Adapter, Breakout Boards

Results: 12
Manufacturer
Aries ElectronicsChip Quik Inc.SparkFun ElectronicsTexas Instruments
Series
-Correct-A-Chip®Correct-A-Chip® 350000Proto-Advantage
Packaging
BoxBulkTube
Proto Board Type
SMD to DIPSMD to Plated Through Hole
Package Accepted
SC-70, SC-88, SOT-363SC-70, SOT-23, SOT-583, SSOP, VSSOPSOICSOIC, SOPTSSOP
Number of Positions
6814162028
Pitch
0.026" (0.65mm)0.050" (1.27mm)-
Board Thickness
0.062" (1.57mm) 1/16"-
Material
-FR4 Epoxy Glass
Size / Dimension
0.400" L x 0.400" W (10.16mm x 10.16mm)0.400" x 0.400" (10.16mm x 10.16mm)0.700" L x 0.450" W (17.78mm x 11.43mm)0.700" L x 0.500" W (17.78mm x 12.70mm)0.700" L x 0.700" W (17.78mm x 17.78mm)0.700" x 0.300" (17.78mm x 7.62mm)0.700" x 0.700" (17.78mm x 17.78mm)0.800" L x 0.700" W (20.32mm x 17.78mm)0.800" x 1.400" (20.32mm x 35.56mm)1.000" L x 0.700" W (25.40mm x 17.78mm)-
Stocking Options
Environmental Options
Media
Marketplace Product
12Results

Showing
of 12
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
BOB-13655
BOB-13655
SOIC TO DIP ADAPTER 8PIN 1=4 PCS
SparkFun Electronics
718
In Stock
1 : ¥28.73000
Bulk
-
Bulk
Active
SMD to DIP
SOIC
8
-
-
-
0.400" L x 0.400" W (10.16mm x 10.16mm)
LCQT-TSSOP14
LCQT-TSSOP14
SOCKET ADAPTER TSSOP TO 14DIP
Aries Electronics
5,986
In Stock
1 : ¥31.93000
Bulk
Bulk
Active
SMD to DIP
TSSOP
14
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" L x 0.500" W (17.78mm x 12.70mm)
14-350000-11-RC
14-350000-11-RC
SOCKET ADAPTER SOIC TO 14DIP 0.3
Aries Electronics
694
In Stock
1 : ¥173.46000
Tube
Tube
Active
SMD to DIP
SOIC
14
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" L x 0.450" W (17.78mm x 11.43mm)
PCB3005A1
PCB3005A1
SOIC-8 TO DIP-8 SMT ADAPTER (1.2
Chip Quik Inc.
747
In Stock
1 : ¥17.16000
Bulk
Bulk
Active
SMD to DIP
SOIC
8
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.400" x 0.400" (10.16mm x 10.16mm)
PA0087
PA0087
SC70-6/SOT-363 TO DIP-6 SMT ADAP
Chip Quik Inc.
630
In Stock
1 : ¥22.08000
Bulk
Bulk
Active
SMD to DIP
SC-70, SC-88, SOT-363
6
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" x 0.300" (17.78mm x 7.62mm)
PCB3001-1
PCB3001-1
SOIC28W/N AND SOP28 TO DIP SMT A
Chip Quik Inc.
193
In Stock
1 : ¥26.19000
Bulk
Bulk
Active
SMD to DIP
SOIC, SOP
28
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.800" x 1.400" (20.32mm x 35.56mm)
PA0003
PA0003
SOIC-14 TO DIP-14 SMT ADAPTER
Chip Quik Inc.
296
In Stock
1 : ¥28.65000
Bulk
Bulk
Active
SMD to DIP
SOIC
14
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" x 0.700" (17.78mm x 17.78mm)
LCQT-SOIC14W
LCQT-SOIC14W
SOCKET ADAPTER SOIC-W TO 14DIP
Aries Electronics
192
In Stock
1 : ¥37.11000
Bulk
Bulk
Active
SMD to DIP
SOIC
14
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" L x 0.700" W (17.78mm x 17.78mm)
LCQT-SOIC14
LCQT-SOIC14
SOCKET ADAPTER SOIC TO 14DIP
Aries Electronics
155
In Stock
1 : ¥37.11000
Bulk
Bulk
Active
SMD to DIP
SOIC
14
0.050" (1.27mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.700" L x 0.700" W (17.78mm x 17.78mm)
LCQT-TSSOP16
LCQT-TSSOP16
SOCKET ADAPTER TSSOP TO 16DIP
Aries Electronics
101
In Stock
1 : ¥38.99000
Bulk
Bulk
Active
SMD to DIP
TSSOP
16
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
0.800" L x 0.700" W (20.32mm x 17.78mm)
LCQT-TSSOP20
LCQT-TSSOP20
SOCKET ADAPTER TSSOP TO 20DIP
Aries Electronics
41
In Stock
1 : ¥52.13000
Bulk
Bulk
Active
SMD to DIP
TSSOP
20
0.026" (0.65mm)
0.062" (1.57mm) 1/16"
FR4 Epoxy Glass
1.000" L x 0.700" W (25.40mm x 17.78mm)
0
In Stock
Check Lead Time
1 : ¥98.51000
Box
-
Box
Active
SMD to Plated Through Hole
SC-70, SOT-23, SOT-583, SSOP, VSSOP
8
-
-
-
-
Showing
of 12

Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.