DDC264 Datasheet by Texas Instruments

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DDC264

Configuration

and

Control

Serial

Interface

CLK

CONV

DIN_CFG

CLK_CFG

RESET

DVALID

DOUT

DIN

DCLK

VREF

DGNDAGNDQGND

AVDD DVDD

OPA350

Buffer

REF3040

VREF

IN64

IN1

To/From

Controller

Product

Folder

Sample &

Buy

Technical

Documents

Tools &

Software

Support &

Community

An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,

intellectual property matters and other important disclaimers. PRODUCTION DATA.

DDC264

SBAS368D –MAY 2006–REVISED DECEMBER 2016

DDC264 64-Channel, Current-Input Analog-to-Digital Converter

1 Features

1• Single-Chip Solution to Directly Measure 64 Low-

Level Currents

• Proven High-Precision, True Integrating

Architecture With 100% Charge Collection

• Easy Upgrade for Existing DDC Family

Applications

• Very Low Power: 3 mW/channel

• Extremely Linear:

INL = ±0.025% of Reading ±1 ppm of FSR

• Low Noise: 6.3 ppm of FSR

• Adjustable Full-Scale Range

• Adjustable Speed

– Data Rates up to 6 kSPS With 20-bit

Performance

– Integration Times as low as 160 µs

• Daisy-Chainable Serial Interface

• In-Package Bypass Capacitors Simplify PCB

Design

2 Applications

• CT Scanner DAS

• Photodiode Sensors

• X-Ray Detection Systems

SPACER

Simplified Schematic

Protected by US Patent #5841310

3 Description

The DDC264 is a 20-bit, 64-channel, current-input

analog-to-digital (A/D) converter. It combines both

current-to-voltage and A/D conversion so that 64

separate low-level current output devices, such as

photodiodes, can be directly connected to its inputs

and digitized.

For each of the 64 inputs, the DDC264 uses the

proven dual switched integrator front-end. This

configuration allows for continuous current

integration: while one integrator is being digitized by

the onboard A/D converter, the other is integrating

the input current. This architecture provides both a

very stable offset and a loss-less collection of the

input current. Adjustable integration times range from

160 µs to 1 s, allowing currents from fAs to µAs to be

continuously measured with outstanding precision.

The DDC264 has a serial interface designed for

daisy-chaining in multi-device systems. Simply

connect the output of one device to the input of the

next to create the chain. Common clocking feeds all

the devices in the chain so that the digital overhead

in a multi-DDC264 system is minimal.

The DDC264 uses a 5-V analog supply and a 2.7-V

to 3.6-V digital supply. Bypass capacitors within the

DDC264 package help minimize the external

component requirements. Operating over the

temperature range of 0°C to 70°C, the DDC264

100-pin NFBGA package is offered in two versions:

the DDC264C for low-power applications, and the

DDC264CK when higher speeds are required.

Device Information(1)

PART NUMBER PACKAGE BODY SIZE (NOM)

DDC264 NFBGA (100) 9.00 mm × 9.00 mm

(1) For all available packages, see the orderable addendum at

the end of the data sheet.

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Table of Contents

1 Features.................................................................. 1

2 Applications ........................................................... 1

3 Description ............................................................. 1

4 Revision History..................................................... 2

5 Device Comparison Table..................................... 3

6 Pin Configuration and Functions......................... 4

7 Specifications......................................................... 5

7.1 Absolute Maximum Ratings ...................................... 5

7.2 ESD Ratings.............................................................. 5

7.3 Recommended Operating Conditions....................... 5

7.4 Thermal Information.................................................. 6

7.5 Electrical Characteristics........................................... 6

7.6 Typical Characteristics.............................................. 8

8 Detailed Description............................................ 11

8.1 Overview ................................................................. 11

8.2 Functional Block Diagram....................................... 13

8.3 Feature Description................................................. 13

8.4 Device Functional Modes........................................ 20

8.5 Programming........................................................... 21

8.6 Register Maps......................................................... 23

9 Application and Implementation ........................ 24

9.1 Application Information............................................ 24

9.2 Typical Application .................................................. 25

10 Power Supply Recommendations ..................... 29

10.1 Power-Up Sequencing .......................................... 29

10.2 Power Supplies and Grounding ............................ 29

11 Layout................................................................... 30

11.1 Layout Guidelines ................................................. 30

11.2 Layout Example .................................................... 31

12 Device and Documentation Support ................. 32

12.1 Receiving Notification of Documentation Updates 32

12.2 Community Resources.......................................... 32

12.3 Trademarks........................................................... 32

12.4 Electrostatic Discharge Caution............................ 32

12.5 Glossary................................................................ 32

13 Mechanical, Packaging, and Orderable

Information ........................................................... 32

4 Revision History

NOTE: Page numbers for previous revisions may differ from page numbers in the current version.

Changes from Revision C (July 2011) to Revision D Page

• Added ESD Ratings table, Feature Description section, Device Functional Modes,Application and Implementation

section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and

Mechanical, Packaging, and Orderable Information section.................................................................................................. 1

• Moved AVDD and DVDD rows to Recommended Operating Conditions table...................................................................... 6

• Moved Dynamic Characteristics rows to Recommended Operating Conditions table .......................................................... 6

• Deleted Voltage row from Electrical Characteristics table ..................................................................................................... 6

• Changed 1.65 mA to 825 µA in Voltage Reference section................................................................................................. 16

• Changed 680 µA to 340 µA in Voltage Reference section................................................................................................... 16

• Changed 64 to 128 in the formula in Reading the Measurement section............................................................................ 27

• Changed high-impedance to low-impedance in Shielding Analog Signal Paths section ..................................................... 30

Changes from Revision B (January, 2011) to Revision C Page

• Updated NOISE vs CSENSOR table; revised values for Range 0 performance in fC and Electrons ........................................ 7

Changes from Revision A (January, 2011) to Revision B Page

• Changed second paragraph of Basic Integration Cycle section to correct CONV timing description error......................... 13

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5 Device Comparison Table

PRODUCT NO. OF CHANNELS FULL-SCALE MAXIMUM

DATA RATE POWER/CHANNEL

AT MAX DATA RATE PACKAGE-PIN

DDC112 2 1000 pC 2 KSPS 80 mW SO-28, TQFP-32

DDC112K 2 1000 pC 3 KSPS 85 mW SO-28, TQFP-32

DDC114 4 350 pC 3.1 KSPS 18 mW QFN-48

DDC118 8 350 pC 3.1 KSPS 18 mW QFN-48

DDC316 16 12 pC 100 KSPS 28 mW BGA-64

DDC232C 32 350 pC 3.1 KSPS 7 mW BGA-64

DDC232CK 32 350 pC 6.2 KSPS 10 mW BGA-64

DDC264C 64 150 pC 3.1 KSPS 3 mW BGA-100

DDC264CK 64 150 pC 6.2 KSPS 5.5 mW BGA-100

DDC1128 128 150 pC 6.2 KSPS 5.5 mW BGA-192

DD2256A 256 150 pC 17 KSPS 2.2 mW BGA-323

l TEXAS INSTRUMENTS

Columns

F D BGH E C A

IN48 IN20 IN25IN12IN41 IN19 IN23 IN26

IN15 IN53 IN60IN44IN9 IN50 IN56 IN59

IN47 IN21 IN27IN11IN42 IN18 IN28 IN32

IN14 IN54 IN62IN43IN10 IN52 IN61 IN63

IN46 IN22 IN30IN13IN36 IN17 IN29 IN31

AGND VREF AGNDAVDDAGND VREF AGND AGND

IN16 IN51 IN57IN45IN8 IN49 IN55 IN58

Rows

AGND AGND IN24QGNDQGND

IN7

IN38

IN6IN37

IN5IN3

IN35IN34

IN4IN33

AGNDAGND

IN40IN39

IN2IN1 AGND AGND IN64

CLK DVDD DINDVALIDDGND DVDD DCLK DOUT

AVDD DGND DIN_CFG

AVDDAVDD

DGNDCONV

AVDDAVDD DGND RST CLK_CFG

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6 Pin Configuration and Functions

ZAW Package

100-Pin NFBGA

Top View

Pin Functions

PIN I/O DESCRIPTION

NAME NO.

