IXYS introduces their power semiconductor product line: 300 V ultra-junction X3-class HiPerFET™ power MOSFETs.
Taica Corporation is the manufacturer of Alpha-GEL® silicone anti-vibration and impact-absorbing products, and Lambda-GEL® Thermal Interface Materials (TIMs).
NXP's i.MX 6ULZ is a high-performance, cost-efficient consumer Linux processor featuring a single Arm® Cortex®-A7 core operating at 900 MHz.
Davies Molding has expanded their knob offering with metric sizes of their popular knob styles.
WIMA SMD series is produced with the proven box technology and covers almost the entire application range of conventional through-hole plastic film capacitors.
Parker Chomerics' THERMFLOW T777 phase change material designed to completely fill interfacial air gaps and voids within electronics assemblies.
MEAN WELL's DRP-3200 and DPU-3200 series fully digital intelligent AC-DC power supplies offer models with the DC output highly demanded by the industry.
Parker Chomerics’ CHO-SEAL 1285 elastomer EMI gasket is available in sheet form and extruded into various profiles for design and manufacturing flexibility.
Parker Chomerics' CHO-TOUCH displays are optically bonded touchscreens and LCD units designed to save assembly time and supply chain logistics.
Parker Chomerics CHO-SEAL 6502 EMI shielding gasket comes in sheet form and is extruded into various profiles allowing for design and manufacturing flexibility.
Nordic's nRF9160 SiP offers a wide selection of general interfaces and peripherals for compact, complete, and energy-efficient cellular IoT solutions.
Pulse Electronics' line of SFP and SFP+ connectors and cages are designed for industry-wide compatibility and are tuned for optimal performance up to 10 Gbps.
Seoul Semiconductor's WICOP series is designed for high flux output applications with high current operation capability.
Lattice's Himax HM01B0 feature a convolutional neural network (CNN) using the compact CNN accelerator soft IP used in human presence and hand gesture detection.