Solderless Breadboards

Results: 4
Manufacturer
Digilent, Inc.Twin Industries
Packaging
BoxBulk
Type
Assembly (On Frame)Terminal Strip (No Frame)
Number of Terminal Strips
13
Number of Distribution Buses
25
Number of Tie Points (Total)
4008302390
Number of 5-Tie Point Terminals
60126378
Number of Binding Posts
34
Size / Dimension
3.29" x 2.15" (83.6mm x 54.6mm)6.50" x 2.14" (165.1mm x 54.4mm)9.06" x 6.89" (230.0mm x 175.0mm)
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Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Terminal Strips
Number of Distribution Buses
Number of Tie Points (Total)
Number of 5-Tie Point Terminals
Number of Binding Posts
Size / Dimension
TW-E40-1020
TW-E40-1020
BREADBOARD TERM STRIP 6.50X2.14"
Twin Industries
1,198
In Stock
1 : ¥54.66000
Bulk
-
Bulk
Active
Terminal Strip (No Frame)
1
2
830
126
-
6.50" x 2.14" (165.1mm x 54.4mm)
TW-E41-102B
TW-E41-102B
BREADBOARD ASSEM 6.5X2.14" 70PC
Twin Industries
389
In Stock
1 : ¥135.92000
Bulk
-
Bulk
Active
Assembly (On Frame)
1
2
830
126
3
6.50" x 2.14" (165.1mm x 54.4mm)
340-002-1_View 1
340-002-1
BREADBOARD KIT SOLDERLESS LARGE
Digilent, Inc.
364
In Stock
1 : ¥416.51000
Box
-
Box
Active
Assembly (On Frame)
3
5
2390
378
4
9.06" x 6.89" (230.0mm x 175.0mm)
240-131
240-131
BREADBOARD TERM STRIP 3.29X2.15"
Digilent, Inc.
144
In Stock
1 : ¥50.92000
Bulk
-
Bulk
Active
Terminal Strip (No Frame)
1
2
400
60
-
3.29" x 2.15" (83.6mm x 54.6mm)
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Solderless Breadboards


Solderless breadboard products provide a convenient means of interconnecting electronic components in hobby, educational, or development contexts, without the need for soldering or similar fixation processes. Composed of U-shaped metallic contacts positioned beneath a grid of holes in an electrically insulating housing, component leads, and wire segments inserted through the holes in the insulator are electrically connected and retained under spring tension by the contacts beneath. Though easily reconfigurable and thus ideal for experimentation, they do not provide mechanically robust interconnections, and introduce significant parasitic circuit elements which make them ill-suited for high-speed circuits.