Heat Sinks

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AluminumCopper
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Mfr Part #
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Series
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Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
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154
In Stock
1 : ¥1,115.81000
Box
Box
Active
Top Mount, Zipper Fin
Intel LGA2011 & LGA2066 CPU Cooler
Push Pin
Square, Fins
3.637" (92.38mm)
3.626" (92.11mm)
-
1.142" (29.00mm)
-
-
-
Aluminum
Nickel
88
In Stock
1 : ¥1,840.86000
Box
Box
Active
Top Mount, Zipper Fin
Intel LGA2011 & LGA2066 CPU Cooler
Push Pin
Square, Fins
3.637" (92.38mm)
3.626" (92.11mm)
-
1.142" (29.00mm)
-
-
-
Copper
Nickel
103
In Stock
1 : ¥1,320.64000
Box
Box
Active
Top Mount, Zipper Fin
Intel LGA2011 & LGA2066 CPU Cooler
Push Pin
Square, Fins
3.637" (92.38mm)
3.626" (92.11mm)
-
1.142" (29.00mm)
-
-
-
Copper
Nickel
Showing
of 3

Heat Sinks


Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.