Solderless Breadboards

Results: 6
Packaging
BoxBulk
Number of Terminal Strips
12346
Number of Distribution Buses
1245711
Number of Tie Points (Total)
83013601660239032204560
Number of 5-Tie Point Terminals
126252378504708
Number of Binding Posts
2345
Size / Dimension
7.20" L x 3.74" W (183.0mm x 95.0mm)8.46" L x 3.94" W (215.0mm x 100.0mm)8.46" L x 5.12" W (215.0mm x 130.0mm)9.06" L x 6.89" W (230.0mm x 175.0mm)9.45" L x 8.27" W (240.0mm x 210.0mm)12.01" L x 9.45" W (305.0mm x 240.0mm)
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Series
Package
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Type
Number of Terminal Strips
Number of Distribution Buses
Number of Tie Points (Total)
Number of 5-Tie Point Terminals
Number of Binding Posts
Size / Dimension
PB-104M
PB-104M
BREADBOARD ASSEMBLY 9.45X8.27"
Global Specialties
29
In Stock
1 : ¥578.01000
Bulk
Bulk
Active
Assembly (On Frame)
4
7
3220
504
4
9.45" L x 8.27" W (240.0mm x 210.0mm)
PB-103M
PB-103M
BREADBOARD ASSEMBLY 9.06X6.89"
Global Specialties
28
In Stock
1 : ¥397.81000
Bulk
Bulk
Active
Assembly (On Frame)
3
5
2390
378
4
9.06" L x 6.89" W (230.0mm x 175.0mm)
PB-101M
PB-101M
BREADBOARD ASSEMBLY 8.46X3.94"
Global Specialties
33
In Stock
1 : ¥212.50000
Bulk
Bulk
Active
Assembly (On Frame)
2
1
1360
252
2
8.46" L x 3.94" W (215.0mm x 100.0mm)
PB-70M
PB-70M
BREADBOARD ASSEMBLY 8.46X5.12"
Global Specialties
49
In Stock
1 : ¥255.01000
Bulk
Bulk
Active
Assembly (On Frame)
2
4
1660
252
3
8.46" L x 5.12" W (215.0mm x 130.0mm)
PB-105M
PB-105M
BREADBOARD ASSEMBLY 12.01X9.45"
Global Specialties
4
In Stock
1 : ¥1,062.52000
Box
Box
Active
Assembly (On Frame)
6
11
4560
708
5
12.01" L x 9.45" W (305.0mm x 240.0mm)
PB-83M
PB-83M
BREADBOARD ASSEMBLY 7.20X3.74"
Global Specialties
0
In Stock
Check Lead Time
1 : ¥178.50000
Bulk
Bulk
Active
Assembly (On Frame)
1
2
830
126
3
7.20" L x 3.74" W (183.0mm x 95.0mm)
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Solderless Breadboards


Solderless breadboard products provide a convenient means of interconnecting electronic components in hobby, educational, or development contexts, without the need for soldering or similar fixation processes. Composed of U-shaped metallic contacts positioned beneath a grid of holes in an electrically insulating housing, component leads, and wire segments inserted through the holes in the insulator are electrically connected and retained under spring tension by the contacts beneath. Though easily reconfigurable and thus ideal for experimentation, they do not provide mechanically robust interconnections, and introduce significant parasitic circuit elements which make them ill-suited for high-speed circuits.