Adapter, Breakout Boards

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Proto Board Type	Package Accepted	Number of Positions	Pitch	Board Thickness	Material	Size / Dimension

1212 SMT ADAP 6 PACK 8SOIC/MSOP/TSSOP Adafruit Industries LLC	305 In Stock	1 : ¥24.22000 Bulk	-	Bulk	Active	SMD to DIP	MSOP, SOIC, TSSOP	8	-	-	-	0.550" L x 0.425" W (13.97mm x 10.80mm)
BOB-13655 SOIC TO DIP ADAPTER 8PIN 1=4 PCS SparkFun Electronics	464 In Stock	1 : ¥28.73000 Bulk	-	Bulk	Active	SMD to DIP	SOIC	8	-	-	-	0.400" L x 0.400" W (10.16mm x 10.16mm)
PA0001C SOIC-8 TO DIP-8 SMT ADAPTER (1.2 Chip Quik Inc.	1,740 In Stock	1 : ¥53.28000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SOIC	8	0.050" (1.27mm)	0.063" (1.60mm)	FR4 Epoxy Glass	0.400" L x 0.400" W (10.16mm x 10.16mm)
PA-SOD3SM18-16 SOCKET ADAPTER SOIC TO 16DIP Logical Systems Inc.	563 In Stock	1 : ¥65.67000 Box	-	Box	Active	SMD to DIP	SOIC	16	0.050" (1.27mm)	0.031" (0.79mm) 1/32"	-	0.850" L x 0.500" W (21.59mm x 12.70mm)
PA0001 SOIC-8 TO DIP-8 SMT ADAPTER Chip Quik Inc.	201 In Stock	1 : ¥28.65000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SOIC	8	0.050" (1.27mm)	0.062" (1.57mm) 1/16"	FR4 Epoxy Glass	0.700" x 0.400" (17.78mm x 10.16mm)
PA0086C SOT23-5 TO DIP-6 SMT ADAPTER (0. Chip Quik Inc.	152 In Stock	1 : ¥46.71000 Bulk	Proto-Advantage	Bulk	Active	SMD to DIP	SOT-23	5	0.037" (0.95mm)	0.063" (1.60mm)	FR4 Epoxy Glass	0.400" L x 0.300" W (10.16mm x 7.62mm)
PA-SOD3SM18-14 SOCKET ADAPTER SOIC TO 14DIP Logical Systems Inc.	423 In Stock	1 : ¥57.47000 Box	-	Box	Active	SMD to DIP	SOIC	14	0.050" (1.27mm)	0.031" (0.79mm) 1/32"	-	0.750" L x 0.500" W (19.05mm x 12.70mm)
5-8-LOGIC-EVM LOGIC EVAL BOARD Texas Instruments	0 In Stock Check Lead Time	1 : ¥98.51000 Box	-	Box	Active	SMD to Plated Through Hole	SC-70, SOT-23, SOT-583, SSOP, VSSOP	8	-	-	-	-
PA-SOTD3SM18-06 SOCKET ADAPTER SOIC TO 6DIP Logical Systems Inc.	7 In Stock	1 : ¥41.05000 Box	-	Box	Active	SMD to DIP	SOIC	6	0.037" (0.95mm)	-	-	0.450" L x 0.350" W (11.43mm x 8.89mm)

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Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.