Heat Sinks

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Package Cooled
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Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
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HEATSINK COMPACT
302NN
HEATSINK COMPACT
Wakefield-Vette
0
In Stock
Check Lead Time
140 : ¥233.92829
Bulk
Bulk
Active
Board Level, Vertical
Stud Mounted Semiconductor Cases
Press Fit
Rectangular, Fins
2.000" (50.80mm)
1.500" (38.10mm)
-
2.000" (50.80mm)
15.0W @ 50°C
1.80°C/W @ 250 LFM
-
Aluminum Alloy
Black Anodized
HEATSINK COMPACT
302M
HEATSINK COMPACT
Wakefield-Vette
0
In Stock
Active
Bulk
Active
Board Level, Vertical
Stud Mounted Semiconductor Cases
Press Fit
Rectangular, Fins
2.000" (50.80mm)
1.500" (38.10mm)
-
2.000" (50.80mm)
15.0W @ 50°C
1.80°C/W @ 250 LFM
-
Aluminum Alloy
Black Anodized
HEATSINK COMPACT
302MM
HEATSINK COMPACT
Wakefield-Vette
0
In Stock
Active
Bulk
Active
Board Level, Vertical
Stud Mounted Semiconductor Cases
Press Fit
Rectangular, Fins
2.000" (50.80mm)
1.500" (38.10mm)
-
2.000" (50.80mm)
15.0W @ 50°C
1.80°C/W @ 250 LFM
-
Aluminum Alloy
Black Anodized
HEATSINK COMPACT
302N
HEATSINK COMPACT
Wakefield-Vette
0
In Stock
Active
Bulk
Active
Board Level, Vertical
Stud Mounted Semiconductor Cases
Press Fit
Rectangular, Fins
2.000" (50.80mm)
1.500" (38.10mm)
-
2.000" (50.80mm)
15.0W @ 50°C
1.80°C/W @ 250 LFM
-
Aluminum Alloy
Black Anodized
Showing
of 4

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.