AGND A8, B8, C7, C8, D7, E7, F7, F8, H8, J8. K8 Analog Analog ground

AVDD F9, G8, G9, H9, J9, K9 Analog Analog power supply, 5-V nominal

CLK F10 Digital input Master clock input

CLK_CFG A9 Digital input Configuration register clock input

CONV K10 Digital input Conversion control input: 0 = integrate on side B; 1 = integrate on side A

DCLK C10 Digital input Serial data clock input

DGND D9, E9, H10, J10 Digital Digital ground

DIN B10 Digital input Serial data input

DIN_CFG B9 Digital input Configuration register data input

DOUT A10 Digital output Serial data output

DVALID G10 Digital output Data valid output, active low

DVDD D10, E10 Digital Digital power supply, 3.3-V nominal

IN1-IN64 Rows 1-6, A7, B7, J7, K7 Analog input Analog inputs for channels 1 to 64

QGND G7, H7 Analog Quiet analog ground; see the guidelines described in Layout

RESET C9 Digital input Digital reset, active low

VREF D8, E8 Analog input External voltage reference input, 4.096-V nominal

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(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

7 Specifications

7.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted) (1)

MIN MAX UNIT

AVDD to AGND –0.3 6 V

DVDD to DGND –0.3 3.6 V

AGND to DGND ±0.2 V

VREF input to AGND 2 AVDD + 0.3 V

Analog input to AGND –0.3 0.7 V

Digital input voltage to DGND –0.3 0.3 V

Digital output voltage to DGND –0.3 0.3 V

Operating temperature 0 70 °C

Junction temperature, TJ150 °C

Storage temperature, Tstg –60 150 °C

(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.

7.2 ESD Ratings

VALUE UNIT

V(ESD) Electrostatic

discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1) ±4000 V

Charged device model (CDM), per JEDEC specification JESD22-C101, all pins(2) ±1000

7.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN NOM MAX UNIT

VREF Reference voltage 4 4.096 4.2 V

POWER-SUPPLY REQUIREMENTS

Analog power supply voltage (AVDD) DDC264C 4.75 5 5.25 V

DDC264CK 4.9 5 5.1

Digital power supply voltage (DVDD) 2.7 3.3 3.6 V

DYNAMIC CHARACTERISTICS

Data rate DDC264C 3 3.125 kSPS

DDC264CK 6 6.25

tINT Integration time DDC264C 320 333 1,000,000 µs

DDC264CK 160 166 1,000,000

System clock

Clkdiv = 0 DDC264C 1 5 MHz

DDC264CK 1 10

Clkdiv = 1 DDC264C 4 20 MHz

DDC264CK 4 40

Data clock (DCLK) 32 MHz

Configuration clock (CLK_CFG) 20 MHz

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(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

7.4 Thermal Information

THERMAL METRIC(1)

DDC264C,

DDC264CK UNIT

ZAW (NFBGA)

100 PINS

RθJA Junction-to-ambient thermal resistance 25.7 °C/W

RθJC(top) Junction-to-case (top) thermal resistance 9.8 °C/W

RθJB Junction-to-board thermal resistance 7.1 °C/W

ψJT Junction-to-top characterization parameter 0.1 °C/W

ψJB Junction-to-board characterization parameter 7 °C/W

RθJC(bot) Junction-to-case (bottom) thermal resistance — °C/W

(1) Input is less than 1% of full-scale.

(2) CSENSOR is the capacitance seen at the DDC264 inputs from wiring, photodiode, etc.

(3) FSR is full-scale range.

(4) A best-fit line is used in measuring nonlinearity.

(5) Matching between side A and side B of the same input.

(6) Voltage produced by the DDC264 at its input that is applied to the sensor.

(7) Ensured by design; not production tested.

(8) Range drift does not include external reference drift.

(9) Input reference current decreases with increasing tINT (see Voltage Reference).

7.5 Electrical Characteristics

at TA= 25°C, AVDD = 5 V, DVDD = 3 V, VREF = 4.096 V, tINT = 333 µs for DDC264C or 166 µs for DDC264CK,

and range = 3 (150 pC) (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

ANALOG INPUT

Range 0 10.5 12.5 14.5 pC

Range 1 47.5 50 52.5 pC

Range 2 95 100 105 pC

Range 3 142.5 150 157.5 pC

Negative full-scale range –0.4% of Positive full-scale range pC

ACCURACY

Noise, low-level input(1) Range = 3, CSENSOR(2) = 35 pF 6.3 ppm of FSR(3), rms

Integral linearity error(4)

±0.025%

Reading

±1-ppm

FSR

±0.05%

Reading

±1.5-ppm

FSR

Resolution No missing codes, format = 1 20 Bits

No missing codes, format = 0 16

Input bias current TA= 25°C to 45°C ±0.5 ±5 pA

Range error match(5) 0.1% 0.5% FSR

Range sensitivity to VREF VREF = 4.096 ±0.1 V 1:1

Offset error ±500 ±1000 ppm of FSR

Offset error match(5) ±150 ppm of FSR

DC bias voltage(6) Low-level input (< 1% FSR) ±0.1 ±1 mV

Power-supply rejection ratio At DC 100 ±300 ppm of FSR/V

PERFORMANCE OVER TEMPERATURE

Offset drift ±0.5 5(7) ppm of FSR/°C

Offset drift stability ±0.2 2(7) ppm of FSR/minute

DC bias voltage drift(6) ±3 μV/°C

Input bias current drift TA= 25°C to 45°C 0.01 1(7) pA/°C

Range drift(8) 25 50 ppm/°C

Range drift match(5) ±5 ppm/°C

REFERENCE

Input current(9) Average value with tINT = 333 µs 825 μA

Average value with tINT = 166 µs (DDC264CK) 1650 μA

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Electrical Characteristics (continued)

at TA= 25°C, AVDD = 5 V, DVDD = 3 V, VREF = 4.096 V, tINT = 333 µs for DDC264C or 166 µs for DDC264CK,

and range = 3 (150 pC) (unless otherwise noted)

PARAMETER TEST CONDITIONS MIN TYP MAX UNIT

(10) Data format is straight binary with a small offset. The number of bits in the output word is controlled by the format bit.

DIGITAL INPUT AND OUTPUT

VIH 0.8 × DVDD DVDD + 0.1 V

VIL –0.1 0.2 × DVDD V

VOH IOH = –500 µA DVDD – 0.4 V

VOL IOL = 500 µA 0.4 V

IIN Input current 0 < VIN < DVDD ±10 µA

Data format(10) Straight binary

POWER-SUPPLY REQUIREMENTS

Analog current DDC264C 34 mA

DDC264CK 60

Digital current DDC264C 7.5 mA

DDC264CK 15

Total power dissipation DDC264C 192 256 mW

DDC264CK 350

Per channel power dissipation DDC264C 3 4 mW/Channel

DDC264CK 5.5

(1) Noise in Table 1 is expressed in three different units for reader convenience. The first section lists noise in units of parts per million of

full-scale range; the second section shows noise as an equivalent input charge (in fC); and the third section converts noise to electrons.

Table 1. NOISE vs CSENSOR(1)

RANGE CSENSOR

0 pF 10 pF 30 pF 43 pF 57 pF 100 pF 270 pF 470 pF 1000 pF

ppm of FSR, rms

Range 0: 12.5 pC 16 20 30 37 44 71 160 270 510

Range 1: 50 pC 6.4 7.4 10 12 14 21 45 74 130

Range 2: 100 pC 5.1 5.5 7.1 8 9.1 12 25 39 71

Range 3: 150 pC 4.8 5 6 6.5 7.2 9.6 17 27 49

fC, rms

Range 0: 12.5 pC 0.2 0.25 0.38 0.46 0.55 0.89 2 3.38 6.38

Range 1: 50 pC 0.32 0.37 0.53 0.62 0.73 1.09 2.29 3.73 6.88

Range 2: 100 pC 0.51 0.55 0.71 0.8 0.91 1.28 2.5 3.97 7.16

Range 3: 150 pC 0.72 0.75 0.9 0.98 1.08 1.45 2.67 4.14 7.36

Electrons, rms

Range 0: 12.5 pC 1250 1560 2340 2890 3430 5540 12480 21070 39790

Range 1: 50 pC 2010 2310 3340 3910 4570 6800 14200 23300 42900

Range 2: 100 pC 3220 3440 4450 5000 5680 7990 15600 24800 44700

Range 3: 150 pC 4530 4730 5610 6120 6770 9050 16700 25800 45900

l TEXAS INSTRUMENTS

Integral Nonlinearity (ppm of Full-Scale)

