Computer
Key Components for Computer Peripherals
- GPU Graphic Cards
- Wireless Charging
- Printers
GPU Graphic Cards
MOSFETs
N-Channel 30 V (D-S) MOSFET
- TrenchFET® Gen IV synchronous buck high-side MOSFET with maximum RDS(on) = 7.5 mΩ
- Low gate charge for low switching losses in the PowerPAK® SO-8 package
MOSFETs
N-Channel 30 V (D-S) MOSFET
- TrenchFET Gen IV synchronous buck low-side MOSFET with maximum RDS(on) = 2.15 mΩ
- Thermally enhanced PowerPAK SO-8 packaging
Tantalum Capacitors
vPolyTan™ Polymer Tantalum Capacitors
- High-capacitance, low-ESR polymer tantalum capacitors
- Higher voltage handling capability requires less voltage derating
- Stable electrical performance over temperature and voltage
- Small case size, low profile
Inductors
Low-Profile, High-Current IHLP® Inductors
- Very low profile, high-current inductor for DC/DC conversion
- High frequency energy storage up to 5 MHz
ICs
60 A VRPower® Integrated Power Stage Offers Highest Power Density and Efficiency
- 3 % better efficiency with 50 °C cooler operation in a 30 % smaller footprint
- Thermally enhanced PowerPAK® MLP55-31L
- Vishay's Gen IV MOSFET technology and a low-side MOSFET with integrated Schottky diode
Inductors
Low-Profile, High-Current IHLP® Inductors
- High-current power inductor for DC/DC conversion and filtering
- High-frequency energy storage up to 5 MHz
Thermistors
SMD 0603, Glass Protected NTC Thermistors
- Standard series, AEC-Q200 compliant
- Glass protected with soft terminations
Power Rectifiers
High Current Density Surface-Mount Schottky Barrier Rectifiers
- Very low profile – typical height of 1.1 mm
- AEC-Q101 qualified
Wireless Charging
MOSFETs
N-Channel 30 V (D-S) MOSFET
- TrenchFET® Gen III technology, maximum RDS(on) 6 mΩ and low gate charge for efficient switching
- Thermally enhanced PowerPAK® 1212-8 is 1/3 the size of an SO-8
Resistors
Power Metal Strip® Resistors, Low Value (Down to 0.001 Ω), Surface-Mount
- Low TCR element (< 20 ppm) results in accurate current sensing in applications
- Power Metal Strip® construction offers high reliability in critical applications
Inductors
Wireless Charging Receiving Coil / Shield
- Thin, efficient, low saturation Rx coils
- WPC and PMA compatible, custom designs available
Inductors
Wireless Charging Receiving Coil / Shield
- Thin, efficient, low saturation Rx coils
- WPC and PMA compatible, custom designs available
Ceramic Capacitors
Ultra-Stable Dielectric Formulation Low Dissipation Factor (DF)
- Ultra-stable dielectric formulation, low dissipation factor (DF)
- Robust design build with wet process and noble metal electrodes
MOSFETs
Single N-Channel, Asymmetric Dual 30 V Power MOSFETs
- Thermally enhanced PowerPAK® 1212-8 is 1/3 the size of an SO-8 (SiS402DN)
- Asymmetrical PowerPAIR® packaging optimizes on-resistance for the low side (SiZ902DT)
- Maximum on-resistance down to 0.006 Ω
Printers
Ceramic Capacitors
AC Line Rated Disc Capacitors, Class X1, 760 VAC, Class Y1, 500 VAC
- X1 / Y1 safety rating according to IEC 60384-14, 3rd edition
- Highest reliability and lifetime, operating temperature: -40 °C to +125 °C
Thermistors
NTC Thermistors, 2-Point Micro Chip Sensor, Insulated Flexible Leads
- Miniature sensor head (1.6 mm) with AWG32 ETFE insulated leads
- AEC-Q200 qualified, fast response time for exposed mounting
- Exceptional withstanding in thermal shocks
Ceramic Capacitors
IEC 60384-14:2005, CAN/CSA/cCSAus, and ANSI/UL CB Certificates
- Surface-mount design: simpler assembly and reduced board space requirement
- Available in NP0 (C0G) or X7R dielectrics
MOSFETs
N- and P-Channel 40 V (D-S) MOSFET
- TrenchFET® technology combining N and P complementary MOSFETs in one package
- Popular SO-8 dual package layout for half bridge and motor drive applications
Optoelectronics
Reflective Optical Sensor with Transistor Output
- Peak operating distance of 1 mm and typical output current of IC = 0.5 mA
- Operating range within > 20 % relative collector current: 0.2 mm to 4 mm
Resistors
Power Metal Strip® Resistors, Low Value (Down to 0.0005 Ω), Surface-Mount
- Low resistance values from 0.002 Ω to 0.1 Ω and tolerance of 1 %
- High power of 2 W in 2816 size resistor
MOSFETs
P-Channel 60 V (D-S) Power MOSFET
- Rugged planar p-channel technology offering a maximum RDS(on) of 500 mΩ
- SOT-223 surface-mount packaging with a maximum continuous current of 1.8 A
Resistors
Professional Thin Film Chip Resistors
- Best in class surge handling capability, excellent overall stability class 0.5
- CECC approved acc. EN 140401-801, sulfur resistant
Tantalum Capacitors
Solid Tantalum Chip Capacitors 298D MICROTAN®, Leadframeless Molded, 298W Extended Range Microtan
- High capacitance in small case sizes including 0603 and 0402 footprint
- Perfect for space-constrained designs