Single Diodes

Results: 2
Manufacturer
Diodes IncorporatedToshiba Semiconductor and Storage
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Technology
SchottkyStandard
Voltage - DC Reverse (Vr) (Max)
60 V80 V
Current - Average Rectified (Io)
100mA5A
Voltage - Forward (Vf) (Max) @ If
700 mV @ 5 A1.2 V @ 100 mA
Speed
Fast Recovery =< 500ns, > 200mA (Io)Small Signal =< 200mA (Io), Any Speed
Current - Reverse Leakage @ Vr
500 nA @ 80 V500 µA @ 60 V
Capacitance @ Vr, F
3pF @ 0V, 1MHz300pF @ 4V, 1MHz
Package / Case
DO-214AB, SMCSC-76A
Supplier Device Package
SC-76-2SMC
Operating Temperature - Junction
-55°C ~ 150°C125°C (Max)
Stocking Options
Environmental Options
Media
Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Technology
Voltage - DC Reverse (Vr) (Max)
Current - Average Rectified (Io)
Voltage - Forward (Vf) (Max) @ If
Speed
Reverse Recovery Time (trr)
Current - Reverse Leakage @ Vr
Capacitance @ Vr, F
Mounting Type
Package / Case
Supplier Device Package
Operating Temperature - Junction
DO-214AB, SMC
B560C-13-F
DIODE SCHOTTKY 60V 5A SMC
Diodes Incorporated
87,971
In Stock
3,675,000
Factory
1 : ¥4.19000
Cut Tape (CT)
3,000 : ¥1.41265
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Schottky
60 V
5A
700 mV @ 5 A
Fast Recovery =< 500ns, > 200mA (Io)
-
500 µA @ 60 V
300pF @ 4V, 1MHz
Surface Mount
DO-214AB, SMC
SMC
-55°C ~ 150°C
SC-76A
1SS352,H3F
DIODE GEN PURP 80V 100MA SC76-2
Toshiba Semiconductor and Storage
233,845
In Stock
1 : ¥1.40000
Cut Tape (CT)
3,000 : ¥0.24052
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
Standard
80 V
100mA
1.2 V @ 100 mA
Small Signal =< 200mA (Io), Any Speed
4 ns
500 nA @ 80 V
3pF @ 0V, 1MHz
Surface Mount
SC-76A
SC-76-2
125°C (Max)
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Single Diodes


Products within the single rectifier diode family are used to allow current flow in one direction only, and implement exactly one instance of this function per device package. Diodes used for other purposes (including zener and variable capacitance diodes) are listed separately in product families of their own, as are products incorporating multiple diodes per device package.