Adapter, Breakout Boards

Results: 3
Package Accepted
LCC, JLCC, PLCCSOIC
Number of Positions
2832
Pitch
0.050" (1.27mm)-
Board Thickness
0.063" (1.60mm)-
Material
-FR4 Epoxy Glass
Size / Dimension
1.400" L x 0.550" W (35.56mm x 13.97mm)1.400" L x 0.700" W (35.56mm x 17.78mm)1.600" L x 0.700" W (40.64mm x 17.78mm)
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Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Proto Board Type
Package Accepted
Number of Positions
Pitch
Board Thickness
Material
Size / Dimension
PA0011C
PA0011C
SOIC-28 TO DIP-28 SMT ADAPTER (1
Chip Quik Inc.
486
In Stock
1 : ¥72.16000
Bulk
Bulk
Active
SMD to DIP
SOIC
28
0.050" (1.27mm)
0.063" (1.60mm)
FR4 Epoxy Glass
1.400" L x 0.700" W (35.56mm x 17.78mm)
PA0011C-N
PA0011C-N
SOIC-28 TO DIP-28 NARROW SMT ADA
Chip Quik Inc.
32
In Stock
1 : ¥72.16000
Bulk
Bulk
Active
SMD to DIP
SOIC
28
-
-
-
1.400" L x 0.550" W (35.56mm x 13.97mm)
PA0214C
PA0214C
PLCC-32 TO DIP-32 SMT ADAPTER (5
Chip Quik Inc.
23
In Stock
1 : ¥127.98000
Bulk
Bulk
Active
SMD to DIP
LCC, JLCC, PLCC
32
0.050" (1.27mm)
-
-
1.600" L x 0.700" W (40.64mm x 17.78mm)
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of 3

Adapter, Breakout Boards


Products in this family provide increased convenience of access to the electrical contacts of a connector, integrated circuit, or similar device by providing interconnection between a component placement area (typically for a fine-pitch, surface mounted integrated circuit) and an interconnect area typically having a much larger distance between pin centers. A common application is accommodating the use of solderless breadboards as a prototyping method for components that are not available in breadboard-compatible packaging.