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374324B00035G | ||
|---|---|---|
DigiKey Part Number | HS318-ND | |
Manufacturer | ||
Manufacturer Product Number | 374324B00035G | |
Description | HEATSINK BGA W/ADHESIVE TAPE | |
Manufacturer Standard Lead Time | 8 Weeks | |
Customer Reference | ||
Detailed Description | Heat Sink BGA, FPGA Aluminum 3.0W @ 90°C Board Level | |
Datasheet | Datasheet | |
Product Attributes
Type | Description | Select All |
|---|---|---|
Category | ||
Mfr | ||
Series | ||
Packaging | Box | |
Part Status | Active | |
Type | Board Level | |
Package Cooled | BGA, FPGA | |
Attachment Method | Thermal Tape, Adhesive (Included) | |
Shape | Square, Pin Fins | |
Length | 1.063" (27.00mm) | |
Width | 1.063" (27.00mm) | |
Diameter | - | |
Fin Height | 0.394" (10.00mm) | |
Power Dissipation @ Temperature Rise | 3.0W @ 90°C | |
Thermal Resistance @ Forced Air Flow | 9.30°C/W @ 200 LFM | |
Thermal Resistance @ Natural | 30.60°C/W | |
Material | ||
Material Finish | Black Anodized | |
Shelf Life | - | |
Base Product Number |
Quantity
All prices are in CNY
Box
| Quantity | Unit Price (Including 13% VAT) | Ext Price (Including 13% VAT) |
|---|---|---|
| 1 | ¥19.62000 | ¥19.62 |
| 10 | ¥19.09500 | ¥190.95 |
| 25 | ¥18.57920 | ¥464.48 |
| 50 | ¥17.54660 | ¥877.33 |
| 100 | ¥16.51470 | ¥1,651.47 |
| 250 | ¥15.48284 | ¥3,870.71 |
| 500 | ¥14.96678 | ¥7,483.39 |
| 1,000 | ¥13.41851 | ¥13,418.51 |
| 5,000 | ¥13.16047 | ¥65,802.35 |
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