LM70 Datasheet by Texas Instruments

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LM70 SPI/MICROWIRE 10-Bit plus Sign Digital Temperature Sensor

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1FEATURES DESCRIPTION

2• 0.25°C Temperature Resolution. The LM70 is a temperature sensor, Delta-Sigma

• Shutdown Mode Conserves Power Between analog-to-digital converter with an SPI and

Temperature Reading MICROWIRE compatible interface available in WSON

• SPI and MICROWIRE Bus Interface and VSSOP 8-pin packages. The host can query the

LM70 at any time to read temperature. A shutdown

• VSSOP-8 and WSON-8 Packages Save Space mode decreases power consumption to less than 10

• UL Recognized Component µA. This mode is useful in systems where low

average power consumption is critical.

APPLICATIONS The LM70 has 10-bit plus sign temperature resolution

• System Thermal Management (0.25°C per LSB) while operating over a temperature

• Personal Computers range of −55°C to +150°C.

• Disk Drives The LM70's 2.65V to 5.5V supply voltage range, low

• Office Electronics supply current and simple SPI interface make it ideal

for a wide range of applications. These include

• Electronic Test Equipment thermal management and protection applications in

hard disk drives, printers, electronic test equipment,

KEY SPECIFICATIONS and office electronics.

• Supply Voltage 2.65V to 5.5V

• Supply Current

– Operating

– 260 μA (typ)

– 490 μA (max)

– Shutdown

– 12 μA (typ)

• Temperature Accuracy

–−40°C to 85°C, ±2°C(max)

–−10°C to 65°C, +1.5/−2°C(max)

–−55°C to 125°C, +3/−2°C(max)

–−55°C to 150°C, +3.5/−2°C(max)

Please be aware that an important notice concerning availability, standard warranty, and use in critical applications of

Texas Instruments semiconductor products and disclaimers thereto appears at the end of this data sheet.

2All trademarks are the property of their respective owners.

Products conform to specifications per the terms of the Texas

Instruments standard warranty. Production processing does not

necessarily include testing of all parameters.

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Simplified Block Diagram

Connection Diagram

Top View Top View

Figure 1. VSSOP-8 Package Figure 2. WSON-8 Package

See Package Number DGK0008A See Package Number NGK0008A

PIN DESCRIPTIONS

VSSOP-8 WSON-8

Pin Name Description Typical Connection

Pin No. Pin No.

SI/O 1 1 Input/Output - Serial bus bi-directional data line. From and to Controller

Schmitt trigger input.

SC 2 3 Clock - Serial bus clock Schmitt trigger input line. From Controller

GND 4 7 Power Supply Ground Ground

V+5 5 Positive Supply Voltage Input DC Voltage from 2.65V to 5.5V. Bypass with a

0.1 μF ceramic capacitor.

CS 7 8 Chip Select input. From Controller

NC 3, 6, 8 2, 4, 6 No Connect These pins are not connected to the LM70 die

in any way.

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Typical Application

Figure 3. COP Microcontroller Interface

These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam

during storage or handling to prevent electrostatic damage to the MOS gates.

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Absolute Maximum Ratings(1)

Supply Voltage −0.3V to 6.0V

Voltage at any Pin −0.3V to V++ 0.3V

Input Current at any Pin(2) 5 mA

Package Input Current(2) 20 mA

Storage Temperature −65°C to +150°C

Soldering Information, Lead Temperature

VSSOP-8 and WSON-8 Packages(3)

Vapor Phase (60 seconds) 215°C

Infrared (15 seconds) 220°C

ESD Susceptibility(4)

Human Body Model 3000V

Machine Model 300V

(1) Absolute Maximum Ratings indicate limits beyond which damage to the device may occur. DC and AC electrical specifications do not

apply when operating the device beyond its rated operating conditions.

(2) When the input voltage (VI) at any pin exceeds the power supplies (VI< GND or VI> +VS) the current at that pin should be limited to 5

mA. The 20 mA maximum package input current rating limits the number of pins that can safely exceed the power supplies with an input

current of 5 mA to four.

(3) See the section titled “Surface Mount” found in a current Linear Data Book for other methods of soldering surface mount devices.

