Edgeboard Connectors

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Card Type	Gender	Number of Positions/Bay/Row	Number of Positions	Card Thickness	Number of Rows	Pitch	Read Out	Features	Mounting Type	Termination	Contact Material	Contact Finish	Contact Finish Thickness	Contact Type	Color	Flange Feature	Operating Temperature

MEC1-130-02-F-D-A CONN EDGE DUAL FMALE 60POS 0.039 Samtec Inc.	173 In Stock 213 Factory	1 : ¥43.59000 Tube	MEC1	Tube	Active	Non Specified - Dual Edge	Female	-	60	0.062" (1.57mm)	2	0.039" (1.00mm)	Dual	Board Guide	Surface Mount	Solder	Phosphor Bronze	Gold	3.00µin (0.076µm)	Loop Bellows	Black	-	-55°C ~ 125°C
MEC1-108-02-S-D-A CONN EDGE DUAL FMALE 16POS 0.039 Samtec Inc.	170 In Stock 5,382 Factory	1 : ¥48.76000 Tube	MEC1	Tube	Active	Non Specified - Dual Edge	Female	-	16	0.062" (1.57mm)	2	0.039" (1.00mm)	Dual	Board Guide	Surface Mount	Solder	Phosphor Bronze	Gold	30.0µin (0.76µm)	Loop Bellows	Black	-	-55°C ~ 125°C
HSEC8-180-03-L-DV-A-WT-K CONN EDGE DUAL FML 160POS 0.031 Samtec Inc.	0 In Stock Check Lead Time	28 : ¥82.24000 Bulk	Edge Rate™ HSEC8	Bulk	Active	Non Specified - Dual Edge	Female	80	160	0.093" (2.36mm)	2	0.031" (0.80mm)	Dual	Board Guide, Solder Retention	Surface Mount	Solder	Beryllium Copper	Gold	10.0µin (0.25µm)	Cantilever	Black	-	-55°C ~ 125°C
HSEC8-180-01-L-DV-A-WT-K CONN EDGE DUAL FML 160POS 0.031 Samtec Inc.	0 In Stock Check Lead Time	28 : ¥87.06000 Tray	Edge Rate™ HSEC8	Tray	Active	Non Specified - Dual Edge	Female	80	160	0.062" (1.57mm)	2	0.031" (0.80mm)	Dual	Board Guide, Solder Retention	Surface Mount	Solder	Beryllium Copper	Gold	10.0µin (0.25µm)	Cantilever	Black	-	-55°C ~ 125°C

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Edgeboard Connectors

Card edge or edgeboard connectors are a style of connector system in which (typically) a pattern of exposed copper regions at the periphery of a printed circuit board constitutes one-half of a mating connector pair. A common use case being the connection of accessory cards such as graphics accelerators to computer motherboards in desktop PC applications, they offer a relatively low-cost, high density interconnect option for applications where durability is not a primary concern.