Type | Description | Select All |
---|---|---|
Category | ||
Manufacturer | 3M | |
Series | ||
Packaging | Bulk | |
Part Status | Active | |
Type | SOIC | |
Number of Positions or Pins (Grid) | 24 (2 x 12) | |
Pitch - Mating | - | |
Contact Finish - Mating | Gold | |
Contact Finish Thickness - Mating | - | |
Contact Material - Mating | Beryllium Copper | |
Mounting Type | Through Hole | |
Features | Closed Frame | |
Termination | Solder | |
Pitch - Post | - | |
Contact Finish - Post | Gold | |
Contact Finish Thickness - Post | 30.0µin (0.76µm) | |
Contact Material - Post | Beryllium Copper | |
Housing Material | Polyethersulfone (PES), Glass Filled | |
Operating Temperature | -55°C ~ 150°C | |
Base Product Number |
Quantity | Unit Price (Including 13% VAT) | Ext Price (Including 13% VAT) |
---|---|---|
1 | ¥369.75000 | ¥369.75 |
10 | ¥339.27600 | ¥3,392.76 |
30 | ¥326.22867 | ¥9,786.86 |
50 | ¥315.35560 | ¥15,767.78 |
100 | ¥297.95580 | ¥29,795.58 |
250 | ¥289.25668 | ¥72,314.17 |