
2
In Stock
1 : ¥38.42000
Box
Box
Active
Board Level, Vertical
TO-247
Clip and PC Pin
Rectangular, Fins
0.984" (25.00mm)
1.500" (38.10mm)
-
0.710" (18.03mm)
5.0W @ 60°C
6.00°C/W @ 350 LFM
-
Aluminum
Black Anodized
6398BG
6398BG
HEATSINK TO-220 PIN BLACK
Boyd Laconia, LLC
0
In Stock
1 : ¥74.55000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.500" (38.10mm)
1.650" (41.91mm)
-
1.000" (25.40mm)
4.0W @ 30°C
2.00°C/W @ 400 LFM
4.40°C/W
Aluminum
Black Anodized
Showing
of 16

Heat Sinks


Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.