(4) Human body model, 100 pF discharged through a 1.5 kΩresistor. Machine model, 200 pF discharged directly into each pin.

Operating Ratings

Specified Temperature Range TMIN to TMAX

See(1) −55°C to +150°C

Supply Voltage Range (+VS) +2.65V to +5.5V

(1) The life expectancy of the LM70 will be reduced when operating at elevated temperatures. LM70 θJA (thermal resistance, junction-to-

ambient) when attached to a printed circuit board with 2 oz. foil is summarized in the table below:Device Number LM70CILD Thermal

Resistance (θJA), 51.3°C/W, Device Number LM70CIMM Thermal Resistance (θJA), 200°C/W

Temperature-to-Digital Converter Characteristics

Unless otherwise noted, these specifications apply for V+= 2.65V to 3.6V for the LM70-3 and V+= 4.5V to 5.5V for the LM70-

5(1).Boldface limits apply for TA= TJ= TMIN to TMAX;all other limits TA= TJ=+25°C, unless otherwise noted.

LM70-5 LM70-3 Units

Parameter Test Conditions Typical(2) Limits(3) Limits(3) (Limit)

Temperature Error(1) TA=−10°C to +65°C +1.5/−2.0 +1.5/−2.0 °C (max)

TA=−40°C to +85°C ±2.0 ±2.0 °C (max)

TA=−55°C to +125°C +3.0/−2.0 +3.0/−2.0 °C (max)

TA=−55°C to +150°C +3.5/−2.0 +3.5/−2.0 °C (max)

Resolution 11 Bits

0.25 °C

Temperature Conversion Time See(4) 140 210 210 ms (max)

Quiescent Current Serial Bus Inactive 260 490 490 μA (max)

Serial Bus Active 260 μA

Shutdown Mode 12 μA

(1) Both part numbers of the LM70 will operate properly over the V+supply voltage range of 2.65V to 5.5V. The temperature error for

temperature ranges of −10°C to +65°C, −40°C to +85°C, −55°C to +125°C and −55°C to +150°C include error induced by power supply

variation of ±5% from the nominal value. Temperature error will increase by ±0.3°C for a power supply voltage (V+) variation of ±10%

from the nominal value.

(2) Typicals are at TA= 25°C and represent most likely parametric norm.

(3) Limits are guaranteed to AOQL (Average Outgoing Quality Level).

(4) This specification is provided only to indicate how often temperature data is updated. The LM70 can be read at any time without regard

to conversion state (and will yield last conversion result). A conversion in progress will not be interrupted. The output shift register will be

updated at the completion of the read and a new conversion restarted.

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Logic Electrical Characteristics Digital DC Characteristics

Unless otherwise noted, these specifications apply for V+= 2.65V to 3.6V for the LM70-3 and V+= 4.5V to 5.5V for the LM70-

5. Boldface limits apply for TA= TJ= TMIN to TMAX;all other limits TA= TJ=+25°C, unless otherwise noted.

Units

Parameter Test Conditions Typical(1) Limits(2) (Limit)

VIN(1) Logical “1” Input Voltage V+× 0.7 V (min)

V++ 0.3 V (max)

VIN(0) Logical “0” Input Voltage −0.3 V (min)

V+× 0.3 V (max)

Input Hysteresis Voltage V+= 2.65V to 3.6V 0.8 0.27 V (min)

V+= 4.5V to 5.5V 0.8 0.35 V (min)

IIN(1) Logical “1” Input Current VIN = V+0.005 3.0 μA (max)

IIN(0) Logical “0” Input Current VIN = 0V −0.005 −3.0 μA (min)

CIN All Digital Inputs 20 pF

VOH High Level Output Voltage IOH =−400 μA2.4 V (min)

VOL Low Level Output Voltage IOL = +2 mA 0.4 V (max)

IO_TRI-STATE TRI-STATE Output Leakage Current VO= GND −1μA (min)

VO= V++1 μA (max)

(1) Typicals are at TA= 25°C and represent most likely parametric norm.

(2) Limits are guaranteed to AOQL (Average Outgoing Quality Level).

