Copper Heat Sinks

Results: 150
Manufacturer
Advanced Thermal Solutions Inc.Assmann WSW ComponentsBoyd Laconia, LLCComair RotronCUI DevicesDFRobotMalico Inc.Seeed Technology Co., LtdSparkFun Electronicst-Global TechnologyWakefield-Vette
Series
-208217218261268286dualFLOW™HBAHBHHSBHSSLattePandaMBA
Packaging
BagBoxBulkCut Tape (CT)Digi-Reel®Tape & Reel (TR)Tray
Product Status
ActiveObsolete
Type
Board LevelBoard Level, VerticalHeat Spreader Kit, Top MountHeat SpreaderTop MountTop Mount, SkivedTop Mount, Zipper Fin
Package Cooled
-Assorted (BGA, LGA, CPU, ASIC...)Axial Lead DevicesBGABGA, FPGAD²Pak (TO-263), SOL-20, SOT-223, TO-220Intel LGA2011 & LGA2066 & LGA1366 CPU CoolerIntel LGA2011 & LGA2066 CPU CoolerIntel® Xeon® CPUMultiwatt, SIPRaspberry Pi 3 B+Raspberry PiSMDTO-126
Attachment Method
-AdhesiveBolt On and Board MountsBolt On and PC PinBolt OnClip and Board LocksClip and Board MountsClip and PC PinClipClip, Thermal Tape, Adhesive (Not included)PC PinPush PinPush Pin, Thermal MaterialSMD Pad
Shape
RectangularRectangular, FinsSquareSquare, FinsSquare, Pin Fins
Length
0.315" (8.00mm)0.320" (8.13mm)0.394" (10.00mm)0.500" (12.70mm)0.520" (13.20mm)0.551" (14.00mm)0.591" (15.00mm)0.700" (17.78mm)0.740" (18.80mm)0.750" (19.05mm)0.763" (19.38mm)0.780" (19.81mm)
Width
0.250" (6.35mm)0.375" (9.53mm)0.394" (10.00mm)0.476" (12.10mm)0.480" (12.19mm)0.500" (12.70mm)0.520" (13.21mm)0.551" (14.00mm)0.591" (15.00mm)0.600" (15.24mm)0.750" (19.05mm)0.790" (20.07mm)
Fin Height
0.002" (0.06mm)0.003" (0.07mm)0.008" (0.21mm)0.041" (1.05mm)0.157" (4.00mm)0.189" (4.80mm)0.250" (6.35mm)0.275" (7.00mm)0.276" (7.00mm)0.307" (7.80mm)0.354" (9.00mm)0.360" (9.14mm)
Power Dissipation @ Temperature Rise
0.5W @ 20°C0.6W @ 30°C1.0W @ 20°C1.0W @ 30°C1.0W @ 50°C1.0W @ 55°C1.3W @ 30°C1.5W @ 20°C1.5W @ 40°C1.5W @ 50°C2.0W @ 30°C2.0W @ 40°C
Thermal Resistance @ Forced Air Flow
0.80°C/W @ 300 LFM1.20°C/W @ 200 LFM1.30°C/W @ 200 LFM1.40°C/W @ 200 LFM1.65°C/W @ 200 LFM1.70°C/W @ 200 LFM1.90°C/W @ 200 LFM2.10°C/W @ 200 LFM2.50°C/W @ 200 LFM2.60°C/W @ 200 LFM2.90°C/W @ 200 LFM3.00°C/W @ 300 LFM
Thermal Resistance @ Natural
4.50°C/W5.10°C/W5.60°C/W7.00°C/W7.20°C/W7.70°C/W8.00°C/W8.30°C/W8.90°C/W10.05°C/W11.00°C/W12.50°C/W
Material Finish
-AavSHIELD 3CBlack AnodizedBlack CoatingBlack PaintClean FinishedNickelPolyesterRed AnodizedTinTin, Black Paint
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
V-1100-SMD/B
V-1100-SMD/B
HEAT SINK COPPER DPAK TO-252
Assmann WSW Components
16,204
In Stock
1 : ¥5.34000
Cut Tape (CT)
400 : ¥4.31320
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
ActiveTop MountTO-252 (DPak)SMD PadRectangular, Fins0.320" (8.13mm)0.790" (20.07mm)-0.390" (9.91mm)--25.00°C/WCopperTin
6025DG
6025DG
HEATSINK TO-220 STAGGEREDFIN TIN
Boyd Laconia, LLC
3,087
In Stock
1 : ¥12.89000
Bulk
-
Bulk
ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins1.250" (31.75mm)0.875" (22.23mm)-0.250" (6.35mm)3.0W @ 60°C7.00°C/W @ 400 LFM17.90°C/WCopperTin
7106DG
7106DG
BOARD LEVEL HEATSINK .375" D2PAK
Boyd Laconia, LLC
11,073
In Stock
1 : ¥15.84000
Bulk
-
Bulk
ActiveTop MountTO-263 (D²Pak), PowerSO-10 (MO-184), SO-10SMD PadRectangular, Fins0.591" (15.00mm)1.020" (25.91mm)-0.375" (9.52mm)2.0W @ 40°C5.00°C/W @ 400 LFM-CopperTin
7109D/TRG
7109D/TRG
HEATSINK TO-263 (D2PK)
Boyd Laconia, LLC
