Heat Sinks

Results: 17
Manufacturer
Assmann WSW ComponentsBoyd Laconia, LLCOhmiteSeeed Technology Co., LtdWakefield-Vette
Series
-2172195731DPenguin
Packaging
BulkCut Tape (CT)Digi-Reel®Tape & Reel (TR)
Type
Board LevelTop MountTop Mount Kit
Package Cooled
Assorted (BGA, LGA, CPU, ASIC...)D²Pak (TO-263), SOL-20, SOT-223, TO-220Raspberry Pi 4BTO-252 (DPak)TO-263 (D²Pak)TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10
Attachment Method
AdhesiveSMD PadSolderable FeetThermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)
Shape
-Rectangular, FinsSquare, FinsSquare, Pin Fins
Length
0.315" (8.00mm)0.320" (8.13mm)0.335" (8.50mm)0.500" (12.70mm)0.591" (15.00mm)0.650" (16.51mm)0.740" (18.80mm)0.763" (19.38mm)-
Width
0.335" (8.50mm)0.600" (15.24mm)0.653" (16.59mm)0.790" (20.07mm)0.900" (22.86mm)1.000" (25.40mm)1.020" (25.91mm)1.030" (26.16mm)1.386" (35.25mm)-
Fin Height
0.315" (8.00mm)0.350" (8.89mm)0.360" (9.14mm)0.375" (9.52mm)0.390" (9.91mm)0.400" (10.16mm)0.450" (11.43mm)0.460" (11.68mm)0.480" (12.19mm)-
Power Dissipation @ Temperature Rise
0.8W @ 30°C1.0W @ 55°C1.3W @ 30°C2.0W @ 30°C2.0W @ 40°C-
Thermal Resistance @ Forced Air Flow
3.00°C/W @ 300 LFM5.00°C/W @ 400 LFM8.00°C/W @ 300 LFM8.00°C/W @ 500 LFM10.00°C/W @ 200 LFM12.50°C/W @ 600 LFM16.00°C/W @ 200 LFM-
Thermal Resistance @ Natural
11.00°C/W15.00°C/W18.00°C/W25.00°C/W26.00°C/W32.00°C/W55.00°C/W-
Material
AluminumAluminum AlloyCopper
Material Finish
-Black AnodizedDegreasedTin
Stocking Options
Environmental Options
Media
Marketplace Product
17Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
V-1100-SMD/B-L
V-1100-SMD/B-L
HEAT SINK COPPER DPAK TO-252
Assmann WSW Components
4,953
In Stock
1 : ¥3.86000
Bulk
-
Bulk
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.320" (8.13mm)
0.790" (20.07mm)
-
0.390" (9.91mm)
-
-
25.00°C/W
Copper
Tin
110991327
110991327
HEAT SINK KIT FOR RASPBERRY PI 4
Seeed Technology Co., Ltd
28,837
In Stock
1 : ¥8.13000
Bulk
-
Bulk
Active
Top Mount Kit
Raspberry Pi 4B
Adhesive
-
-
-
-
-
-
-
-
Aluminum
-
DV-T263-201E-TR
DV-T263-201E-TR
HEATSINK FOR TO-263
Ohmite
23,446
In Stock
1 : ¥9.19000
Cut Tape (CT)
200 : ¥8.10675
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.500" (12.70mm)
1.020" (25.91mm)
-
0.480" (12.19mm)
2.0W @ 30°C
8.00°C/W @ 500 LFM
-
Aluminum
Degreased
573100D00010G
573100D00010G
HEATSINK SMT D-PAK/TO-252 TIN
Boyd Laconia, LLC
15,050
In Stock
1 : ¥10.43000
Cut Tape (CT)
250 : ¥8.32164
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.315" (8.00mm)
0.900" (22.86mm)
-
0.400" (10.16mm)
0.8W @ 30°C
12.50°C/W @ 600 LFM
26.00°C/W
Aluminum
Tin
LTN20069-T5
LTN20069
HEAT SINK BGA/PGA 16.5X16.5X8.9
Wakefield-Vette
3,002
In Stock
1 : ¥12.23000
Bulk
Bulk
Active
Board Level
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Fins
0.650" (16.51mm)
0.653" (16.59mm)
-
0.350" (8.89mm)
-
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
7109D/TRG
7109D/TRG
HEATSINK TO-263 (D2PK)
Boyd Laconia, LLC
17,989
In Stock
1 : ¥16.09000
Cut Tape (CT)
125 : ¥13.57760
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.763" (19.38mm)
1.000" (25.40mm)
-
0.450" (11.43mm)
2.0W @ 30°C
3.00°C/W @ 300 LFM
11.00°C/W
Copper
Tin
