Bipolar Transistor Arrays

Results: 2
Manufacturer
Diodes IncorporatedNexperia USA Inc.
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Transistor Type
1 NPN, 1 PNP2 NPN (Dual)
Current - Collector (Ic) (Max)
100mA4A, 3A
Voltage - Collector Emitter Breakdown (Max)
45V50V, 40V
Vce Saturation (Max) @ Ib, Ic
300mV @ 5mA, 100mA320mV @ 200mA, 4A / 370mV @ 250mA, 2.5A
Current - Collector Cutoff (Max)
15nA (ICBO)100nA
DC Current Gain (hFE) (Min) @ Ic, Vce
100 @ 2A, 2V / 60 @ 1.5A, 2V200 @ 2mA, 5V
Power - Max
300mW1.7W
Frequency - Transition
100MHz165MHz, 190MHz
Operating Temperature
-55°C ~ 150°C (TJ)150°C (TJ)
Package / Case
6-TSSOP, SC-88, SOT-3638-WDFN Exposed Pad
Supplier Device Package
6-TSSOPDFN3020B-8
Stocking Options
Environmental Options
Media
Marketplace Product
2Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Transistor Type
Current - Collector (Ic) (Max)
Voltage - Collector Emitter Breakdown (Max)
Vce Saturation (Max) @ Ib, Ic
Current - Collector Cutoff (Max)
DC Current Gain (hFE) (Min) @ Ic, Vce
Power - Max
Frequency - Transition
Operating Temperature
Grade
Qualification
Mounting Type
Package / Case
Supplier Device Package
SOT363
BC847BS,135
TRANS 2NPN 45V 0.1A 6TSSOP
Nexperia USA Inc.
156,857
In Stock
1 : ¥2.22000
Cut Tape (CT)
10,000 : ¥0.20925
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
2 NPN (Dual)
100mA
45V
300mV @ 5mA, 100mA
15nA (ICBO)
200 @ 2mA, 5V
300mW
100MHz
150°C (TJ)
-
-
Surface Mount
6-TSSOP, SC-88, SOT-363
6-TSSOP
ZXTC6719MCTA
ZXTC6719MCTA
TRANS NPN/PNP 50V/40V 4A/3A 8DFN
Diodes Incorporated
5,351
In Stock
12,000
Factory
1 : ¥6.81000
Cut Tape (CT)
3,000 : ¥2.59952
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
1 NPN, 1 PNP
4A, 3A
50V, 40V
320mV @ 200mA, 4A / 370mV @ 250mA, 2.5A
100nA
100 @ 2A, 2V / 60 @ 1.5A, 2V
1.7W
165MHz, 190MHz
-55°C ~ 150°C (TJ)
-
-
Surface Mount
8-WDFN Exposed Pad
DFN3020B-8
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Bipolar Transistor Arrays


Bipolar transistor arrays incorporate two or more discrete transistors in a shared package, either as electrically separate entities or with interconnections of some form between them being made inside the device package. Arrays in which the devices contained have closely matched or complementary characteristics, the co-packaged character minimizes temperature differences between devices during operation.