IC Sockets

Results: 16
Manufacturer
3MAssmann WSW ComponentsCNC TechMill-Max Manufacturing Corp.On Shore Technology Inc.Preci-DipTE Connectivity AMP Connectors
Series
-1104800714Diplomate DLSA
Packaging
BulkTube
Type
DIP, 0.1" (2.54mm) Row SpacingDIP, 0.3" (7.62mm) Row Spacing
Number of Positions or Pins (Grid)
4 (2 x 2)6 (2 x 3)8 (2 x 4)14 (2 x 7)16 (2 x 8)
Contact Finish - Mating
GoldTin
Contact Finish Thickness - Mating
10.0µin (0.25µm)30.0µin (0.76µm)35.4µin (0.90µm)60.0µin (1.52µm)-Flash
Contact Material - Mating
Beryllium CopperPhosphor Bronze
Mounting Type
Through HoleThrough Hole, Kinked Pin
Features
Carrier, Closed FrameOpen Frame
Contact Finish - Post
GoldTin
Contact Finish Thickness - Post
10.0µin (0.25µm)30.0µin (0.76µm)35.0µin (0.90µm)60.0µin (1.52µm)80.0µin (2.03µm)200.0µin (5.08µm)-
Contact Material - Post
Beryllium CopperBrassBrass AlloyBrass, CopperPhosphor Bronze
Housing Material
Polybutylene Terephthalate (PBT)Polybutylene Terephthalate (PBT), Glass FilledPolycyclohexylenedimethylene Terephthalate (PCT), PolyesterPolycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass FilledPolyester, Glass FilledThermoplastic, PolyesterThermoplastic, Polyester, Glass Filled
Operating Temperature
-55°C ~ 125°C-55°C ~ 85°C-40°C ~ 105°C-25°C ~ 85°C
Stocking Options
Environmental Options
Media
Marketplace Product
16Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
A08-LC-TT-(R)
A 08-LC-TT
CONN IC DIP SOCKET 8POS TIN
Assmann WSW Components
3,962
In Stock
1 : ¥1.56000
Tube
-
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Phosphor Bronze
Polybutylene Terephthalate (PBT)
-55°C ~ 85°C
13,553
In Stock
1 : ¥1.64000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass, Copper
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
AR08-HZL-TT(-R)
AR 08-HZL-TT
CONN IC DIP SOCKET 8POS TIN
Assmann WSW Components
6,636
In Stock
1 : ¥4.10000
Tube
-
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
SA163000
SA163000
CONN IC DIP SOCKET 16POS GOLD
On Shore Technology Inc.
3,185
In Stock
1 : ¥7.22000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
2,167
In Stock
1 : ¥9.11000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
2,301
In Stock
1 : ¥13.13000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-87-304-41-001101
110-87-304-41-001101
CONN IC DIP SOCKET 4POS GOLD
Preci-Dip
9,290
In Stock
1 : ¥3.04000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
4 (2 x 2)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
-
Brass
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled
-55°C ~ 125°C
243-16-1-03
243-16-1-03
CONN IC DIP SOCKET 16POS TIN
CNC Tech
5,924
In Stock
1 : ¥3.04000
Tube
-
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
16 (2 x 8)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
245-14-1-03
245-14-1-03
CONN IC DIP SOCKET 14POS TIN
CNC Tech
1,344
In Stock
1 : ¥3.04000
Tube
-
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Through Hole, Kinked Pin
Open Frame
Solder
0.100" (2.54mm)
Tin
60.0µin (1.52µm)
Phosphor Bronze
Polybutylene Terephthalate (PBT), Glass Filled
-40°C ~ 105°C
SA083000
SA083000
CONN IC DIP SOCKET 8POS GOLD
On Shore Technology Inc.
3,467
In Stock
1 : ¥4.02000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
210-1-06-003
210-1-06-003
CONN IC DIP SOCKET 6POS GOLD
CNC Tech
1,114
In Stock
1 : ¥4.27000
Tube
-
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
6 (2 x 3)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polybutylene Terephthalate (PBT)
-40°C ~ 105°C
AR08-HZL/01-TT-(R)
AR 08-HZL/01-TT
CONN IC DIP SOCKET 8POS GOLD
Assmann WSW Components
9,022
In Stock
1 : ¥4.43000
Tube
-
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Beryllium Copper
Thermoplastic, Polyester
-40°C ~ 105°C
SA083040
SA083040
CONN IC DIP SOCKET 8POS GOLD
On Shore Technology Inc.
4,589
In Stock
1 : ¥4.60000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
Flash
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
80.0µin (2.03µm)
Brass
Thermoplastic, Polyester, Glass Filled
-40°C ~ 105°C
4808-3000-CP
4808-3000-CP
CONN IC DIP SOCKET 8POS TIN
3M
27,373
In Stock
1 : ¥5.83000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Tin
35.4µin (0.90µm)
Phosphor Bronze
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
35.0µin (0.90µm)
Phosphor Bronze
Polyester, Glass Filled
-25°C ~ 85°C
210-1-14-003
210-1-14-003
CONN IC DIP SOCKET 14POS GOLD
CNC Tech
1,031
In Stock
1 : ¥9.60000
Tube
-
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
14 (2 x 7)
0.100" (2.54mm)
Gold
-
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass
Polybutylene Terephthalate (PBT)
-40°C ~ 105°C
0
In Stock
Value Added Item
Active
Bulk
Active
DIP, 0.1" (2.54mm) Row Spacing
8 (2 x 4)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Carrier, Closed Frame
Solder
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Showing
of 16

IC Sockets

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.