0100k 200k 300k 400k 500k 600k 700k 800k 900k 1M

Input (ppm of Full-Scale)

DDC264C, 3kSPS

Range 3

+45 C°

+25 C°

-5 C°

+60 C°

+75 C°

125

100

125

Integral Nonlinearity (ppm of Full-Scale)

0100k 200k 300k 400k 500k 600k 700k 800k 900k 1M

Input (ppm of Full-Scale)

+45 C°

+25 C° -5 C°

+75 C°

+60 C°

DDC264CK, 6kSPS

Range 3

Integral Nonlinearity (ppm of Full-Scale)

0100k 200k 300k 400k 500k 600k 700k 800k 900k 1M

Input (ppm of Full-Scale)

DDC264C, 3kSPS

Range 3, +25 C°

Average

125

100

125

Integral Nonlinearity (ppm of Full-Scale)

0100k 200k 300k 400k 500k 600k 700k 800k 900k 1M

Input (ppm of Full-Scale)

DDC264CK, 6kSPS

Range 3, +25 C°

Average

Integral Nonlinearity (ppm of Full-Scale)

0100k 200k 300k 400k 500k 600k 700k 800k 900k 1M

Input (ppm of Full-Scale)

Range 0

DDC264C, 3kSPS

Range 3

Range 2

Range 1

125

100

125

Integral Nonlinearity (ppm of Full-Scale)

0100k 200k 300k 400k 500k 600k 700k 800k 900k 1M

Input (ppm of Full-Scale)

Range 0

DDC264CK, 6kSPS

Range 3

Range 2

Range 1

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7.6 Typical Characteristics

at TA= 25°C (unless otherwise noted)

Figure 1. Integral Nonlinearity Figure 2. Integral Nonlinearity

Figure 3. Integral Nonlinearity Envelope of All 64 Channels Figure 4. Integral Nonlinearity Envelope of All 64 Channels

Figure 5. Integral Nonlinearity vs Temperature Figure 6. Integral Nonlinearity vs Temperature

l TEXAS INSTRUMENTS

% of Occurrences

-0.6

-0.45

-0.3

-0.15

0.15

0.3

0.45

0.6

Offset Drift (ppm of FSR/min)

Repeated measurement

of offset drift taken over

a 1-min interval

DDC264C, 3kSPS

DC264CK, 6kSPS

Range 3

250

200

150

100

150

200

250

Offset Drift (ppm of FSR)

25 30 35 40 45 50 55 60 65 70

Temperature ( C)°

DDC264C, 3kSPS

DC264CK, 6kSPS

Ranges 1, 2, 3

Noise (ppm of Full-Scale, RMS)

0 10 20 30 40 50 60 70

Temperature ( C)°

C = 35pF

SENSOR

Range 0

Range 3

Range 2

Range 1

0.1

0.01

Bias Current (pA)

0 10 20 30 40 50 60 70

Temperature ( C)°

DDC264C, 3kSPS

DDC264CK, 6kSPS

Ranges 1, 2, 3

Noise (ppm of Full-Scale, RMS)

Integration Time (ms)

0.1 1001 10

DDC264C, 3kSPS

DDC264CK, 6kSPS

C = 35pF

Range 3

SENSOR

Noise (ppm of Full-Scale, RMS)

Percentage of Input (%)

DDC264C, 3kSPS

DDC264CK, 6kSPS

C = 35pF

SENSOR

0 20 40 60 80 100

Range 1

Range 2

Range 3

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Typical Characteristics (continued)

at TA= 25°C (unless otherwise noted)

Figure 7. NOISE vs Integration Time Figure 8. NOISE vs Input Level

Figure 9. NOISE vs Temperature Figure 10. Input BIAS Current vs Temperature

Figure 11. Offset Drift vs Temperature Figure 12. Offset Drift Stability Over Time Histogram

l TEXAS INSTRUMENTS SENSOR

600

550

500

450

400

350

300

250

200

150

100

Noise (ppm of FSR, rms)

0 100 200 300 400 500 600 700 800 900 1000

C (pF)

SENSOR

Range 0

Range 1

Range 2

Range 3

DDC264C, 3kSPS

DDC264CK, 6kSPS

2.5

1.5

0.5

DC Bias Voltage (mV)

0 10 20 30 40 50 60 70 80 90 100

Percentage of Input (%)

Range 0

Range 3

Range 2

Range 1

DDC264C

3kSPS

3.5

2.5

1.5

0.5

DC Bias Voltage (mV)

0 10 20 30 40 50 60 70 80 90 100

Percentage of Input (%)

Range 0

Range 3

Range 2

Range 1

DDC264CK

6kSPS

Current (mA)

0 10 20 30 40 50 60 70

Temperature ( C)°

DDC264CK

6kSPS

DDC264C

3kSPS

Current (mA)

0 10 20 30 40 50 60 70

Temperature ( C)°

DDC264CK

6kSPS

DDC264C

3kSPS

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Typical Characteristics (continued)

at TA= 25°C (unless otherwise noted)

Figure 13. Analog Supply Current vs Temperature Figure 14. Digital Supply Current vs Temperature

Figure 15. DC BIAS Voltage vs Input Percentage Figure 16. DC BIAS Voltage vs Input Percentage

Figure 17. NOISE vs CSENSOR

l TEXAS INSTRUMENTS

To ADC

IN1

Input

Current

Side A Integrator

Photodiode

Side B Integrator

QGND

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8 Detailed Description

8.1 Overview

The DDC264 contains 64 identical input channels (see Functional Block Diagram) that perform the function of

current-to-voltage integration followed by a multiplexed A/D conversion. Each input has two integrators (see

Figure 18) so that the current-to-voltage integration can be continuous in time. The DDC264 continuously

integrates the input signal by switching integrations between side A and side B.

For example, while side A integrates the input signal, the side B outputs are digitized by the onboard ADC. This

integration and A/D conversion process is controlled by the convert pin, CONV. The results from side A and side

B of each signal input are stored in a serial output shift register. The DVALID output goes low when the shift

Figure 18. Dual Switched Integrator Architecture

Figure 19 shows a few integration cycles beginning after the device has been powered up, reset, and the

Configuration Register has been programmed. The top signal is CONV and is supplied by the user. The

integration status trace indicates which side is integrating. The output digital interface of the DDC264 sends the

digital results through a synchronous serial interface that consists of a data clock (DCLK), a valid data pin

(DVALID), a serial data output pin (DOUT), and a serial data input pin (DIN). As described above, DVALID goes

active low when data are ready to be retrieved from the DDC264. It stays low until DCLK is taken high and then

back low by the user. The text below the DVALID pulse indicates the side of the data available to be read. The

arrow is used to match the data to the corresponding integration. Table 2 shows the timing specifications for

Figure 19.

l TEXAS INSTRUMENTS

Integrate AIntegrate B Integrate B Integrate A

CONV

Integration

Status

DVALID

Side B

Data

Side A

Data

Side B

Data

Input current

tDR

tINT

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Overview (continued)

(1) Internal clock frequency = 5 MHz

(2) Internal clock frequency = 10 MHz

Figure 19. Integration Sequence Timing

Table 2. Timing Requirements for Integration Sequence Timing

MIN TYP MAX UNIT

tINT Integration time DDC264C(1) 320 1,000,000 µs

DDC264CK(2) 160

tDR Time until data ready DDC264C(1) 276.4 ±0.4 µs

DDC264CK(2) 138.2 ±0.2

»»»»»»»»»»

Serial

Interface

Configuration

and

Control

AVDD

VREF DVDD

0.3 F

0.1 F

CLK

CONV

DIN_CFG

CLK_CFG

IN1

IN2

RESET

IN3

DVALID

IN4

DCLK

IN61

AGND DGND

0.2 F

ADC

IN62

IN63

IN64

Dual

Switched

Integrator

DOUT

DIN

Dual

Switched

Integrator

Dual

Switched

Integrator

Dual

Switched

Integrator

Dual

Switched

Integrator

Dual

Switched

Integrator

Dual

Switched

Integrator

Dual

Switched

Integrator

ADC

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Finally, a second set of digital signals (DIN_CFG and CLK_CFG pins, see Configuration Register — Read and

Write Operations) is used to configure the DDC264 by addressing a dedicated register.

