Solderless Breadboards

Results: 7
Number of Terminal Strips
12345
Number of Distribution Buses
2681012
Number of Tie Points (Total)
61084018242712364845205424
Number of 5-Tie Point Terminals
94128256384512640768
Number of Binding Posts
234
Size / Dimension
5.40" x 4.00" (137.2mm x 101.6mm)7.00" x 4.00" (177.8mm x 101.6mm)7.75" x 6.25" (196.9mm x 158.8mm)8.00" x 9.25" (203.2mm x 235.0mm)10.25" x 9.25" (260.4mm x 235.0mm)12.44" x 9.75" (316.0mm x 247.7mm)14.69" x 9.75" (373.1mm x 247.7mm)
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Terminal Strips
Number of Distribution Buses
Number of Tie Points (Total)
Number of 5-Tie Point Terminals
Number of Binding Posts
Size / Dimension
922318
922318
BREADBOARD ASSEMBLY 7.75X6.25"
3M
38
In Stock
1 : ¥1,201.41000
Bulk
Bulk
Active
Assembly (On Frame)
2
6
1824
256
3
7.75" x 6.25" (196.9mm x 158.8mm)
922327
922327
BREADBOARD ASSEMBLY 8.00X9.25"
3M
51
In Stock
1 : ¥1,810.37000
Bulk
Bulk
Active
Assembly (On Frame)
3
8
2712
384
4
8.00" x 9.25" (203.2mm x 235.0mm)
922309
922309
BREADBOARD ASSEMBLY 7.00X4.00"
3M
25
In Stock
1 : ¥707.64000
Bulk
Bulk
Active
Assembly (On Frame)
1
2
840
128
3
7.00" x 4.00" (177.8mm x 101.6mm)
922306
922306
BREADBOARD ASSEMBLY 5.40X4.00"
3M
18
In Stock
1 : ¥627.14000
Bulk
Bulk
Active
Assembly (On Frame)
1
2
610
94
2
5.40" x 4.00" (137.2mm x 101.6mm)
922336
922336
BREADBRD ASSEMBLY 10.25X9.25"
3M
17
In Stock
1 : ¥1,878.37000
Bulk
Bulk
Active
Assembly (On Frame)
4
10
3648
512
4
10.25" x 9.25" (260.4mm x 235.0mm)
922354
922354
BREADBRD ASSEMBLY 14.69X9.75"
3M
10
In Stock
1 : ¥2,884.19000
Bulk
Bulk
Active
Assembly (On Frame)
5
12
5424
768
4
14.69" x 9.75" (373.1mm x 247.7mm)
922345
922345
BREADBRD ASSEMBLY 12.44X9.75"
3M
1
In Stock
1 : ¥2,585.67000
Bulk
Bulk
Active
Assembly (On Frame)
5
12
4520
640
4
12.44" x 9.75" (316.0mm x 247.7mm)
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Solderless Breadboards


Solderless breadboard products provide a convenient means of interconnecting electronic components in hobby, educational, or development contexts, without the need for soldering or similar fixation processes. Composed of U-shaped metallic contacts positioned beneath a grid of holes in an electrically insulating housing, component leads, and wire segments inserted through the holes in the insulator are electrically connected and retained under spring tension by the contacts beneath. Though easily reconfigurable and thus ideal for experimentation, they do not provide mechanically robust interconnections, and introduce significant parasitic circuit elements which make them ill-suited for high-speed circuits.