Heat Sinks

Results: 14
Packaging
BoxTray
Attachment Method
Thermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)
Length
0.910" (23.11mm)1.010" (25.65mm)1.110" (28.19mm)1.210" (30.73mm)1.310" (33.27mm)1.410" (35.81mm)1.510" (38.35mm)1.610" (40.89mm)1.710" (43.43mm)1.810" (45.97mm)
Width
0.910" (23.11mm)1.010" (25.65mm)1.110" (28.19mm)1.210" (30.73mm)1.310" (33.27mm)1.410" (35.81mm)1.510" (38.35mm)1.610" (40.89mm)1.710" (43.43mm)1.810" (45.97mm)
Fin Height
0.355" (9.02mm)0.555" (14.10mm)0.605" (15.37mm)
Thermal Resistance @ Forced Air Flow
2.80°C/W @ 400 LFM3.50°C/W @ 400 LFM3.80°C/W @ 400 LFM4.50°C/W @ 400 LFM5.20°C/W @ 400 LFM5.60°C/W @ 400 LFM6.00°C/W @ 400 LFM6.30°C/W @ 400 LFM6.80°C/W @ 400 LFM7.20°C/W @ 400 LFM8.00°C/W @ 400 LFM9.60°C/W @ 400 LFM
Thermal Resistance @ Natural
8.10°C/W10.80°C/W11.50°C/W13.50°C/W15.10°C/W16.10°C/W16.20°C/W16.50°C/W19.60°C/W20.80°C/W20.90°C/W26.40°C/W26.90°C/W
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
BDN10-3CB/A01
BDN10-3CB/A01
HEATSINK CPU W/ADHESIVE 1.01"SQ
CTS Thermal Management Products
1,744
In Stock
1 : ¥20.61000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.010" (25.65mm)
1.010" (25.65mm)
-
0.355" (9.02mm)
-
8.00°C/W @ 400 LFM
26.40°C/W
Aluminum
Black Anodized
BDN09-3CB/A01 Heat Sink
BDN09-3CB/A01
HEATSINK CPU W/ADHESIVE .91"SQ
CTS Thermal Management Products
472
In Stock
1 : ¥24.38000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.910" (23.11mm)
0.910" (23.11mm)
-
0.355" (9.02mm)
-
9.60°C/W @ 400 LFM
26.90°C/W
Aluminum
Black Anodized
HEATSINK CPU W/ADHESIVE 1.81"SQ
BDN18-6CB/A01
HEATSINK CPU W/ADHESIVE 1.81"SQ
CTS Thermal Management Products
558
In Stock
1 : ¥48.44000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.810" (45.97mm)
1.810" (45.97mm)
-
0.605" (15.37mm)
-
2.80°C/W @ 400 LFM
8.10°C/W
Aluminum
Black Anodized
BDN11-3CB/A01
BDN11-3CB/A01
HEATSINK CPU W/ADHESIVE 1.11"SQ
CTS Thermal Management Products
291
In Stock
1 : ¥22.90000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.110" (28.19mm)
1.110" (28.19mm)
-
0.355" (9.02mm)
-
7.20°C/W @ 400 LFM
20.90°C/W
Aluminum
Black Anodized
BDN12-5CB/A01
BDN12-5CB/A01
HEATSINK CPU W/ADHESIVE 1.21"SQ
CTS Thermal Management Products
805
In Stock
1 : ¥26.35000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.210" (30.73mm)
1.210" (30.73mm)
-
0.555" (14.10mm)
-
5.20°C/W @ 400 LFM
16.50°C/W
Aluminum
Black Anodized
BDN18-3CB/A01
BDN18-3CB/A01
HEATSINK CPU W/ADHESIVE 1.81"SQ
CTS Thermal Management Products
1,222
In Stock
1 : ¥43.18000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.810" (45.97mm)
1.810" (45.97mm)
-
0.355" (9.02mm)
-
3.50°C/W @ 400 LFM
10.80°C/W
Aluminum
Black Anodized
450
In Stock
1 : ¥11.33000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.910" (23.11mm)
0.910" (23.11mm)
-
0.355" (9.02mm)
-
9.60°C/W @ 400 LFM
26.90°C/W
Aluminum
Black Anodized
BDN13-3CB/A01
BDN13-3CB/A01
HEATSINK CPU W/ADHESIVE 1.31"SQ
CTS Thermal Management Products
464
In Stock
1 : ¥28.98000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.310" (33.27mm)
1.310" (33.27mm)
-
0.355" (9.02mm)
-
6.00°C/W @ 400 LFM
16.10°C/W
Aluminum
Black Anodized
BDN14-3CB/A01
BDN14-3CB/A01
HEATSINK CPU W/ADHESIVE 1.41"SQ
CTS Thermal Management Products
0
In Stock
Check Lead Time
1 : ¥31.15000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.410" (35.81mm)
1.410" (35.81mm)
-
0.355" (9.02mm)
-
5.60°C/W @ 400 LFM
16.20°C/W
Aluminum
Black Anodized
HEATSINK CPU W/ADHESIVE 1.01"SQ
BDN10-5CB/A01
HEATSINK CPU W/ADHESIVE 1.01"SQ
CTS Thermal Management Products
0
In Stock
Check Lead Time
1,000 : ¥16.58871
Tray
Tray
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.010" (25.65mm)
1.010" (25.65mm)
-
0.555" (14.10mm)
-
6.30°C/W @ 400 LFM
20.80°C/W
Aluminum
Black Anodized
BDN12-3CB/A01
BDN12-3CB/A01
HEATSINK CPU W/ADHESIVE 1.21"SQ
CTS Thermal Management Products
0
In Stock
Check Lead Time
1,260 : ¥17.66658
Tray
Tray
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.210" (30.73mm)
1.210" (30.73mm)
-
0.355" (9.02mm)
-
6.80°C/W @ 400 LFM
19.60°C/W
Aluminum
Black Anodized
HEATSINK CPU W/ADHESIVE 1.51"SQ
BDN15-3CB/A01
HEATSINK CPU W/ADHESIVE 1.51"SQ
CTS Thermal Management Products
0
In Stock
Check Lead Time
1,000 : ¥22.65722
Tray
Tray
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.510" (38.35mm)
1.510" (38.35mm)
-
0.355" (9.02mm)
-
4.50°C/W @ 400 LFM
15.10°C/W
Aluminum
Black Anodized
BDN17-3CB/A01
BDN17-3CB/A01
HEATSINK CPU W/ADHESIVE 1.71"SQ
CTS Thermal Management Products
0
In Stock
Check Lead Time
1,000 : ¥26.95794
Tray
Tray
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.710" (43.43mm)
1.710" (43.43mm)
-
0.355" (9.02mm)
-
3.80°C/W @ 400 LFM
11.50°C/W
Aluminum
Black Anodized
HEATSINK CPU W/ADHESIVE 1.61"SQ
BDN16-3CB/A01
HEATSINK CPU W/ADHESIVE 1.61"SQ
CTS Thermal Management Products
0
In Stock
Check Lead Time
2,000 : ¥32.14259
Tray
Tray
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.610" (40.89mm)
1.610" (40.89mm)
-
0.355" (9.02mm)
-
4.50°C/W @ 400 LFM
13.50°C/W
Aluminum
Black Anodized
Showing
of 14

Heat Sinks


Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.