8.2 Functional Block Diagram

8.3 Feature Description

8.3.1 Dual Switched Integrator: Basic Integration Cycle

The topology of the front end of the DDC264 is an analog integrator as shown in Figure 20. In this diagram, only

input IN1 is shown. The input stage consists of an operational amplifier, a selectable feedback capacitor network

(CF), and several switches that implement the integration cycle. The timing relationships of all of the switches

shown in Figure 20 are illustrated in Figure 21.Figure 21 conceptualizes the operation of the integrator input

stage of the DDC264 and must not be used as an exact timing tool for design.

‘5‘ TEXAS INSTRUMENTS

12.5pF

25pF

VREF

Range[0] Bit

Range[1] Bit

SRESET

SREF2 SADC1A

SINTA

SREF1

IN1

ESD

Protection

Diodes

Input

Current

Integrator A

Integrator B

Photodiode

3pF

To Converter

SINTB QGND

Range Selection Capacitors (C )

DDC264

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Feature Description (continued)

See Figure 22 for the block diagrams of the reset, integrate, wait, and convert states of the integrator section of

the DDC264. This internal switching network is controlled externally with the convert pin (CONV) and the system

clock (CLK). For the best noise performance, CONV must be synchronized with the falling edge of CLK. TI

recommends toggling CONV within ±10 ns of the falling edge of CLK.

The noninverting inputs of the integrators are connected to the QGND pin. Consequently, the DDC264 analog

ground, QGND, must be as clean as possible. In Figure 20, the feedback capacitors (CF) are shown in parallel

between the inverting input and output of the operational amplifier. At the beginning of a conversion, the switches

SA/D, SINTA, SINTB, SREF1, SREF2, and SRESET are set (see Figure 21).

At the completion of an A/D conversion, the charge on the integration capacitor (CF) is reset with SREF1 and

SRESET (see Figure 21 and Figure 22a). This process is done during reset. In this manner, the selected capacitor

is charged to the reference voltage, VREF. Once the integration capacitor is charged, SREF1 and SRESET are

switched so that VREF is no longer connected to the amplifier circuit while it waits to begin integrating (see

Figure 22b). With the rising edge of CONV, SINTA closes, which begins the integration of side A. This process

puts the integrator stage into its integrate mode (see Figure 22c).

Charge from the input signal is collected on the integration capacitor, causing the voltage output of the amplifier

to decrease. The falling edge of CONV stops the integration by switching the input signal from side A to side B

(SINTA and SINTB). Prior to the falling edge of CONV, the signal on side B was converted by the A/D converter and

reset during the time that side A was integrating. With the falling edge of CONV, side B starts integrating the

input signal. At this point, the output voltage of the side A operational amplifier is presented to the input of the

A/D converter (see Figure 22d).

A special elecrostatic discharge (ESD) structure protects the inputs but does not increase current leakage on the

input pins.

Figure 20. Basic Integration Configuration

l TEXAS INSTRUMENTS

To C onverter

SR E S E T

SR E F 2

SA/D

VR E F

SR E F 1

SINT

To Converter

SR E S E T

SR E F 2

SA/D

VR E F

SR E F 1

SINT

a) Reset/Auto Zero Configuration

c) Integrate Configuration

To C onverter

SR E S E T

SR E F 2

SA/D

VR E F

SR E F 1

SINT

To C onverter

SR E S E T

SR E F2

SA/D

VR E F

SR E F 1

SINT

d) Convert Configuration

b) Wait Configuration

CONV

CLK

SINTA

SINTB

SREF1

SREF2

SRESET

SA/D1A

Configuration of

Integrator A

VREF

Integrator A

Voltage Output

Convert Convert

Wait Wait

Integrate

Reset

Wait

DVALID

DDC264

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Feature Description (continued)

Figure 21. Integration Timing (see Figure 20)

Figure 22. Four Configurations of the Front-End Integrators

l TEXAS INSTRUMENTS

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Feature Description (continued)

8.3.2 Integration Capacitors

There are four different capacitor configurations available on-chip for both sides of every channel in the DDC264.

These internal capacitors are trimmed in production to achieve the specified performance for range error of the

DDC264. The range control bits (Range[1:0]) set the capacitor value for all integrators. Consequently, all inputs

and both sides of each input always have the same full-scale range. Table 3 shows the capacitor value selected

for each range selection.

Table 3. Range Selection

RANGE RANGE CONTROL BITS CFINPUT RANGE

Range[1] Range[0]

0 0 0 3 pF –0.04 to 12.5 pC

1 0 1 12.5 pF –0.2 to 50 pC

2 1 0 25 pF –0.4 to 100 pC

3 1 1 37.5 pF –0.6 to 150 pC

8.3.3 Voltage Reference

The external voltage reference is used to reset the integration capacitors before an integration cycle begins. It is

also used by the A/D converter while the converter is measuring the voltage stored on the integrators after an

integration cycle ends. During this sampling, the external reference must supply the charge required by the A/D

converter. For an integration time of 333 µs, this charge translates to an average VREF current of approximately

825 µA. The amount of charge required by the A/D converter is independent of the integration time; therefore,

increasing the integration time lowers the average current. For example, an integration time of 800 µs lowers the

average VREF current to 340 µA.

8.3.4 Serial Data Output and Control Interface

8.3.4.1 System and Data Clocks (CLK and DCLK)

The device internal clock is derived directly or after a divide by 4 from the CLK input (see Bit[13] in the

configuration register). TI recommends driving the CLK pin with a free-running clock source (that is, do not start

and stop CLK between conversions). Make sure the clock signals are clean—avoid overshoot or ringing.

As explained in Overview, DCLK is used to read out the data (more details in the following sections). For best

performance, generate CLK and DCLK clocks from the same clock source. Disable DCLK by taking it low after

the data have been shifted out and while CONV is transitioning.

When using multiple DDC264 devices, pay close attention to the DCLK distribution on the printed-circuit board

(PCB). In particular, make sure to minimize skew in the DCLK signal because this can lead to timing violations in

the serial interface specifications. See Cascading Multiple Converters for more details.

8.3.4.2 CONV: Setting the Integration Time

As explained in Overview, one integration cycle happens between two consecutive CONV signal edges. For the

best noise performance, CONV must be synchronized with the falling edge of CLK. TI recommends toggling

CONV within ±10 ns of the falling edge of CLK.

The minimum tINT for the DDC264 scales directly with the internal clock frequency. With an internal clock

frequency of 10 MHz, the minimum time is 160 μs, which is achieved with the right register settings (see

Configuration Register — Read and Write Operations for more details). If the minimum integration time is

violated, the DDC264 stops continuously integrating the input signal. To return to normal operation (that is,

continuous integration) after a violation of the minimum tINT specification, perform three integrations that each

last for a minimum of 5000 internal clock periods. In other words, integrate three times with each integration

lasting for at least 1 ms when using an internal clock frequency of 5 MHz. During this time, ignore the DVALID

pin. Once the three integrations complete, normal continuous operation resumes, and data can be retrieved.

f ’ﬂgqmmmm:ﬂ * ooooooooo

CLK

DVALID

tPDCDV

tPDDCDV

tHDDODC

tHDDODV

tPDDCDO

DCLK

DOUT Input 64

MSB

Input 64

MSB

Input 64

LSB

Input 63

LSB

Input 5

LSB

Input 4

MSB

Input 2

LSB

Input 1

MSB

Input 1

LSB

DDC264

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(1) Excludes the effects of noise, INL, offset, and gain errors.

8.3.4.3 Data Valid (DVALID)

The DVALID signal indicates that data are ready to be read. Data retrieval may begin after DVALID goes low.

This signal is generated using an internal clock divided down from the system clock, CLK. The phase relationship

between this internal clock and CLK is set when power is first applied and is random. Because the user must

synchronize CONV with CLK, the DVALID signal has a random phase relationship with CONV. This uncertainty

is ±1/fCLK. Polling DVALID eliminates any concern about this relationship. If the data readback is timed from

CONV, make sure to wait for the required amount of time. The data stored internally is lost if not read before the

next DVALID.

