Heat Sinks

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Package Cooled	Attachment Method	Shape	Length	Width	Diameter	Fin Height	Power Dissipation @ Temperature Rise	Thermal Resistance @ Forced Air Flow	Thermal Resistance @ Natural	Material	Material Finish

V5618A HEATSINK ALUM ANOD Assmann WSW Components	28,437 In Stock 11,500 Factory	1 : ¥3.86000 Bulk	-	Bulk	Active	Top Mount	6-Dip and 8-Dip	Press Fit	Rectangular, Fins	0.334" (8.50mm)	0.250" (6.35mm)	-	0.189" (4.80mm)	-	-	80.00°C/W	Aluminum	Black Anodized
375424B00034G HEATSINK PIN-FIN W/TAPE Boyd Laconia, LLC	4,167 In Stock	1 : ¥10.92000 Bulk	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Pin Fins	0.598" (15.19mm)	0.598" (15.19mm)	-	0.252" (6.40mm)	-	17.60°C/W @ 200 LFM	62.50°C/W	Aluminum	Black Anodized
ATS-55150D-C1-R0 HEAT SINK 15MM X 15MM X 9.5MM Advanced Thermal Solutions Inc.	1,776 In Stock	1 : ¥57.55000 Bulk	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Included)	Square, Fins	0.591" (15.00mm)	0.591" (15.00mm)	-	0.374" (9.50mm)	-	29.50°C/W @ 200 LFM	-	Aluminum	Black Anodized
HSB02-101007 HEAT SINK, BGA, 10 X 10 X 7 MM CUI Devices	5,723 In Stock	1 : ¥5.50000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.394" (10.00mm)	0.394" (10.00mm)	-	0.275" (7.00mm)	2.0W @ 75°C	16.50°C/W @ 200 LFM	37.90°C/W	Aluminum Alloy	Black Anodized
HSB01-080808 HEAT SINK, BGA, 8.5 X 8.5 X 8 MM CUI Devices	4,276 In Stock	1 : ¥5.99000 Box	HSB	Box	Active	Top Mount	BGA	Adhesive (Not Included)	Square, Pin Fins	0.335" (8.50mm)	0.335" (8.50mm)	-	0.315" (8.00mm)	1.9W @ 75°C	16.00°C/W @ 200 LFM	39.10°C/W	Aluminum Alloy	Black Anodized
TGH-0100-01 ALUMINIUM HEAT SINK 10X10MM t-Global Technology	633 In Stock	1 : ¥16.09000 Bulk	TGH	Bulk	Active	Top Mount	-	-	Square, Fins	0.394" (10.00mm)	0.394" (10.00mm)	-	0.374" (9.50mm)	-	-	-	Aluminum	Clean Anodized
ATS010010010-SF-1I HEATSINK 10X10X10MM Advanced Thermal Solutions Inc.	158 In Stock	1 : ¥23.97000 Bulk	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	0.394" (10.00mm)	0.394" (10.00mm)	-	0.394" (10.00mm)	-	31.20°C/W @ 200 LFM	-	Aluminum	Black Anodized
ATS010010019-SF-1R HEATSINK 10X10X19MM Advanced Thermal Solutions Inc.	236 In Stock	1 : ¥39.41000 Bulk	-	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Fins	0.394" (10.00mm)	0.394" (10.00mm)	-	0.748" (19.00mm)	-	16.43°C/W @ 200 LFM	-	Aluminum	Black Anodized
FIT0367 RASPBERRY PI COPPER HEATSINK DFRobot	230 In Stock	1 : ¥8.13000 Bulk	-	Bulk	Active	Top Mount	Raspberry Pi	Thermal Tape, Adhesive (Included)	Rectangular	0.520" (13.20mm)	0.476" (12.10mm)	-	-	-	-	-	Copper	-
ATS010010025-MF-1X MAXIFLOW HEATSINK 10X10X25MM Advanced Thermal Solutions Inc.	70 In Stock	1 : ¥61.82000 Bulk	maxiFLOW	Bulk	Active	Top Mount	BGA	Thermal Tape, Adhesive (Not Included)	Square, Angled Fins	0.394" (10.00mm)	0.394" (10.00mm)	-	0.984" (25.00mm)	-	12.66°C/W @ 200 LFM	-	Aluminum	Black Anodized
V2017B HEATSINK ANOD ALUM CPU Assmann WSW Components	0 In Stock Check Lead Time	1 : ¥4.52000 Bulk	-	Bulk	Active	Top Mount	Assorted (BGA, LGA, CPU, ASIC...)	-	Square, Pin Fins	0.394" (10.00mm)	0.394" (10.00mm)	-	0.275" (7.00mm)	-	-	31.00°C/W	Aluminum	Black Anodized
HSB03-121218 HEAT SINK, BGA, 12 X 12 X 18 MM CUI Devices	0 In Stock Check Lead Time	1 : ¥7.47000 Tray	HSB	Tray	Active	Top Mount	BGA	Adhesive	Square, Pin Fins	0.472" (12.00mm)	0.472" (12.00mm)	-	0.709" (18.00mm)	3.1W @ 75°C	9.60°C/W @ 200 LFM	24.01°C/W	Aluminum Alloy	Black Anodized

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Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.