DA-T263-201E-TR
DA-T263-201E-TR
HEATSINK FOR TO-263
Ohmite
134
In Stock
1 : ¥19.46000
Cut Tape (CT)
200 : ¥16.38670
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.500" (12.70mm)
1.020" (25.91mm)
-
0.480" (12.19mm)
2.0W @ 30°C
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
219-263A
219-263A-TR
TO-263 HEAT SINK ANODZD REEL
Wakefield-Vette
2,099
In Stock
1 : ¥23.48000
Cut Tape (CT)
250 : ¥18.53144
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.500" (12.70mm)
1.020" (25.91mm)
-
0.480" (12.19mm)
2.0W @ 30°C
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
31,002
In Stock
4,800
Factory
1 : ¥3.20000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
-
-
32.00°C/W
Aluminum Alloy
Black Anodized
217-36CTE6
217-36CTE6
HEATSINK DPAK SMT TIN PLATED
Wakefield-Vette
10,915
In Stock
1 : ¥4.35000
Bulk
Bulk
Active
Top Mount
D²Pak (TO-263), SOL-20, SOT-223, TO-220
SMD Pad
Rectangular, Fins
0.740" (18.80mm)
0.600" (15.24mm)
-
0.360" (9.14mm)
1.0W @ 55°C
16.00°C/W @ 200 LFM
55.00°C/W
Copper
Tin
573100D00000G
573100D00000G
TOP MOUNT HEATSINK .4" D-PAK
Boyd Laconia, LLC
2,957
In Stock
1 : ¥16.17000
Bulk
Bulk
Active
Top Mount
TO-252 (DPak)
SMD Pad
Rectangular, Fins
0.315" (8.00mm)
0.900" (22.86mm)
-
0.400" (10.16mm)
0.8W @ 30°C
12.50°C/W @ 600 LFM
15.00°C/W
Aluminum
Tin
219-263A
219-263A
TO-263 HEAT SINK ANODZD
Wakefield-Vette
795
In Stock
1 : ¥22.49000
Bulk
Bulk
Active
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.500" (12.70mm)
1.020" (25.91mm)
-
0.480" (12.19mm)
2.0W @ 30°C
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
573300D00000G
573300D00000G
TOP MOUNT HEATSINK .4" D2PAK
Boyd Laconia, LLC
2,897
In Stock
1 : ¥31.44000
Bulk
-
Bulk
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.030" (26.16mm)
-
0.400" (10.16mm)
1.3W @ 30°C
8.00°C/W @ 300 LFM
18.00°C/W
Aluminum
Tin
219-263B
219-263B
TO-263 HEAT SINK ANODZD
Wakefield-Vette
2,247
In Stock
1 : ¥23.48000
Bulk
Bulk
Active
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.500" (12.70mm)
1.386" (35.25mm)
-
0.460" (11.68mm)
2.0W @ 30°C
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
573300D00010(G)
573300D00010G
HEATSINK D2PAK .4" HIGH SMD
Boyd Laconia, LLC
35
In Stock
1 : ¥7.39000
Cut Tape (CT)
250 : ¥28.69264
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
SMD Pad
Rectangular, Fins
0.500" (12.70mm)
1.030" (26.16mm)
-
0.400" (10.16mm)
1.3W @ 30°C
10.00°C/W @ 200 LFM
18.00°C/W
Aluminum
Tin
DA-T263-401E-TR
DA-T263-401E-TR
TO-263 SMD HEAT SINK ANODZD
Ohmite
0
In Stock
Check Lead Time
1 : ¥25.53000
Cut Tape (CT)
200 : ¥21.49125
Tape & Reel (TR)
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Top Mount
TO-263 (D²Pak)
Solderable Feet
Rectangular, Fins
0.500" (12.70mm)
1.030" (26.16mm)
-
0.460" (11.68mm)
-
-
-
Aluminum
Black Anodized
BOARD LEVEL HEATSINK .375" D2PAK
7106D/TRG
BOARD LEVEL HEATSINK .375" D2PAK
Boyd Laconia, LLC
0
In Stock
1,000 : ¥50.74362
Tape & Reel (TR)
-
Tape & Reel (TR)
Active
Top Mount
TO-263 (D²Pak), PowerSO-10 (MO-184), SO-10
SMD Pad
Rectangular, Fins
0.591" (15.00mm)
1.020" (25.91mm)
-
0.375" (9.52mm)
2.0W @ 40°C
5.00°C/W @ 400 LFM
-
Copper
Tin
Showing
of 17

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.