8.3.4.4 Data Format

The serial output data are provided in an offset binary code as shown in Table 4. The format bit in the

configuration register selects how many bits are used in the output word. When format = 1, 20 bits are used.

When format = 0, the lower four bits are truncated so that only 16 bits are used. Note that the LSB size is 16

times bigger when format = 0. An offset is included in the output to allow slightly negative inputs (for example,

from board leakages) from clipping the reading. This offset is approximately 0.4% of the positive full-scale.

Table 4. Ideal Output Code vs Input Signal(1)

INPUT SIGNAL IDEAL OUTPUT CODE FORMAT = 1 IDEAL OUTPUT CODE FORMAT = 0

≥100% FS 1111 1111 1111 1111 1111 1111 1111 1111 1111

0.001531% FS 0000 0001 0000 0001 0000 0000 0001 0000 0001

0.001436% FS 0000 0001 0000 0000 1111 0000 0001 0000 0000

0.000191% FS 0000 0001 0000 0000 0010 0000 0001 0000 0000

0.000096% FS 0000 0001 0000 0000 0001 0000 0001 0000 0000

0% FS 0000 0001 0000 0000 0000 0000 0001 0000 0000

–0.3955% FS 0000 0000 0000 0000 0000 0000 0000 0000 0000

8.3.4.5 Data Retrieval

The data from the last conversion are available for retrieval on the falling edge of DVALID (see Figure 23 and

Table 5). Data are shifted out on the falling edge of the data clock, DCLK.

Make sure not to retrieve data around changes in CONV because this change can introduce noise. Stop activity

on DCLK at least 2 µs before or after a CONV transition.

Setting the format bit = 0 (16-bit output word) reduces the time required to retrieve data by 20% because there

are fewer bits to shift out. This technique can be useful in multichannel systems requiring only 16 bits of

resolution.

Figure 23. Digital Interface Timing Diagram for Data Retrieval From a Single DDC264

‘5‘ TEXAS INSTRUMENTS mu ccccc XXXXXjXXVCXMXI XLDXXXCMXCMUXZX

DVALID

DCLK

DIN

tSTDIDC tHDDIDC

DOUT

Input

256

MSB

Input

256

MSB

Input

256

LSB

Input

255

MSB

Input 3

LSB

Input 2

MSB

Input 2

LSB

Input 1

MSB

Input 1

LSB

IN64

256

192

128

Sensor

DIN

DOUT DDC264

Data

Retrieval

Output

Data Clock

DIN

DOUT DDC264 DIN

DOUT DDC264

DVALID

DCLK

DVALID

DCLK

DVALID

DCLK

DVALID

DCLK

IN63

255

IN62

254

IN61

253

IN4

196

IN3

195

IN2

194

IN1

193

IN1

129

IN1

IN2

130

IN2

IN3

131

IN3

IN4

132

IN4

IN61

189

IN61

125

IN61

IN62

190

IN62

126

IN62

IN63

191

IN63

127

IN63

DDC264

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Table 5. Timing for DDC264 Data Retrieval

MIN TYP MAX UNIT

tPDCDV Propagation delay from falling edge of CLK to DVALID Low 10 ns

tPDDCDV Propagation delay from falling edge of DCLK to DVALID High 5 ns

tHDDODV Hold time that DOUT is valid before the falling edge of DVALID 400 ns

tHDDODC Hold time that DOUT is valid after falling edge of DCLK 4 ns

tPDDCDO Propagation delay from falling edge of DCLK to valid DOUT 25 ns

8.3.4.5.1 Cascading Multiple Converters

Multiple DDC264 devices can be connected in a serial configuration; see Figure 24.

DOUT can be used with DIN to daisy-chain multiple DDC264 devices together to minimize wiring. In this mode of

operation, the serial data output is shifted through multiple DDC264s; see Figure 24.

Figure 25 shows the timing diagram when the DIN input is used to daisy-chain several devices. Table 6 gives the

timing specification for data retrieval using DIN.

Figure 24. Daisy-Chained DDC264s

(1) See Cascading Multiple Converters.

Figure 25. Timing Diagram When Using DDC264 DIN Function

Table 6. Timing for DDC264 Data Retrieval Using DIN

MIN TYP MAX UNIT

tSTDIDC Setup time from DIN to falling edge of DCLK 10 ns

tHDDIDC Hold time for DIN after falling edge of DCLK 10 ns

l TEXAS INSTRUMENTS TDCLK ¥—l— — R444 , ‘ U FLI'LHI FLFLIUWW XXXXW X)O0HOOO( ‘DcLK

274 sm

(20 64)´ tDCLK

¼¼

Side B

Data

Side A

Data

tINT tINT

tDR

tSDCV

CONV

DVALID

DCLK

DOUT

1000 s 278.4 s- mm

(1280)(50ns) = 11.5 11 DDC264s®

t (t + t )

INT DR

-SDCV

(20 64)´ tDCLK

DDC264

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8.3.4.5.2 Retrieval Before CONV Toggles

In this method, data retrieval begins soon after DVALID goes low and finishes before CONV toggles, as shown in

Figure 26. For best performance, data retrieval must stop tSDCV before CONV toggles. This method is most

appropriate for longer integration times and yields the best performance results as the output interface toggling

noise does not interfere with the ADC conversion operation. The maximum time available for readback is

tINT – tCMDR – tSDCV. The maximum number of DDC264s that can be daisy-chained together (format = 1) is

calculated by Equation 1.

Note: (16 × 64)τDCLK is used for format = 0, where τDCLK is the period of the data clock (1)

For example, if tINT = 1000 µs and DCLK = 20 MHz, the maximum number of DDC264s with format = 1 is shown

in Equation 2.

or 14 DDC264s for format = 0 (2)

Figure 26. Readback Before CONV Toggles

Table 7. Timing for Readback

MIN TYP MAX UNIT

tSDCV Data retrieval shutdown before or after edge of CONV 2 µs

8.3.4.5.3 Retrieval After CONV Toggles

For shorter integration times, more time is available if data retrieval begins after CONV toggles and ends before

the new data are ready. Data retrieval must wait tSDCV after CONV toggles before beginning. See Figure 27 for

an example of this timing sequence. The maximum time available for retrieval is tDR – (tSDCV + tHDDODV),

regardless of tINT. The maximum number of DDC264s that can be daisy-chained together with format = 1 is

calculated by Equation 3.

Note: (16 × 64)τDCLK is for format = 0 (3)

For DCLK = 20 MHz, the maximum number of DDC264s is four (or five for format = 0).

l TEXAS INSTRUMENTS TTTTT

¼ ¼ ¼ ¼ ¼ ¼

DCLK

DVALID

CONV

DOUT

Side B

Data

Side A

Data

tINT

tSDCV

tSDCV tHDDODV

tINT tINT

t (t +t +t )-

INT SDCV SDCV HDDODV

(20 64)´ tDCLK

tINT

tDR

tSDCV

tINT tINT

¼ ¼ ¼

Side A

Data

Side B

Data

Side A

Data

CONV

DVALID

DCLK

DOUT

tHDDODV

DDC264

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Figure 27. Readback After CONV Toggles

8.3.4.5.4 Retrieval Before and After CONV Toggles

For the absolute maximum time for data retrieval, data can be retrieved before and after CONV toggles. Nearly

all of tINT is available for data retrieval. Figure 28 illustrates how this process is done by combining the two

previous methods. Pause the retrieval during CONV toggling to prevent digital noise, as discussed previously,

and finish before the next data are ready. The maximum number of DDC264s that can be daisy-chained together

with format = 1 is calculated by Equation 4.

Note: (16 × 64)τDCLK is used for format = 0 (4)

For tINT = 400 µs and DCLK = 20 MHz, the maximum number of DDC264s is six (or seven for format = 0).

Figure 28. Readback Before and After CONV Toggles

8.4 Device Functional Modes

There are no functional modes for this device.

l TEXAS INSTRUMENTS

RESET tRST

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8.5 Programming

8.5.1 Reset (RESET)

The DDC264 is reset asynchronously by taking the RESET input low, as shown in Figure 29. Make sure the

release pulse is a minimum of tRST wide. It is very important that RESET is glitch-free to avoid unintentional

resets. The Configuration Register must be programmed immediately afterwards. After programming the

DDC264, wait at least four conversions before using the data.

