Solderless Breadboards

Results: 5
Manufacturer
3MBud IndustriesDigilent, Inc.Global Specialties
Series
-300BG, Board-GanizerPB
Packaging
BoxBulk
Type
Assembly (On Frame)Terminal Strip (No Frame)
Number of Terminal Strips
123
Number of Distribution Buses
256
Number of Tie Points (Total)
83084018242390
Number of 5-Tie Point Terminals
126128256378
Number of Binding Posts
34
Size / Dimension
6.50" x 2.15" (165.1mm x 54.5mm)7.00" x 4.00" (177.8mm x 101.6mm)7.75" x 6.25" (196.9mm x 158.8mm)9.06" L x 6.89" W (230.0mm x 175.0mm)9.06" x 6.89" (230.0mm x 175.0mm)
Stocking Options
Environmental Options
Media
Marketplace Product
5Results

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of 5
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Terminal Strips
Number of Distribution Buses
Number of Tie Points (Total)
Number of 5-Tie Point Terminals
Number of Binding Posts
Size / Dimension
BG, Board-Ganizer Series
BB-32656
BREADBOARD TERM STRIP 6.50X2.15"
Bud Industries
546
In Stock
774
Factory
1 : ¥68.85000
Bulk
Bulk
Active
Terminal Strip (No Frame)
1
2
830
126
-
6.50" x 2.15" (165.1mm x 54.5mm)
340-002-1_View 1
340-002-1
BREADBOARD KIT SOLDERLESS LARGE
Digilent, Inc.
343
In Stock
1 : ¥416.51000
Box
-
Box
Active
Assembly (On Frame)
3
5
2390
378
4
9.06" x 6.89" (230.0mm x 175.0mm)
922318
922318
BREADBOARD ASSEMBLY 7.75X6.25"
3M
37
In Stock
1 : ¥1,201.41000
Bulk
Bulk
Active
Assembly (On Frame)
2
6
1824
256
3
7.75" x 6.25" (196.9mm x 158.8mm)
PB-103M
PB-103M
BREADBOARD ASSEMBLY 9.06X6.89"
Global Specialties
15
In Stock
1 : ¥397.81000
Bulk
Bulk
Active
Assembly (On Frame)
3
5
2390
378
4
9.06" L x 6.89" W (230.0mm x 175.0mm)
922309
922309
BREADBOARD ASSEMBLY 7.00X4.00"
3M
24
In Stock
1 : ¥707.64000
Bulk
Bulk
Active
Assembly (On Frame)
1
2
840
128
3
7.00" x 4.00" (177.8mm x 101.6mm)
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of 5

Solderless Breadboards


Solderless breadboard products provide a convenient means of interconnecting electronic components in hobby, educational, or development contexts, without the need for soldering or similar fixation processes. Composed of U-shaped metallic contacts positioned beneath a grid of holes in an electrically insulating housing, component leads, and wire segments inserted through the holes in the insulator are electrically connected and retained under spring tension by the contacts beneath. Though easily reconfigurable and thus ideal for experimentation, they do not provide mechanically robust interconnections, and introduce significant parasitic circuit elements which make them ill-suited for high-speed circuits.