BAS,SBAS40-04LT1G Datasheet by onsemi

0N Semiconductorg www.0nsemi.com
© Semiconductor Components Industries, LLC, 1997
March, 2018 − Rev. 13 1Publication Order Number:
BAS40−04LT1/D
BAS40-04LT1G,
SBAS40-04LT1G
Dual Series
Schottky Barrier Diode
These Schottky barrier diodes are designed for high speed switching
applications, circuit protection, and voltage clamping. Extremely low
forward voltage reduces conduction loss. Miniature surface mount
package is excellent for hand held and portable applications where
space is limited.
Features
•Extremely Fast Switching Speed
•Low Forward Voltage
•S Prefix for Automotive and Other Applications Requiring Unique
Site and Control Change Requirements; AEC−Q101 Qualified and
PPAP Capable
•These Devices are Pb−Free, Halogen Free/BFR Free and are RoHS
Compliant
MAXIMUM RATINGS
Rating Symbol Value Unit
Reverse Voltage VR40 V
Forward Power Dissipation
@ TA = 25°C
Derate above 25°C
PF225
1.8 mW
mW/°C
Operating Junction and Storage
Temperature Range TJ, Tstg −55 to +150 °C
Forward Continuous Current IFM 120 mA
Single Forward Current
t v 1 s
t v 10 ms
IFSM 200
600
mA
Thermal Resistance (Note 1)
Junction−to−Ambient (Note 2) RqJA 508
311 °C/W
Stresses exceeding those listed in the Maximum Ratings table may damage
the device. If any of these limits are exceeded, device functionality should not
be assumed, damage may occur and reliability may be affected.
1. FR−4 @ minimum pad.
2. FR−4 @ 1.0 x 1.0 in pad.
www.onsemi.com
Device Package Shipping†
ORDERING INFORMATION
SOT−23 (TO−236)
CASE 318
STYLE 11
40 VOLTS
SCHOTTKY BARRIER DIODES
MARKING DIAGRAM
CB = Specific Device Code
M = Date Code*
G= Pb−Free Package
ANODE
1
CATHODE
2
3
CATHODE/ANODE
BAS40−04LT1G SOT−23
(Pb−Free)
3,000 /
Tape & Reel
†For information on tape and reel specifications,
including part orientation and tape sizes, please
refer to our Tape and Reel Packaging Specification
s
Brochure, BRD8011/D.
1
CB MG
G
(Note: Microdot may be in either location)
*Date Code orientation and/or overbar may
vary depending upon manufacturing location.
SBAS40−04LT1G SOT−23
(Pb−Free)
3,000 /
Tape & Reel
BAS40−04LT1G, SBAS40−04LT1G
www.onsemi.com
2
ELECTRICAL CHARACTERISTICS (TA = 25°C unless otherwise noted)
Characteristic Symbol Min Max Unit
Reverse Breakdown Voltage
(IR = 10 mA) V(BR)R 40 − V
Total Capacitance
(VR = 1.0 V, f = 1.0 MHz) CT− 5.0 pF
Reverse Leakage
(VR = 25 V) IR− 1.0 mA
Forward Voltage
(IF = 1.0 mA) VF− 380 mV
Forward Voltage
(IF = 10 mA) VF− 500 mV
Forward Voltage
(IF = 40 mA) VF− 1.0 V
Product parametric performance is indicated in the Electrical Characteristics for the listed test conditions, unless otherwise noted. Product
performance may not be indicated by the Electrical Characteristics if operated under different conditions.
100
0 0.1
VF, FORWARD VOLTAGE (VOLTS)
0.2 0.3 0.4 0.5
10
1.0
0.1
85°C
10
0
VR, REVERSE VOLTAGE (VOLTS)
1.0
0.1
0.01
0.001
5.0 10 15 20 25
3.5
0
VR, REVERSE VOLTAGE (VOLTS)
3.0
1.0
0.5
0
CT, CAPACITANCE (pF)
5.0 10 15 40
IF, FORWARD CURRENT (mA)
Figure 1. Typical Forward Voltage Figure 2. Reverse Current versus Reverse
Voltage
Figure 3. Typical Capacitance
-40°C
25°C
TA = 150°C
25°C
IR, REVERSE CURRENT (μA)
0.8
-55°C
125°C
150°C
100
2520
1.5
2.0
2.5
0.6 0.7
125°C
85°C
30 35
(y [1 LE @% SOLDERING F0 + ‘ —\ 1—‘7 * tuir jggi L#F if 0" 30m iiiii
SOT−23 (TO−236)
CASE 318−08
ISSUE AS DATE 30 JAN 201
8
SCALE 4:1
D
A1
3
12
1
XXXMG
G
XXX = Specific Device Code
M = Date Code
G= Pb−Free Package
*This information is generic. Please refer to
device data sheet for actual part marking.
Pb−Free indicator, “G” or microdot “ G”,
may or may not be present.
GENERIC
MARKING DIAGRAM*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH.
MINIMUM LEAD THICKNESS IS THE MINIMUM THICKNESS OF
THE BASE MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH,
PROTRUSIONS, OR GATE BURRS.