Figure 29. Reset Timing

8.5.2 Configuration Register — Read and Write Operations

The Configuration Register must be programmed after power-up or a device reset. The DIN_CFG, CLK_CFG,

and RESET pins are used to write to this register. When beginning a write operation, hold CONV low and strobe

RESET; see Figure 30. Then begin shifting in the configuration data on DIN_CFG. Data are written to the

Configuration Register most significant bit first. The data are internally latched on the falling edge of CLK_CFG.

Partial writes to the Configuration Register are not allowed, that is, make sure to send all 16 bits when updating

the register.

Optional readback of the Configuration Register is available immediately after the write sequence. During

readback, 320 '0's, then the 16-bit configuration data followed by a 4-bit revision ID and the check pattern are

shifted out on the DOUT pin on the rising edge of DCLK. The check pattern can be used to check or verify the

DOUT functionality.

NOTE

With format = 1, the check pattern is 300 bits, with only the last 72 bits non-zero. This

sequence of outputs is repeated twice for each DDC264 block and daisy-chaining is

supported in configuration readback. Table 9 shows the check pattern configuration during

readback. Table 8 shows the timing for the Configuration Register read and write

operations. Strobe CONV to begin normal operation, that is, CONV must not toggle during

the readback operation.

Table 8. Timing Requirements for the Configuration Register Read/Write

MIN TYP MAX UNIT

tWTRST Wait Required from Reset High to First Rising Edge of CLK_CFG 2 µs

tWTWR Wait Required from Last CLK_CFG of Write Operation to

First DCLK of Read Operation 2 µs

tSTCF Set-Up Time from DIN_CFG to Falling Edge of CLK_CFG 10 ns

tHDCF Hold Time for DIN_CFG After Falling Edge of CLK_CFG 10 ns

tRST Pulse Width for RESET Active 1 µs

Table 9. Check Pattern During Readback

FORMAT

BIT CHECK PATTERN

(Hex) TOTAL

READBACK BITS

0 180 0s, 30F066012480F6h 1024

1 228 0s, 30F066012480F69055h 1280

‘5‘ TEXAS INSTRUMENTS %_ _w Wmm ”i 3 Mm— —FU'LJU'LJU1J'LM_— '_|l

Configuration

Data

Write Configuration Register Data

Configuration Register Operations(1)

Check Pattern

Read Configuration Register

and Check Pattern

RESET

CLK_CFG

DIN_CFG

DCLK

DOUT

CONV

Normal Operation

tWTWR

tWTRST

MSB LSB

tSTCF

tRST

tHDCF

1 320(2)

320 0s(2)

DDC264

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CLK must be running during Configuration Register write and read operations.

In 16-bit mode (format = 0), only 256 0s are read before the Configuration Register write and read operations.

Figure 30. Configuration Register Write and Read Operations

l TEXAS INSTRUMENTS

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8.6 Register Maps

Configuration Register Bit Assignments

BIT 15 BIT 14 BIT 13 BIT 12 BIT 11 BIT 10 BIT 9 BIT 8

0 0 Clkdiv 0 0 Range[1] Range[0] Format

BIT 7 BIT 6 BIT 5 BIT 4 BIT 3 BIT 2 BIT 1 BIT 0

Version 0 0 Reserved 0 0 0 Test

Bits 15:14 These bits must always be set to 0.

Bit 13 Clkdiv

The Clkdiv input enables an internal divider on the system clock as shown in Table 10. When

Clkdiv = 1, the system clock is divided by 4. This configuration allows a system clock that is

faster by a factor of four, which in turn provides a finer quantization of the integration time,

because the CONV signal must be synchronized with the system clock for the best performance.

0 = Internal clock divider set to 1

1 = Internal clock divider set to 4

Table 10. Clkdiv Operation

Clkdiv BIT CLK DIVIDER VALUE CLK FREQUENCY INTERNAL CLOCK FREQUENCY

0 1 5 MHz 5 MHz

1 4 20 MHz 5 MHz

Bits 12:11 These bits must always be set to 0.

Bits 10:9 Range[1:0]

These bits set the full-scale range.

00 = Range 0

01 = Range 1 = 12.5 pC

= 50 pC 10 = Range 2

11 = Range 3 = 100 pC

= 150 pC

Bit 8 Format

Format selects how many bits are used in the data output word.

0 = 16-bit output

1 = 20-bit output

Bit 7 Version

This bit must be set to match the device being used.

Must be set to 0for DDC264C.

Must be set to 1for DDC264CK.

Bits 6:5 These bits must always be set to 0.

Bit 4 Reserved

This bit is reserved and must be set to 0.

Bits 3:1 These bits must always be set to 0.

Bit 0 Test

When Test Mode is used, the inputs (IN1 through IN64) are disconnected from the DDC264

integrators to enable the user to measure a zero input signal regardless of the current supplied

to the inputs.

0 = TEST mode off

1 = TEST mode on

l TEXAS INSTRUMENTS

Q = i(t) dt

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9 Application and Implementation

NOTE

Information in the following applications sections is not part of the TI component

specification, and TI does not warrant its accuracy or completeness. TI’s customers are

responsible for determining suitability of components for their purposes. Customers should

validate and test their design implementation to confirm system functionality.

9.1 Application Information

A typical application case of the DDC family of products, including the DDC264, is the measurement of currents

produced by photodiodes when excited by light, or the equivalent charge over a period of time (see Equation 5).

The DDC264 can measure 64 channels simultaneously. As explained in Functional Block Diagram, the

measurement is done by integrating the currents during a given time, set by the two consecutive edges of the

CONV signal, provided by the system, see Figure 19. The result of the integration is shown in Equation 5.

where

• tiand tfrepresent the instant where the integration starts and finishes, respectively

• i(t) the input current (which is a function of time)

• Q the reported result by the DDC (5)

All temporal information of i in that interval is lost and only an equivalent average i can be obtained.

The user must also provide a CLK signal used to run all the internal circuits, including the ADCs, which converts

the result of the integration and generate a DVALID pulse to indicate that the conversion is done. The controller,

then, can read that data, before it gets erased by the next conversion. The following sections explain the

necessary control signals to operate the device, and the choices that the circuit designer can make.

l TEXAS INSTRUMENTS mm Ayn.) LEM n 1» mm% . mm AVDDL K’ AVDD ﬁx ﬁx Mm) + mm mm —F7 F" AVDD m m Avnnl— . mm AVDI.)L H) AVDD Dm m hum mm mun —E'” E” mm m m wu— mm; ownL 5“ DGND nwum «.K on» :3 «.K m m m 7% m m. H, U m cm rm» to mum Dmfra —W cm rm 13 a; Msz may m mam" mm *W “2an mm mml r not 1 ﬂ Dom K4 \0 WW DN- 8H) ’ DIN" B“. DN m M (m , rm , u H mm mp m mm mm *W um w: m» m m ”K —W‘ (LK Nu nvAHnm “m nmmm nvAHnnz : W nvmm .mzs Down m, Dom; m. ”(WW m mm; mm “qu77 (an (0m 74. mm was m u ”“9 mm; DON!) mm. D’ "' \N4v m. A; M: Co w: m. v my W \m. vkrr p m w n, “N“ D4 F4 W“ E P , w mm AGND ,; m was mm H _ ,7 «my - W Am, F, $10M 1 W N Am M. «(.Nn M mm mm mm H mm “m” MVI) m “1“" AGND ' C8 AGND «(.Nn n W.) mm) ¢ mm Hg «.Nn AGND , M AGND mm; 7 4 m mom; mm \w: AGND AGND I + mu R 2 opmsn mm mm “mp W.) 3: (4 3: Own QGND QGND H ”WNW W :1“ UIXZMJ‘USI u utmvn AGND AGND am AGND vsm NOTE‘C101.CI03.C20I.CZOJARENOTPOPULATED : 1 =5- 7 5 am ulzmii Minimum AGND Copyugm © 21115, Texas \ns‘rumems Incmpcrzied

DDC264

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9.2 Typical Application

Figure 31. Typical Application Circuit

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Typical Application (continued)

9.2.1 Design Requirements

For the following example, assume the user wants to measure the current coming from 128 photodiodes every

500 µs, and the maximum current per photodiode is 250 nA.

