Adhesives, Epoxies, Greases, Pastes

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Size / Dimension	Usable Temperature Range	Color	Thermal Conductivity	Features	Shelf Life	Storage/Refrigeration Temperature

TC3-1G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	648 In Stock	1 : ¥51.66000 Bulk	CHIPQUIK®	Bulk	Active	Silicone Compound	1 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
TC3-10G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	263 In Stock	1 : ¥326.42000 Bulk	CHIPQUIK®	Bulk	Active	Silicone Compound	10 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
TC4-1G HEAT SINK THERMAL COMPOUND - DEE Chip Quik Inc.	9 In Stock	1 : ¥100.98000 Bulk	CHIPQUIK®	Bulk	Active	Thermal Compound, Liquid Metal	1 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Silver	79.00 W/m-K	-	60 Months	68°F ~ 77°F (20°C ~ 25°C)
TC3-3.5G HEAT SINK THERMAL COMPOUND Chip Quik Inc.	31 In Stock	1 : ¥128.59000 Bulk	CHIPQUIK®	Bulk	Active	Silicone Compound	3.5 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Gray	8.50W/m-K	-	60 Months	37°F ~ 77°F (3°C ~ 25°C)
TC4-2G HEAT SINK THERMAL COMPOUND - DEE Chip Quik Inc.	14 In Stock	1 : ¥151.81000 Bulk	CHIPQUIK®	Bulk	Active	Thermal Compound, Liquid Metal	2 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Silver	79.00 W/m-K	-	60 Months	68°F ~ 77°F (20°C ~ 25°C)
TC4-20G HEAT SINK THERMAL COMPOUND - DEE Chip Quik Inc.	13 In Stock	1 : ¥479.36000 Bulk	CHIPQUIK®	Bulk	Active	Thermal Compound, Liquid Metal	20 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Silver	79.00 W/m-K	-	60 Months	68°F ~ 77°F (20°C ~ 25°C)
TC4-10G HEAT SINK THERMAL COMPOUND - DEE Chip Quik Inc.	0 In Stock Check Lead Time	1 : ¥287.40000 Bulk	CHIPQUIK®	Bulk	Active	Thermal Compound, Liquid Metal	10 gram Syringe	-40°F ~ 302°F (-40°C ~ 150°C)	Silver	79.00 W/m-K	-	60 Months	68°F ~ 77°F (20°C ~ 25°C)

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Adhesives, Epoxies, Greases, Pastes

Products in this family are fluids, gels, or semi-solids used primarily to aid the heat transfer between objects such as a transistor and a heatsink or a printed circuit board assembly and a device enclosure. A variety of materials are included, some of which provide additional functions such as adhesive bonding, mechanical cushioning and shock absorption, or environmental sealing.