Logic Electrical Characteristics Serial Bus Digital Switching Characteristics

Unless otherwise noted, these specifications apply for V+= 2.65V to 3.6V for the LM70-3 and V+= 4.5V to 5.5V for the LM70-

5, CL(load capacitance) on output lines = 100 pF unless otherwise specified. Boldface limits apply for TA= TJ= TMIN to

TMAX;all other limits TA= TJ= +25°C, unless otherwise noted.

Units

Parameter Test Conditions Typical(1) Limits(2) (Limit)

t1SC (Clock) Period 0.16 μs (min)

DC (max)

t2CS Low to SC (Clock) High Set-Up Time 100 ns (min)

t3CS Low to Data Out (SO) Delay 70 ns (max)

t4SC (Clock) Low to Data Out (SO) Delay 70 ns (max)

t5CS High to Data Out (SO) TRI-STATE 200 ns (min)

t6SC (Clock) High to Data In (SI) Hold Time 60 ns (min)

t7Data In (SI) Set-Up Time to SC (Clock) High 30 ns (min)

(1) Typicals are at TA= 25°C and represent most likely parametric norm.

(2) Limits are guaranteed to AOQL (Average Outgoing Quality Level).

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Timing Diagrams

Figure 4. Data Output Timing Diagram

Figure 5. TRI-STATE Data Output Timing Diagram

Figure 6. Data Input Timing Diagram

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Figure 7. Temperature-to-Digital Transfer Function (Non-linear scale for clarity)

Figure 8. TRI-STATE Test Circuit

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Typical Performance Characteristics

Average Power-On Reset Voltage vs Temperature Static Supply Current vs Temperature

Figure 9. Figure 10.

Temperature Error

Figure 11.

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FUNCTIONAL DESCRIPTION

The LM70 temperature sensor incorporates a band-gap type temperature sensor and 10-bit plus sign ΔΣ ADC

(Delta-Sigma Analog-to-Digital Converter). Compatibility of the LM70's three wire serial interface with SPI and

MICROWIRE allows simple communications with common microcontrollers and processors. Shutdown mode can

be used to optimize current drain for different applications. A manufacture's ID register identifies the LM70 as a

TI product.

POWER UP AND POWER DOWN

The LM70 always powers up in a known state. The power up default condition is continuous conversion mode.

Immediatly after power up the LM70 will output an erroneous code until the first temperature conversion has

completed.

When the supply voltage is less than about 1.6V (typical), the LM70 is considered powered down. As the supply

voltage rises above the nominal 1.6V power up threshold, the internal registers are reset to the power up default

state described above.

SERIAL BUS INTERFACE

The LM70 operates as a slave and is compatible with SPI or MICROWIRE bus specifications. Data is clocked

out on the falling edge of the serial clock (SC), while data is clocked in on the rising edge of SC. A complete

transmit/receive communication will consist of 32 serial clocks. The first 16 clocks comprise the transmit phase of

communication, while the second 16 clocks are the receive phase.

When CS is high SI/O will be in TRISTATE. Communication should be initiated by taking chip select (CS) low.

This should not be done when SC is changing from a low to high state. Once CS is low the serial I/O pin (SI/O)

will transmit the first bit of data. The master can then read this bit with the rising edge of SC. The remainder of

the data will be clocked out by the falling edge of SC. Once the 14 bits of data (one sign bit, ten temperature bits

and 3 high bits) are transmitted the SI/O line will go into TRI-STATE. CS can be taken high at any time during

the transmit phase. If CS is brought low in the middle of a conversion the LM70 will complete the conversion and

the output shift register will be updated after CS is brought back high.

