Computer

Key Components for Computer Peripherals

  • GPU Graphic Cards
  • Wireless Charging
  • Printers

GPU Graphic Cards

MOSFETs

N-Channel 30 V (D-S) MOSFET

  • TrenchFET® Gen IV synchronous buck high-side MOSFET with maximum RDS(on) = 7.5 mΩ
  • Low gate charge for low switching losses in the PowerPAK® SO-8 package

MOSFETs

N-Channel 30 V (D-S) MOSFET

  • TrenchFET Gen IV synchronous buck low-side MOSFET with maximum RDS(on) = 2.15 mΩ
  • Thermally enhanced PowerPAK SO-8 packaging

Tantalum Capacitors

vPolyTan™ Polymer Tantalum Capacitors

  • High-capacitance, low-ESR polymer tantalum capacitors
  • Higher voltage handling capability requires less voltage derating
  • Stable electrical performance over temperature and voltage
  • Small case size, low profile

Inductors

Low-Profile, High-Current IHLP® Inductors

  • Very low profile, high-current inductor for DC/DC conversion
  • High frequency energy storage up to 5 MHz

ICs

60 A VRPower® Integrated Power Stage Offers Highest Power Density and Efficiency

  • 3 % better efficiency with 50 °C cooler operation in a 30 % smaller footprint
  • Thermally enhanced PowerPAK® MLP55-31L
  • Vishay's Gen IV MOSFET technology and a low-side MOSFET with integrated Schottky diode

Inductors

Low-Profile, High-Current IHLP® Inductors

  • High-current power inductor for DC/DC conversion and filtering
  • High-frequency energy storage up to 5 MHz

Thermistors

SMD 0603, Glass Protected NTC Thermistors

  • Standard series, AEC-Q200 compliant
  • Glass protected with soft terminations

Power Rectifiers

High Current Density Surface-Mount Schottky Barrier Rectifiers

  • Very low profile – typical height of 1.1 mm
  • AEC-Q101 qualified

Wireless Charging

MOSFETs

N-Channel 30 V (D-S) MOSFET

  • TrenchFET® Gen III technology, maximum RDS(on) 6 mΩ and low gate charge for efficient switching
  • Thermally enhanced PowerPAK® 1212-8 is 1/3 the size of an SO-8

Resistors

Power Metal Strip® Resistors, Low Value (Down to 0.001 Ω), Surface-Mount

  • Low TCR element (< 20 ppm) results in accurate current sensing in applications
  • Power Metal Strip® construction offers high reliability in critical applications

Inductors

Wireless Charging Receiving Coil / Shield

  • Thin, efficient, low saturation Rx coils
  • WPC and PMA compatible, custom designs available

Inductors

Wireless Charging Receiving Coil / Shield

  • Thin, efficient, low saturation Rx coils
  • WPC and PMA compatible, custom designs available

Ceramic Capacitors

Ultra-Stable Dielectric Formulation Low Dissipation Factor (DF)

  • Ultra-stable dielectric formulation, low dissipation factor (DF)
  • Robust design build with wet process and noble metal electrodes

MOSFETs

Single N-Channel, Asymmetric Dual 30 V Power MOSFETs

  • Thermally enhanced PowerPAK® 1212-8 is 1/3 the size of an SO-8 (SiS402DN)
  • Asymmetrical PowerPAIR® packaging optimizes on-resistance for the low side (SiZ902DT)
  • Maximum on-resistance down to 0.006 Ω

Printers

Ceramic Capacitors

AC Line Rated Disc Capacitors, Class X1, 760 VAC, Class Y1, 500 VAC

  • X1 / Y1 safety rating according to IEC 60384-14, 3rd edition
  • Highest reliability and lifetime, operating temperature: -40 °C to +125 °C

Thermistors

NTC Thermistors, 2-Point Micro Chip Sensor, Insulated Flexible Leads

  • Miniature sensor head (1.6 mm) with AWG32 ETFE insulated leads
  • AEC-Q200 qualified, fast response time for exposed mounting
  • Exceptional withstanding in thermal shocks

Ceramic Capacitors

IEC 60384-14:2005, CAN/CSA/cCSAus, and ANSI/UL CB Certificates

  • Surface-mount design: simpler assembly and reduced board space requirement
  • Available in NP0 (C0G) or X7R dielectrics

MOSFETs

N- and P-Channel 40 V (D-S) MOSFET

  • TrenchFET® technology combining N and P complementary MOSFETs in one package
  • Popular SO-8 dual package layout for half bridge and motor drive applications

Optoelectronics

Reflective Optical Sensor with Transistor Output

  • Peak operating distance of 1 mm and typical output current of IC = 0.5 mA
  • Operating range within > 20 % relative collector current: 0.2 mm to 4 mm

Resistors

Power Metal Strip® Resistors, Low Value (Down to 0.0005 Ω), Surface-Mount

  • Low resistance values from 0.002 Ω to 0.1 Ω and tolerance of 1 %
  • High power of 2 W in 2816 size resistor

MOSFETs

P-Channel 60 V (D-S) Power MOSFET

  • Rugged planar p-channel technology offering a maximum RDS(on) of 500 mΩ
  • SOT-223 surface-mount packaging with a maximum continuous current of 1.8 A

Resistors

Professional Thin Film Chip Resistors

  • Best in class surge handling capability, excellent overall stability class 0.5
  • CECC approved acc. EN 140401-801, sulfur resistant

Tantalum Capacitors

Solid Tantalum Chip Capacitors 298D MICROTAN®, Leadframeless Molded, 298W Extended Range Microtan

  • High capacitance in small case sizes including 0603 and 0402 footprint
  • Perfect for space-constrained designs