9.2.2 Detailed Design Procedure

9.2.2.1 Input Connection

Figure 31 represents a top level schematic of a solution for this case. 2 DDC264 are used. Inputs are

represented on the top schematic by the two connectors on the left and right sides.

The photodiodes must be connected to the inputs in such a way that the current flows into the device. To

achieve that, usually the anode of the photodiode is connected to the input of the device (see Figure 20) and the

cathode to a node with the same or higher voltage, in such a way that the photodiode is reverse biased or not

biased at all. The application usually determines the choice. No bias minimizes dark current in the photodiode;

therefore, minimizing errors during the integration or measurement of small signal currents. Nevertheless, the

parasitic junction capacitance of the photodiode decreases with the reverse bias voltage. The lower the input

capacitance, the lower the input noise (see Table 1). As such, applying a reverse bias reduces the noise of the

measurement while increasing the dark current. The user must choose depending on their application. In

applications with small signal currents, usually no bias is applied. In that case, the cathodes can be connected to

AGND.

Notice that although only positive currents (in the direction towards the inside of the device) can be measured,

the device has around 0.4% margin towards the negative excursion. In this way, small offsets and negative

currents do not saturate the device in the bottom rail and can be detected and measured.

9.2.2.2 Selecting Integration Time, Device Clock, and Range

The second step is to select the right integration time. There may be system level constraints that set this. For

instance, to get at least a given number of readings per second. Going faster than that may not be helpful,

degrade performance and increase power unnecessarily. In this case, the user wants to, at least, get 2 KSPS

(integration time = 500 µs). With 500 µs, the maximum integrated charge would be 250 nA × 500 µs = 125 pC.

This is too much for Range 2 (100 pC full scale) but falls comfortably in Range 3 (150 pC). As such, the likely

preferred option is to use Range 3 by setting bits 9 and 10 to one. Another potential option is to run the device

slightly faster such that Range 2 can be used. In this case, 100 pC/250 nA = 400 µs, or 2.5 KSPS. Notice that

this frequency (the frequency at which input currents are sampled) is actually 2× the frequency of the CONV

signal. That is, 400 µs is half the period of the CONV signal, i.e. the time between two consecutive edges of the

CONV signal.

The user must check the specification and performance curves to see the differences between both ranges for

the specific conditions. Normally, performance may be close in both cases and operating the device slower may

give some extra advantage on power and help relax practical system constraints.

For this particular case, both choices can be supported with the lower speed version device (DDC264C version),

which supports up to 3 KSPS. As such, to benefit from this, the user must set bit 7 to zero. In this mode, the

maximum internal clock is 5 MHz, so the user can choose to drive the CLK pin of the device with a 5-MHz clock

maximum or with a 20-MHz clock maximum and the internal divide by 4 (setting register bit 13 to one).

Notice that using a slower external clock is also possible, but the ADC conversion lasts longer (see tDR in

Table 2). This affects the time left to capture data after DVALID and before CONV edge (see Reading the

Measurement)

9.2.2.3 Voltage Reference

It is critical that VREF be stable during the different modes of operation (see Figure 22). The A/D converter

measures the voltage on the integrator with respect to VREF. Because the integrator capacitors are initially reset

to VREF, any drop in VREF from the time the capacitors are reset to the time when the converter measures the

integrator output introduces an offset. It is also important that VREF be stable over longer periods of time because

changes in VREF correspond directly to changes in the full-scale range. Finally, VREF must introduce as little

additional noise as possible.

l TEXAS INSTRUMENTS éi Copyngm 201619an \nslrumems \ncarporakad

OPA350 To VREF Pin on

the DDC264

+5V

0.10 Fμ

0.47 Fμ

REF3040

1kΩ

0.7Ω

47 Fμ

100 Fμ (1)

0.7Ω

10 Fμ (1)

Near Each DDC

DDC264

www.ti.com

SBAS368D –MAY 2006–REVISED DECEMBER 2016

Product Folder Links: DDC264

Typical Application (continued)

For these reasons, it is strongly recommended that the external reference source be buffered with an operational

amplifier, as shown in Figure 32. In this circuit, the voltage reference is generated by a +4.096 V reference. A

low-pass filter to reduce noise connects the reference to an operational amplifier configured as a buffer. This

amplifier must have low noise and input/output common-mode ranges that support VREF. Even though the circuit

in Figure 32 might appear to be unstable because of the large output capacitors, it works well for the OPA350. TI

does not recommend a series resistor be placed at its output to improve stability, because this can cause a drop

in VREF which produces large offsets. 10 µF and 0.7 Ωare good initial values for the decoupling network close to

the DDC264, but may have to be optimized depending on its placement and board layout.

(1) Ceramic X5R capacitors are recommended.

Figure 32. Recommended External Voltage Reference Circuit for Best Low-Noise Operation

Figure 31 shows a portion of the driving circuit on the top part, driving one of the DDC264. This assumes that the

output of the reference IC is routed from somewhere else, due, for instance, to space limitations on the board.

Being the reference noise critical for the final performance of the system, TI recommends shielding and passing

the filter the signal low. The bottom of Figure 31 shows the second DDC264 where the reference is driven by the

same buffer as the first DDC and only a decoupling network is added close to the device. This is again assuming

space and cost limitations. Ideally the use of two different buffers, one close to each reference, isolates

interactions between both devices from being coupled through the reference line.

9.2.2.4 Reading the Measurement

As explained in Data Retrieval, the data can be read as soon as DVALID goes low. The user can choose to

monitor this signal or simply wait a period of time predicted by tDR in Table 2. For this example, assuming that a

CLK frequency of 5 MHz was selected, the data would be ready after approximately 276 µs. Staying with Range

3, the integration time is 500 µs and as such, after detecting DVALID, there is approximately 500 µs – 276 µs to

read the data. We assume 220 µs to avoid getting too close to the CONV edge. In 20 bit mode, reading two

DDC264, with daisy chain between DOUT and DIN, see Figure 31, would take 128 × 20 × (1/32 MHz) = 80 µs,

which fits in the interval between DVALID and next CONV edge. This minimizes noise due to the DCLK and

DOUT switching during the conversion of the ADC (which happens from CONV edge to /DVALID) and can help

improve the performance. In Figure 31, both converters are connected in daisy chain, which minimizes the

number of traces being routed back to the controller. One small drawback of this approach versus shifting the

data of both DDC264 in parallel (without the daisy chain) is that the outputs switch for longer time (2×),

increasing the total power by a small fraction (as the output switching power is only a small portion of the total

power consumption). Another solution is to transfer part or all the data during the ADC conversion (see Retrieval

Before and After CONV Toggles and Retrieval After CONV Toggles). A potential way to minimize this noise,

specially if the DOUT traces are long is to buffer them on board, close to the device.

l TEXAS INSTRUMENTS

−

0.1

tINT

100

tINT

Frequency

Gain (dB)

tINT tINT

DDC264

SBAS368D –MAY 2006–REVISED DECEMBER 2016

www.ti.com

Product Folder Links: DDC264

9.2.3 Application Curve

The frequency response of the DDC264 is set by the front-end integrators and is that of a traditional continuous

time integrator, as shown in Figure 33. By adjusting the integration time, tINT, the user can change the 3-dB

bandwidth and the location of the notches in the response. The frequency response of the A/D converter that

follows the front-end integrator is of no consequence because the converter samples a held signal from the

integrators. That is, the input to the A/D converter is always a DC signal. The output of the front-end integrators

are sampled; therefore, aliasing can occur. Whenever the frequency of the input signal exceeds one-half of the

sampling rate the signal folds back down to lower frequencies.

Figure 33. Frequency Response

l TEXAS INSTRUMENTS Ana‘og l Copyngm @ 2015 Texas lnslmmems \nwrpnrated

AVDD

DVDD

AGND

DGND

DDC264

10 Fμ

0.3 Fμ

0.1 Fμ

10 Fμ

Analog

Supply

Digital

Supply

Power Supplies

RESET

tRST

tPOR

Write to the

Configuration Register

Configuration

Serial Interface

CLK

DDC264

www.ti.com

SBAS368D –MAY 2006–REVISED DECEMBER 2016

Product Folder Links: DDC264

10 Power Supply Recommendations

10.1 Power-Up Sequencing

Before device power-up, all digital and analog inputs must be low. At the time of power-up, all of these signals

must remain low until the power supplies have stabilized, as shown in Figure 34. The analog supply must come

up before or at the same time as the digital supply. At this time, begin supplying the master clock signal to the

CLK pin. Wait for time tPOR, then give a RESET pulse. After releasing RESET, the Configuration Register must

be written. Table 11 shows the timing for the power-up sequence.

