Heat Sinks

Results: 9
Manufacturer
Assmann WSW ComponentsBoyd Laconia, LLCOhmite
Series
-MRR2VMW
Packaging
BoxBulkTray
Type
Board LevelBoard Level, VerticalTop Mount
Package Cooled
TO-218, TO-220, TO-247TO-220TO-220, TO-247TO-247TO-247, TO-264TO-264
Attachment Method
Bolt On and PC PinBolt OnClip and PC PinSolderable Feet
Length
0.984" (25.00mm)1.060" (26.92mm)1.260" (32.00mm)1.500" (38.10mm)1.520" (38.61mm)1.654" (42.00mm)2.170" (55.12mm)2.500" (63.50mm)
Width
0.921" (23.40mm)0.985" (25.00mm)1.260" (32.00mm)1.350" (34.30mm)1.380" (35.05mm)1.650" (41.91mm)2.200" (55.88mm)2.362" (60.00mm)
Fin Height
0.630" (16.00mm)0.787" (19.99mm)0.870" (22.10mm)0.984" (25.00mm)1.000" (25.40mm)1.520" (38.61mm)1.712" (43.48mm)2.000" (50.80mm)
Power Dissipation @ Temperature Rise
1.0W @ 20°C2.0W @ 20°C5.0W @ 20°C8.0W @ 40°C10.0W @ 50°C16.0W @ 43°C20.0W @ 60°C-
Thermal Resistance @ Forced Air Flow
0.60°C/W @ 600 LFM1.00°C/W @ 300 LFM1.00°C/W @ 800 LFM2.00°C/W @ 300 LFM2.00°C/W @ 400 LFM8.00°C/W @ 500 LFM-
Thermal Resistance @ Natural
2.60°C/W3.50°C/W4.60°C/W8.60°C/W10.00°C/W11.00°C/W-
Material Finish
Black AnodizedDegreased
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
530002B02500(G)
530002B02500G
HEATSINK TO-220 POWER W/PINS BK
Boyd Laconia, LLC
2,288
In Stock
1 : ¥17.16000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
2.500" (63.50mm)
1.650" (41.91mm)
-
1.000" (25.40mm)
20.0W @ 60°C
2.00°C/W @ 300 LFM
2.60°C/W
Aluminum
Black Anodized
R2A-CT4-38E
R2A-CT4-38E
HEATSINK FOR TO-247
Ohmite
4,322
In Stock
1 : ¥26.02000
Box
Box
Active
Board Level
TO-247
Clip and PC Pin
Rectangular, Fins
1.500" (38.10mm)
1.380" (35.05mm)
-
0.870" (22.10mm)
2.0W @ 20°C
1.00°C/W @ 800 LFM
8.60°C/W
Aluminum
Black Anodized
V5220W
V5220W
HEATSINK ANOD ALUM W/PIN TO-220
Assmann WSW Components
2,556
In Stock
1 : ¥7.55000
Tray
-
Tray
Active
Board Level, Vertical
TO-220
Bolt On
Rectangular, Fins
0.984" (25.00mm)
1.260" (32.00mm)
-
0.787" (19.99mm)
-
-
10.00°C/W
Aluminum
Black Anodized
RA-T2X-51E
RA-T2X-51E
HEATSINK TO-218,TO-220,TO-247
Ohmite
1,871
In Stock
1 : ¥20.19000
Box
Box
Active
Board Level, Vertical
TO-218, TO-220, TO-247
Bolt On and PC Pin
Rectangular, Fins
1.654" (42.00mm)
0.985" (25.00mm)
-
2.000" (50.80mm)
8.0W @ 40°C
1.00°C/W @ 300 LFM
3.50°C/W
Aluminum
Black Anodized
WA-T264-101E
WA-T264-101E
HEATSINK W/CLIP FOR TO-264
Ohmite
3,606
In Stock
1 : ¥21.59000
Box
Box
Active
Board Level, Vertical
TO-264
Clip and PC Pin
Rectangular, Fins
1.260" (32.00mm)
0.921" (23.40mm)
-
0.630" (16.00mm)
1.0W @ 20°C
8.00°C/W @ 500 LFM
11.00°C/W
Aluminum
Black Anodized
MA-301-27E
MA-301-27E
HEATSINK W/CLIP - TO-247/TO-264
Ohmite
241
In Stock
1 : ¥63.95000
Box
Box
Active
Top Mount
TO-247, TO-264
Clip and PC Pin
Rectangular, Fins
1.060" (26.92mm)
2.200" (55.88mm)
-
1.712" (43.48mm)
-
-
4.60°C/W
Aluminum
Black Anodized
M Series Heatsinks
MA-102-55E
HEATSINK FOR TO-247 TO-264 BLK
Ohmite
286
In Stock
1 : ¥76.43000
Box
Box
Active
Top Mount
TO-247, TO-264
Clip and PC Pin
Rectangular, Fins
2.170" (55.12mm)
1.350" (34.30mm)
-
1.520" (38.61mm)
16.0W @ 43°C
2.00°C/W @ 400 LFM
-
Aluminum
Black Anodized
MV-302-55E
MV-302-55E
HEATSINK FOR TO-247 TO-264
Ohmite
96
In Stock
1 : ¥107.62000
Box
Box
Active
Top Mount
TO-247, TO-264
Clip and PC Pin
Rectangular, Fins
2.170" (55.12mm)
2.200" (55.88mm)
-
1.712" (43.48mm)
5.0W @ 20°C
1.00°C/W @ 300 LFM
-
Aluminum
Degreased
VM SERIES
VM1-038-1AE
HEATSINK VERTICAL
Ohmite
0
In Stock
Check Lead Time
1 : ¥32.43000
Bulk
Bulk
Active
Board Level, Vertical
TO-220, TO-247
Solderable Feet
Rectangular, Fins
1.520" (38.61mm)
2.362" (60.00mm)
-
0.984" (25.00mm)
10.0W @ 50°C
0.60°C/W @ 600 LFM
-
Aluminum
Black Anodized
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Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.