SOLDERING FOOTPRINT
VIEW C
L
0.25
L1
e
EE
b
A
SEE VIEW C
DIM
AMIN NOM MAX MIN
MILLIMETERS
0.89 1.00 1.11 0.035
INCHES
A1 0.01 0.06 0.10 0.000
b0.37 0.44 0.50 0.015
c0.08 0.14 0.20 0.003
D2.80 2.90 3.04 0.110
E1.20 1.30 1.40 0.047
e1.78 1.90 2.04 0.070
L0.30 0.43 0.55 0.012
0.039 0.044
0.002 0.004
0.017 0.020
0.006 0.008
0.114 0.120
0.051 0.055
0.075 0.080
0.017 0.022
NOM MAX
L1
H
STYLE 22:
PIN 1. RETURN
2. OUTPUT
3. INPUT
STYLE 6:
PIN 1. BASE
2. EMITTER
3. COLLECTOR
STYLE 7:
PIN 1. EMITTER
2. BASE
3. COLLECTOR
STYLE 8:
PIN 1. ANODE
2. NO CONNECTION
3. CATHODE
STYLE 9:
PIN 1. ANODE
2. ANODE
3. CATHODE
STYLE 10:
PIN 1. DRAIN
2. SOURCE
3. GATE
STYLE 11:
PIN 1. ANODE
2. CATHODE
3. CATHODE−ANODE
STYLE 12:
PIN 1. CATHODE
2. CATHODE
3. ANODE
STYLE 13:
PIN 1. SOURCE
2. DRAIN
3. GATE
STYLE 14:
PIN 1. CATHODE
2. GATE
3. ANODE
STYLE 15:
PIN 1. GATE
2. CATHODE
3. ANODE
STYLE 16:
PIN 1. ANODE
2. CATHODE
3. CATHODE
STYLE 17:
PIN 1. NO CONNECTION
2. ANODE
3. CATHODE
STYLE 18:
PIN 1. NO CONNECTION
2. CATHODE
3. ANODE
STYLE 19:
PIN 1. CATHODE
2. ANODE
3. CATHODE−ANODE
STYLE 23:
PIN 1. ANODE
2. ANODE
3. CATHODE
STYLE 20:
PIN 1. CATHODE
2. ANODE
3. GATE
STYLE 21:
PIN 1. GATE
2. SOURCE
3. DRAIN
STYLE 1 THRU 5:
CANCELLED
STYLE 24:
PIN 1. GATE
2. DRAIN
3. SOURCE
STYLE 25:
PIN 1. ANODE
2. CATHODE
3. GATE
STYLE 26:
PIN 1. CATHODE
2. ANODE
3. NO CONNECTIO
N
STYLE 27:
PIN 1. CATHODE
2. CATHODE
3. CATHODE
2.10 2.40 2.64 0.083 0.094 0.104
HE
0.35 0.54 0.69 0.014 0.021 0.027
c0 −−− 10 0 −−− 10
T°°°°
(Note: Microdot may be in either location)
T
3X
TOP VIEW
SIDE VIEW END VIEW
2.90
0.80
DIMENSIONS: MILLIMETERS
0.90
PITCH
3X
3X 0.95
RECOMMENDED
STYLE 28:
PIN 1. ANODE
2. ANODE
3. ANODE
MECHANICAL CASE OUTLINE
PACKAGE DIMENSIONS
http://onsemi.com
1
© Semiconductor Components Industries, LLC, 2002
October, 2002 − Rev. 0 Case Outline Number:
XXX
DOCUMENT NUMBER:
STATUS:
NEW STANDARD:
DESCRIPTION:
98ASB42226B
ON SEMICONDUCTOR STANDARD
SOT−23 (TO−236)
Electronic versions are uncontrolled except when
accessed directly from the Document Repository. Printed
versions are uncontrolled except when stamped
“CONTROLLED COPY” in red.
PAGE 1 OF 2
0N Semlconduclol“ m Semicanduclnr and J
DOCUMENT NUMBER:
98ASB42226B
PAGE 2 OF 2
ISSUE REVISION DATE
AJ ADDED STYLE 27. REQ. BY P. LEM. 07 JUL 2004
AK OBSOLETED −09 VERSION. REQ. BY D. TRUHITTE. 14 SEP 2004
AL ADDED NOMINAL VALUES AND UPDATED GENERIC MARKING DIAGRAM. REQ.
BY HONG XIAO. 27 MAY 2005
AM REDREW LEAD SIDE VIEW. REQ BY DARRELL TRUHITTE. 26 AUG 2005
AN REINTRODUCED LABELS FOR DIMENSION C. REQ. BY D. TRUHITTE. 14 OCT 2005
AP ADDED THETA DEGREE VALUES TO DIMENSION TABLE. REQ. BY D. TRUHITTE. 17 NOV 2009
AR MODIFIED DIMENSIONS C AND L. REQ. BY M. YOU. 10 OCT 2016
AS ADDED STYLE 28. REQ. BY E. ESTILLER. 30 JAN 2018
© Semiconductor Components Industries, LLC, 2018
January, 2018 − Rev. AS Case Outline Number
:
31
8
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