Adhesives, Epoxies, Greases, Pastes

Showing

of 12

Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Size / Dimension	Usable Temperature Range	Color	Thermal Conductivity	Features	Shelf Life	Storage/Refrigeration Temperature

A13717-03 TPUTTY 504 30CC SYRINGE Laird Technologies - Thermal Materials	0 In Stock	Obsolete	Tputty™ 504	Bulk	Obsolete	Silicone Gel	30cc Syringe	-49°F ~ 392°F (-45°C ~ 200°C)	Gray	1.80W/m-K	Low Outgassing (ASTM E595)	-	-
A13926-02 TPUTTY 504 1000CC PAIL Laird Technologies - Thermal Materials	0 In Stock	Obsolete	Tputty™ 504	Bulk	Obsolete	-	-	-	-	-	-	-	-
A15669-01 TPUTTY 504 100CC CARTRIDGE Laird Technologies - Thermal Materials	0 In Stock	Obsolete	Tputty™ 504	Bulk	Obsolete	-	-	-	-	-	-	-	-
A13717-02 TPUTTY 504 10CC SYRINGE AUTOMATI Laird Technologies - Thermal Materials	0 In Stock	Obsolete	Tputty™ 504	Bulk	Obsolete	-	-	-	-	-	-	-	-
A13717-01 TPUTTY 504 10CC SYRINGE MANUAL Laird Technologies - Thermal Materials	0 In Stock	Obsolete	Tputty™ 504	Bulk	Obsolete	-	-	-	-	-	-	-	-
A15685-00 TPUTTY 504 170CC CARTRIDGE Laird Technologies - Thermal Materials	0 In Stock	Obsolete	Tputty™ 504	Bulk	Obsolete	-	-	-	-	-	-	-	-
A15731-01 TPUTTY 504 20 KG BUCKET Laird Technologies - Thermal Materials	0 In Stock	Obsolete	Tputty™ 504	Bulk	Obsolete	-	-	-	-	-	-	-	-
A15638-01 TPUTTY 504 305CC CARTRIDGE Laird Technologies - Thermal Materials	0 In Stock	Obsolete	Tputty™ 504	Bulk	Obsolete	-	-	-	-	-	-	-	-
A13717-04 TPUTTY 504 30CC SYRINGE AUTOMATI Laird Technologies - Thermal Materials	0 In Stock	Obsolete	Tputty™ 504	Bulk	Obsolete	-	-	-	-	-	-	-	-
A13926-03 TPUTTY 504 3KG PAIL Laird Technologies - Thermal Materials	0 In Stock	Obsolete	Tputty™ 504	Bulk	Obsolete	-	-	-	-	-	-	-	-
A13926-01 TPUTTY 504 400CC PAIL Laird Technologies - Thermal Materials	0 In Stock	Obsolete	Tputty™ 504	Bulk	Obsolete	-	-	-	-	-	-	-	-
A13717-05 TPUTTY 504 55CC SYRINGE MANUAL Laird Technologies - Thermal Materials	0 In Stock	Obsolete	Tputty™ 504	Bulk	Obsolete	-	-	-	-	-	-	-	-

Showing

of 12

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.