Power Driver Modules

Results: 7
Series
CIPOS™IM818-SCC
Configuration
3 Phase3 Phase Inverter
Current
6 A10 A16 A20 A30 A
Voltage
600 V650 V1.2 kV
Voltage - Isolation
2000Vrms2500Vrms
Package / Case
24-PowerDIP Module (1.028", 26.10mm)24-PowerDIP Module (1.205", 30.60mm)
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Quantity Available
Price
Series
Package
Product Status
Type
Configuration
Current
Voltage
Voltage - Isolation
Mounting Type
Package / Case
CIPOS Series
IGCM20F60GAXKMA1
IGBT 600V 20A 24PWRDIP MOD
Infineon Technologies
227
In Stock
1 : ¥100.08000
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IGBT
3 Phase
20 A
600 V
2000Vrms
Through Hole
24-PowerDIP Module (1.028", 26.10mm)
DIP 36x23D
IM818MCCXKMA1
IGBT MODULE 1200V 16A 24PWRDIP
Infineon Technologies
639
In Stock
1 : ¥296.38000
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IGBT
3 Phase Inverter
16 A
1.2 kV
2500Vrms
Through Hole
24-PowerDIP Module (1.205", 30.60mm)
279
In Stock
1 : ¥74.87000
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Active
IGBT
3 Phase
6 A
600 V
2000Vrms
Through Hole
24-PowerDIP Module (1.028", 26.10mm)
226
In Stock
1 : ¥78.49000
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Active
IGBT
3 Phase
20 A
600 V
2000Vrms
Through Hole
24-PowerDIP Module (1.028", 26.10mm)
CIPOS Series
IKCM10H60GAXKMA1
MODULE IGBT 600V 10A 24PWRDIP
Infineon Technologies
283
In Stock
1 : ¥85.63000
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IGBT
3 Phase
10 A
600 V
2000Vrms
Through Hole
24-PowerDIP Module (1.028", 26.10mm)
24-PowerDIP Module
IFCM15S60GDXKMA1
IFPS MODULE 650V 30A 24PWRDIP
Infineon Technologies
273
In Stock
1 : ¥143.18000
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IGBT
3 Phase Inverter
30 A
650 V
2000Vrms
Through Hole
24-PowerDIP Module (1.028", 26.10mm)
0
In Stock
Check Lead Time
1 : ¥89.49000
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IGBT
3 Phase
10 A
600 V
2000Vrms
Through Hole
24-PowerDIP Module (1.028", 26.10mm)
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Power Driver Modules

Power driver modules provide the physical containment for power components, usually IGBTs and MOSFETs in a half bridge or one-, two- or three-phase configurations. Power semiconductors or dies are soldered or sintered on a substrate that carries the power semiconductors and provides electrical and thermal contact and electrical insulation where needed. Power modules provide a higher power density and are in many cases more reliable and easier to cool.