IC Sockets

Results: 15
Manufacturer
3MAdafruit Industries LLCAmphenol ICC (FCI)Aries ElectronicsCNC TechPreci-Dip
Series
-11055Textool™
Packaging
-BulkTube
Type
DIP, 0.6" (15.24mm) Row SpacingDIP, ZIF (ZIP)DIP, ZIF (ZIP), 0.3" (7.62mm) Row SpacingDIP, ZIF (ZIP), 0.6" (15.24mm) Row SpacingDIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing
Number of Positions or Pins (Grid)
14 (2 x 7)16 (2 x 8)20 (2 x 10)28 (2 x 14)32 (2 x 16)40 (2 x 20)42 (2 x 21)48 (2 x 24)
Pitch - Mating
0.070" (1.78mm)0.100" (2.54mm)-
Contact Finish - Mating
GoldTin
Contact Finish Thickness - Mating
30.0µin (0.76µm)100.0µin (2.54µm)200.0µin (5.08µm)-Flash
Contact Material - Mating
-Beryllium CopperCopper AlloyPhosphor Bronze
Mounting Type
ConnectorThrough Hole
Features
Closed FrameOpen Frame
Termination
Press-FitSolder
Pitch - Post
0.100" (2.54mm)-
Contact Finish - Post
GoldTin
Contact Finish Thickness - Post
30.0µin (0.76µm)100.0µin (2.54µm)200.0µin (5.08µm)-
Contact Material - Post
-Beryllium CopperBrassCopper AlloyPhosphor Bronze
Housing Material
-Polyamide (PA), NylonPolybutylene Terephthalate (PBT), Glass FilledPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass FilledPolyphenylene Sulfide (PPS), Glass FilledPolysulfone (PSU), Glass Filled
Operating Temperature
-55°C ~ 105°C-55°C ~ 125°C-40°C ~ 105°C-
Stocking Options
Environmental Options
Media
Marketplace Product
15Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
214-3339-00-0602J
214-3339-00-0602J
CONN IC DIP SOCKET ZIF 14POS GLD
3M
351
In Stock
1 : ¥187.43000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
220-3342-00-0602J
220-3342-00-0602J
CONN IC DIP SOCKET ZIF 20POS GLD
3M
401
In Stock
1 : ¥199.42000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
20 (2 x 10)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
216-3340-00-0602J
216-3340-00-0602J
CONN IC DIP SOCKET ZIF 16POS GLD
3M
181
In Stock
1 : ¥202.13000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
243-40-1-06
243-40-1-06
CONN IC DIP SOCKET 40POS TIN
CNC Tech
1,850
In Stock
1 : ¥6.40000
Tube
-
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
DILB40P-223TLF
DILB40P-223TLF
CONN IC DIP SOCKET 40POS TIN
Amphenol ICC (FCI)
11,009
In Stock
1 : ¥11.17000
Tube
-
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Copper Alloy
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Copper Alloy
Polyamide (PA), Nylon
-55°C ~ 105°C
110-87-640-41-001101
110-87-640-41-001101
CONN IC DIP SOCKET 40POS GOLD
Preci-Dip
2,039
In Stock
1 : ¥24.79000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
101
In Stock
1 : ¥32.84000
-
-
-
Active
DIP, ZIF (ZIP)
40 (2 x 20)
-
Gold
-
-
Through Hole
Closed Frame
Solder
-
Gold
-
-
-
-
40-6554-10
40-6554-10
CONN IC DIP SOCKET ZIF 40POS TIN
Aries Electronics
92
In Stock
1 : ¥158.61000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
248-1282-00-0602J
248-1282-00-0602J
CONN IC DIP SOCKET ZIF 48POS GLD
3M
48
In Stock
1 : ¥326.59000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
48 (2 x 24)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
240-1288-00-0602J
240-1288-00-0602J
CONN IC DIP SOCKET ZIF 40POS GLD
3M
83
In Stock
1 : ¥379.95000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
40-6554-11
40-6554-11
CONN IC DIP SOCKET ZIF 40POS GLD
Aries Electronics
45
In Stock
1 : ¥228.73000
Bulk
Bulk
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Gold
-
Beryllium Copper
Polyphenylene Sulfide (PPS), Glass Filled
-
228-1290-00-0602j
228-1290-00-0602J
CONN IC DIP SOCKET ZIF 28POS GLD
3M
13
In Stock
1 : ¥242.68000
Bulk
Bulk
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.070" (1.78mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
242-1281-00-0602J
242-1281-00-0602J
CONN IC DIP SOCKET ZIF 42POS GLD
3M
30
In Stock
1 : ¥251.47000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
42 (2 x 21)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
232-1285-00-0602J
232-1285-00-0602J
CONN IC DIP SOCKET ZIF 32POS GLD
3M
10
In Stock
1 : ¥230.04000
Tube
Tube
Active
DIP, ZIF (ZIP), 0.6" (15.24mm) Row Spacing
32 (2 x 16)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
240-3639-00-0602j
240-3639-00-0602J
CONN IC DIP SOCKET ZIF 40POS GLD
3M
0
In Stock
Check Lead Time
1 : ¥378.97000
Bulk
Bulk
Active
DIP, ZIF (ZIP), 1.0" (25.40mm) Row Spacing
40 (2 x 20)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Connector
Closed Frame
Press-Fit
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Polysulfone (PSU), Glass Filled
-55°C ~ 125°C
Showing
of 15

IC Sockets

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.