Figure 34. DDC264 Timing Diagram at Power-Up

Table 11. Timing for DDC264 Power-Up Sequence

MIN TYP MAX UNIT

tPOR Wait after power-up until reset 250 ms

10.2 Power Supplies and Grounding

Both AVDD and DVDD must be as quiet as possible. It is particularly important to eliminate noise from AVDD

that is non-synchronous with the DDC264 operation. Figure 35 illustrates how to supply power to the DDC264.

Each DDC264 has internal bypass capacitors on AVDD and DVDD; therefore, the only external bypass

capacitors typically required are 10-µF ceramic capacitors, one per PCB. TI recommends connecting both the

analog and digital grounds (AGND and DGND) to a single ground plane on the PCB.

Figure 35. Power Supply Connections

l TEXAS INSTRUMENTS

DDC264

SBAS368D –MAY 2006–REVISED DECEMBER 2016

www.ti.com

Product Folder Links: DDC264

11 Layout

11.1 Layout Guidelines

11.1.1 Shielding Analog Signal Paths

As with any precision circuit, careful PCB layout ensures the best performance. It is essential to make short,

direct interconnections and avoid stray wiring capacitance—particularly at the analog input pins and QGND. The

analog input pins are low-impedance and extremely sensitive to extraneous noise. The QGND pin must be

treated as a sensitive analog signal and connected directly to the supply ground with proper shielding. Leakage

currents between the PCB traces can exceed the input bias current of the DDC264 if shielding (guard) is not

implemented. Digital signals (including digital supply) must be kept as far as possible from the analog input

signals on the PCB. If possible, avoid running digital supply planes over analog ground or signals.

11.1.2 Power Supply Routing

Figure 36 shows a diagram summarizing the concept behind the power supply distribution used in the DDC264

evaluation module (EVM).

In theoretical terms, from an isolation perspective, generating all required supplies from different sources (LDOs)

may be the best but may actually be not practical/too costly. In Figure 36, an analog supply is used to generate

and drive the VREF/Buffer supplies and the DDC AVDD. The AGND runs parallel to this plane (above or below).

The VREF signal is also routed in the same location. As seen on the figure, these do not overlap with the digital

supply/ground/signals at any moment.

Away from the analog portion, a digital supply can be used/shared between the FPGA and the DDC.

Nevertheless a star configuration is used to isolate the effect between both as much as possible. For the same

reason, the physical planes of both digital supplies are also separated.

Notice nevertheless, that it is not a bad practice to include places along the separation between all these planes

to allow for shorts, whether through a zero value resistor or a ferrite bead. This enables fine tuning of the design

performance.

11.1.3 Reference Routing

In the case where only one reference buffer is used for multiple DDCs, all reference pins must be as isolated as

possible from each other to avoid interactions between devices. One potential approach to this is to do a star

connection where the traces to the reference of each device are connected to the others only at the output of the

driver. Keep VREF shielded from any noisy signals, like digital traces or supplies.

‘5‘ TEXAS INSTRUMENTS IIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIIII

DDC264FPGA

VREFan

Buffer

xDGND (layer 1)

FPGA 3.3V Plane (layer 2)

xDGND to DGND short

DGND to AGND short

FPGA 3.3V to DDC DVDD short

DGND (layer 1)

DVDD Plane (layer 2)

AGND (layer 1)

AVDD Plane (layer 2)

DDC Digital Pins

QGND to AGND

short

Other

FPGA

Supplies

AVDD

Supply

3.3V

Supply

DDC Analog Pins

DDC264

www.ti.com

SBAS368D –MAY 2006–REVISED DECEMBER 2016

Product Folder Links: DDC264

11.2 Layout Example

Figure 36. DDC264 Layout Example

l TEXAS INSTRUMENTS

DDC264

SBAS368D –MAY 2006–REVISED DECEMBER 2016

www.ti.com

Product Folder Links: DDC264

12 Device and Documentation Support

12.1 Receiving Notification of Documentation Updates

To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper

right corner, click on Alert me to register and receive a weekly digest of any product information that has

changed. For change details, review the revision history included in any revised document.

12.2 Community Resources

The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective

contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of

Use.

TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration

among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help

solve problems with fellow engineers.

Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and

contact information for technical support.

12.3 Trademarks

E2E is a trademark of Texas Instruments.

All other trademarks are the property of their respective owners.

12.4 Electrostatic Discharge Caution

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

12.5 Glossary

SLYZ022 —TI Glossary.

This glossary lists and explains terms, acronyms, and definitions.

13 Mechanical, Packaging, and Orderable Information

The following pages include mechanical, packaging, and orderable information. This information is the most

current data available for the designated devices. This data is subject to change without notice and revision of

this document. For browser-based versions of this data sheet, refer to the left-hand navigation.

I TEXAS INSTRUMENTS

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

DDC264CKZAW ACTIVE NFBGA ZAW 100 168 RoHS & Green SNAGCU Level-3-260C-168 HR 0 to 70 DDC264K

DDC264CKZAWR ACTIVE NFBGA ZAW 100 1000 RoHS & Green SNAGCU Level-3-260C-168 HR 0 to 70 DDC264K

DDC264CZAW ACTIVE NFBGA ZAW 100 168 RoHS & Green SNAGCU Level-3-260C-168 HR 0 to 70 DDC264

DDC264CZAWR ACTIVE NFBGA ZAW 100 1000 RoHS & Green SNAGCU Level-3-260C-168 HR 0 to 70 DDC264

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

I TEXAS INSTRUMENTS

PACKAGE OPTION ADDENDUM

www.ti.com 10-Dec-2020

Addendum-Page 2

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

l TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS ’ I+K0 '«PI» Reel Diame|er AD Dimension deSIgned Io accommodate me componem wIdIh E0 Dimension deSIgned Io eecommodaIe me componenI Iengm KO Dlmenslun desIgned to accommodate me componem Ihlckness 7 w OvereII wmm OHhe earner cape i p1 Pitch between successwe cavIIy cemers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O D O O D O SprockeIHoles ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pockel Quadrams

TAPE AND REEL INFORMATION

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

DDC264CKZAWR NFBGA ZAW 100 1000 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q1

DDC264CZAWR NFBGA ZAW 100 1000 330.0 16.4 9.3 9.3 1.5 12.0 16.0 Q1

PACKAGE MATERIALS INFORMATION

www.ti.com 5-Jan-2022

Pack Materials-Page 1

l TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

DDC264CKZAWR NFBGA ZAW 100 1000 350.0 350.0 43.0

DDC264CZAWR NFBGA ZAW 100 1000 350.0 350.0 43.0

PACKAGE MATERIALS INFORMATION

www.ti.com 5-Jan-2022

Pack Materials-Page 2

l TEXAS INSTRUMENTS L - Outer tray length without tabs rt+++++ ++++++ ++++++ ++++++ ++++++ + + + +++++ +++++ +++++ +++++ ++++++ ++++++ +tTgr+ + + + ++++++ Outer tray width 1 P1 - Tray unit pocket pitch CW - Measurement tor tray edge (Y direction) to comer pocket center — CL - Measurement for tray edge (X direction) to corner pocket center {KU- Outer tray height

TRAY

Chamfer on Tray corner indicates Pin 1 orientation of packed units.

*All dimensions are nominal

Device Package

Name Package

Type Pins SPQ Unit array

matrix Max

temperature

(°C)

L (mm) W

(mm) K0

(µm) P1

(mm) CL

(mm) CW

(mm)

DDC264CKZAW ZAW NFBGA 100 168 8 x 21 150 315 135.9 7620 14.75 10 12.7

DDC264CZAW ZAW NFBGA 100 168 8 x 21 150 315 135.9 7620 14.75 10 12.7

PACKAGE MATERIALS INFORMATION

www.ti.com 5-Jan-2022

Pack Materials-Page 3

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DDC264 Datasheet by Texas Instruments

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