18,822
In Stock
1 : ¥16.09000
Cut Tape (CT)
125 : ¥13.57760
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
ActiveTop MountTO-263 (D²Pak)SMD PadRectangular, Fins0.763" (19.38mm)1.000" (25.40mm)-0.450" (11.43mm)2.0W @ 30°C3.00°C/W @ 300 LFM11.00°C/WCopperTin
7109DG
7109DG
TOP MOUNT HEATSINK .45" D2PAK
Boyd Laconia, LLC
5,573
In Stock
1 : ¥27.91000
Bag
-
Bag
ActiveTop MountTO-263 (D²Pak)SMD PadRectangular, Fins0.763" (19.38mm)1.000" (25.40mm)-0.450" (11.43mm)2.0W @ 30°C3.00°C/W @ 300 LFM11.00°C/WCopperTin
6030B-TTG
6030B-TTG
THM,10594B-TT REV BB(COPPER)G
Boyd Laconia, LLC
225
In Stock
1 : ¥36.86000
Bulk
-
Bulk
ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins1.180" (29.97mm)1.000" (25.40mm)-0.500" (12.70mm)---CopperTin, Black Paint
ATS-UC-NF-200
ATS-UC-NF-200
CPU HEAT SINK NO FAN COPPER
Advanced Thermal Solutions Inc.
62
In Stock
1 : ¥1,279.84000
Box
-
Box
ActiveTop Mount, SkivedIntel LGA2011 & LGA2066 CPU CoolerPush PinSquare, Fins3.543" (90.00mm)3.543" (90.00mm)-1.102" (28.00mm)---CopperNickel
ATS-UC-DFLOW-100
ATS-UC-DFLOW-200
DUALFLOW HEATSINK 1U CU FINS
Advanced Thermal Solutions Inc.
98
In Stock
1 : ¥1,298.14000
Box
Box
ActiveTop Mount, Zipper FinIntel LGA2011 & LGA2066 CPU CoolerPush PinSquare, Fins3.637" (92.38mm)3.626" (92.11mm)-1.142" (29.00mm)---CopperNickel
217-36CTE6
217-36CTE6
HEATSINK DPAK SMT TIN PLATED
Wakefield-Vette
11,127
In Stock
1 : ¥4.35000
Bulk
Bulk
ActiveTop MountD²Pak (TO-263), SOL-20, SOT-223, TO-220SMD PadRectangular, Fins0.740" (18.80mm)0.600" (15.24mm)-0.360" (9.14mm)1.0W @ 55°C16.00°C/W @ 200 LFM55.00°C/WCopperTin
ATS-PCB1073
ATS-PCB1073
HEATSINK TO-263 COPPER
Advanced Thermal Solutions Inc.
116,834
In Stock
1 : ¥6.73000
Bulk
-
Bulk
ActiveTop MountTO-263 (D²Pak)-Rectangular, Fins0.500" (12.70mm)1.031" (26.20mm)-0.402" (10.21mm)-9.50°C/W @ 200 LFM18.00°C/WCopperTin
7173DG
7173DG
BOARD LEVEL HEATSINK .375"TO-220
Boyd Laconia, LLC
6,053
In Stock
1 : ¥9.60000
Bulk
-
Bulk
ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins0.750" (19.05mm)0.750" (19.05mm)-0.375" (9.52mm)1.5W @ 50°C10.00°C/W @ 200 LFM25.80°C/WCopperTin
573400D00010(G)
573400D00010G
HEATSINK D-PAK3 TIN PLATED SMD
Boyd Laconia, LLC
2,404
In Stock
1 : ¥9.69000
Cut Tape (CT)
250 : ¥7.72500
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
ActiveTop MountTO-268 (D³Pak)SMD PadRectangular, Fins0.500" (12.70mm)1.220" (30.99mm)-0.401" (10.20mm)1.0W @ 20°C4.00°C/W @ 600 LFM14.00°C/WCopperTin
7139DG
7139DG
HEATSINK TO-220 TIN CLIP-ON 13MM
Boyd Laconia, LLC
5,673
In Stock
1 : ¥11.08000
Bulk
-
Bulk
ActiveBoard LevelTO-220Clip and PC PinRectangular, Fins0.780" (19.81mm)0.520" (13.21mm)-0.515" (13.08mm)1.5W @ 50°C8.00°C/W @ 500 LFM28.30°C/WCopperTin
V-1102-SMD/A-L
V-1102-SMD/A-L
HEATSINK TO-263 19.38X25.40MM
Assmann WSW Components
6,568
In Stock
1 : ¥11.16000
Bulk
-
Bulk
ActiveTop MountTO-263 (D²Pak)SMD PadRectangular, Fins0.763" (19.38mm)1.000" (25.40mm)-0.450" (11.43mm)-23.00°C/W @ 300 LFM11.00°C/WCopperTin
6030D(COPPER)G
6030D(COPPER)G
BOARD LEVEL HEAT SINK
Boyd Laconia, LLC
1,526
In Stock
1 : ¥11.49000
Bulk
-
Bulk
ActiveBoard Level, VerticalTO-220Bolt On and PC PinRectangular, Fins1.180" (29.97mm)1.000" (25.40mm)-0.500" (12.70mm)1.0W @ 20°C6.00°C/W @ 300 LFM12.50°C/WCopperTin
ATS-PCB1074
ATS-PCB1074
HEATSINK TO-263 COPPER
Advanced Thermal Solutions Inc.
