Diode Arrays

Results: 2
Manufacturer
onsemiSMC Diode Solutions
Packaging
Cut Tape (CT)Digi-Reel®Tape & Reel (TR)
Diode Configuration
1 Pair Common Cathode1 Pair Series Connection
Technology
SchottkyStandard
Voltage - DC Reverse (Vr) (Max)
40 V100 V
Current - Average Rectified (Io) (per Diode)
200mA-
Voltage - Forward (Vf) (Max) @ If
530 mV @ 6 A1 V @ 10 mA
Speed
Fast Recovery =< 500ns, > 200mA (Io)Small Signal =< 200mA (Io), Any Speed
Current - Reverse Leakage @ Vr
5 µA @ 75 V1 mA @ 40 V
Package / Case
TO-236-3, SC-59, SOT-23-3TO-252-3, DPAK (2 Leads + Tab), SC-63
Supplier Device Package
DPAKSOT-23-3
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Diode Configuration
Technology
Voltage - DC Reverse (Vr) (Max)
Current - Average Rectified (Io) (per Diode)
Voltage - Forward (Vf) (Max) @ If
Speed
Reverse Recovery Time (trr)
Current - Reverse Leakage @ Vr
Operating Temperature - Junction
Mounting Type
Package / Case
Supplier Device Package
DPAK
12CWQ04FN
DIODE ARRAY SCHOTTKY 40V DPAK
SMC Diode Solutions
11,340
In Stock
1 : ¥5.09000
Cut Tape (CT)
2,500 : ¥1.94019
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
1 Pair Common Cathode
Schottky
40 V
-
530 mV @ 6 A
Fast Recovery =< 500ns, > 200mA (Io)
-
1 mA @ 40 V
-55°C ~ 150°C
Surface Mount
TO-252-3, DPAK (2 Leads + Tab), SC-63
DPAK
SOT-23-3
MMBD4148SE
DIODE ARRAY GP 100V 200MA SOT23
onsemi
0
In Stock
Check Lead Time
1 : ¥2.63000
Cut Tape (CT)
3,000 : ¥0.44897
Tape & Reel (TR)
-
Tape & Reel (TR)
Cut Tape (CT)
Digi-Reel®
Active
1 Pair Series Connection
Standard
100 V
200mA
1 V @ 10 mA
Small Signal =< 200mA (Io), Any Speed
4 ns
5 µA @ 75 V
-55°C ~ 150°C
Surface Mount
TO-236-3, SC-59, SOT-23-3
SOT-23-3
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Diode Arrays

Products within the diode and rectifier array family incorporate two or more discrete diodes within a single package. They are characterized in terms similar to those used for single discrete diodes, with the addition of a "Diode Configuration" attribute indicating the presence and character of any internal connections between the diodes in the device. Note that arrays with a full-bridge configuration are specifically excluded, and listed as a separate product family.