7,977
In Stock
1 : ¥11.90000
Cut Tape (CT)
250 : ¥9.55172
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
ActiveTop MountTO-263 (D²Pak)-Rectangular, Fins0.500" (12.70mm)1.031" (26.20mm)-0.401" (10.20mm)-9.50°C/W @ 200 LFM18.00°C/WCopperTin
7136DG
7136DG
BOARD LEVEL HEATSINK .515"TO-220
Boyd Laconia, LLC
1,831
In Stock
1 : ¥32.18000
Bulk
-
Bulk
ActiveBoard Level, VerticalTO-220Clip and PC PinRectangular, Fins0.848" (21.55mm)0.520" (13.21mm)-0.515" (13.08mm)1.0W @ 30°C6.00°C/W @ 500 LFM19.70°C/WCopperTin
7138DG
7138DG
BOARD LEVEL HEAT SINK
Boyd Laconia, LLC
1,531
In Stock
1 : ¥61.08000
Bulk
-
Bulk
ActiveBoard Level, VerticalTO-220Clip and PC PinRectangular, Fins1.025" (26.04mm)1.005" (25.53mm)-0.610" (15.49mm)1.5W @ 40°C5.00°C/W @ 500 LFM20.00°C/WCopperTin
342941
342941
COPPER HEATSINK 40X40.5X13.5MM
Boyd Laconia, LLC
228
In Stock
1 : ¥285.27000
Tray
-
Tray
ActiveTop Mount, SkivedBGAPush PinSquare, Fins1.594" (40.50mm)1.575" (40.00mm)-0.531" (13.50mm)-2.50°C/W @ 200 LFM13.30°C/WCopperAavSHIELD 3C
342949
342949
COPPER HEATSINK 80X80X12MM
Boyd Laconia, LLC
177
In Stock
1 : ¥501.02000
Tray
-
Tray
ActiveTop Mount, SkivedBGAPush PinSquare, Fins3.150" (80.00mm)3.150" (80.00mm)-0.472" (12.00mm)-1.20°C/W @ 200 LFM5.10°C/WCopperAavSHIELD 3C
ATS-UC-QFLOW-100
ATS-UC-QFLOW-200
QUADFLOW HEATSINK 1U CU FINS
Advanced Thermal Solutions Inc.
91
In Stock
1 : ¥1,320.64000
Box
Box
ActiveTop Mount, Zipper FinIntel LGA2011 & LGA2066 CPU CoolerPush PinSquare, Fins3.637" (92.38mm)3.626" (92.11mm)-1.142" (29.00mm)---CopperNickel
ATS-UC-QFLOW-100
ATS-UC-QFLOW-VC-200
QUADFLOW HEATSINK 1U VAPOR
Advanced Thermal Solutions Inc.
88
In Stock
1 : ¥1,840.86000
Box
Box
ActiveTop Mount, Zipper FinIntel LGA2011 & LGA2066 CPU CoolerPush PinSquare, Fins3.637" (92.38mm)3.626" (92.11mm)-1.142" (29.00mm)---CopperNickel
ATS-PCBT1095
ATS-PCBT1095
HEATSINK TO-252 D-PAK COPPER
Advanced Thermal Solutions Inc.
2,601
In Stock
1 : ¥7.63000
Bulk
-
Bulk
ActiveTop MountTO-252 (DPak)-Rectangular, Fins0.315" (8.00mm)0.842" (21.40mm)-0.400" (10.16mm)-21.00°C/W @ 200 LFM28.00°C/WCopperTin
7142DG
7142DG
HEATSINK TO-220 TIN CLIP-ON 21MM
Boyd Laconia, LLC
5,390
In Stock
1 : ¥8.37000
Bulk
-
Bulk
ActiveBoard LevelTO-220Clip and Board LocksRectangular, Fins0.780" (19.81mm)0.520" (13.21mm)-0.515" (13.08mm)1.0W @ 30°C8.00°C/W @ 400 LFM20.30°C/WCopperTin
ATS-PCBT1093
ATS-PCBT1093
HEATSINK TO-220 COPPER
Advanced Thermal Solutions Inc.
929
In Stock
1 : ¥11.90000
Bulk
-
Bulk
ActiveBoard Level, VerticalTO-220Bolt On and Board MountsRectangular, Fins1.252" (31.80mm)0.913" (23.20mm)-0.041" (1.05mm)-14.00°C/W @ 200 LFM23.00°C/WCopperTin
Showing
of 150

Copper Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.