The receive phase of a communication starts after 16 SC periods. CS can remain low for 32 SC cycles. The

LM70 will read the data available on the SI/O line on the rising edge of the serial clock. Input data is to an 8-bit

shift register. The part will detect the last eight bits shifted into the register. The receive phase can last up to 16

SC periods. All ones must be shifted in order to place the part into shutdown. A zero in any location will take the

LM70 out of shutdown. The following codes only should be transmitted to the LM70:

• 00 hex (normal operation)

• 01 hex (normal operation)

• 03 hex (normal operation)

• 07 hex (normal operation)

• 0F hex (normal operation)

• 1F hex (normal operation)

• 3F hex(normal operation)

• 7F hex(normal operation)

• FF hex (Shutdown, transmit manufacturer's ID)

any others may place the part into a Test Mode. Test Modes are used by TI to thoroughly test the function of the

LM70 during production testing. Only eight bits have been defined above since only the last eight transmitted,

before CS is taken HIGH, are detected by the LM70

The following communication can be used to determine the Manufacturer's/Device ID and then immediately place

the part into continuous conversion mode. With CS continuously low:

• Read 16 bits of temperature data

• Write 16 bits of data commanding shutdown

• Read 16 bits of Manufacture's/Device ID data

• Write 8 to 16 bits of data commanding Conversion Mode

• Take CS HIGH.

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Note that 210 ms will have to pass for a conversion to complete before the LM70 actually transmits temperature

data.

TEMPERATURE DATA FORMAT

Temperature data is represented by a 11-bit, two's complement word with an LSB (Least Significant Bit) equal to

0.25°C:

Digital Output

Temperature Binary Hex

+150°C 0100 1011 0001 1111 4B 1Fh

+125°C 0011 1110 1001 1111 3E 9Fh

+25°C 0000 1100 1001 1111 0B 9Fh

+0.25°C 0000 0000 0011 1111 00 3Fh

0°C 0000 0000 0001 1111 00 1Fh

−0.25°C 1111 1111 1111 1111 FF FFh

−25°C 1111 0011 1001 1111 F3 9Fh

−55°C 1110 0100 1001 1111 E4 9Fh

Note: The last two bits are TRI-STATE and depicted as one in the table.

The first data byte is the most significant byte with most significant bit first, permitting only as much data as

necessary to be read to determine temperature condition. For instance, if the first four bits of the temperature

data indicate an overtemperature condition, the host processor could immediately take action to remedy the

excessive temperatures.

SHUTDOWN MODE/MANUFACTURER'S ID

Shutdown mode is enabled by writing XX FF to the LM70 as shown in Figure 14c. and discussed in Section 1.2.

The serial bus is still active when the LM70 is in shutdown. Current draw drops to less than 10 µA between serial

communications. When in shutdown mode the LM70 always will output 1000 0001 0000 00XX. This is the

manufacturer's ID/Device ID information. The first 5-bits of the field (1000 0XXX) are reserved for manufacturer's

ID.

INTERNAL REGISTER STRUCTURE

The LM70 has three registers, the temperature register, the configuration register and the manufacturer's/device

identification register. The temperature and manufacturer's/device identification registers are read only. The

configuration register is write only.

CONFIGURATION REGISTER

(Selects shutdown or continuous conversion modes):

Table 1. (Write Only):

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

X X X X X X X X Shutdown

D0-D15 set to XX FF hex enables shutdown mode.

D0-D15 set to XX 00 hex enables continuous conversion mode.

Note: setting D0-D15 to any other values may place the LM70 into a manufacturer's test mode, upon which the

LM70 will stop responding as described. These test modes are to be used for production testing only. See

Section 1.2 Serial Bus Interface for a complete discussion.

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TEMPERATURE REGISTER

Table 2. (Read Only):

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

MSB Bit 9 Bit 8 Bit 7 Bit 6 Bit 5 Bit 4 Bit 3 Bit 2 Bit 1 LSB 1 1 1 X X

D0–D1: Undefined. TRI-STATE will be output on SI/0.

D2–D4: Always set high.

D5–D15: Temperature Data. One LSB = 0.25°C. Two's complement format.

MANUFACTURER'S/DEVICE ID REGISTER

Table 3. (Read Only):

D15 D14 D13 D12 D11 D10 D9 D8 D7 D6 D5 D4 D3 D2 D1 D0

10000001000000XX

D0–D1: Undefined. TRI-STATE will be output on SI/0.

D2-D4: Always set LOW.

D5–D15: Manufacturer's ID Data. This register is accessed whenever the LM70 is in shutdown mode.

Serial Bus Timing Diagrams

Figure 12. a) Reading Continuous Conversion - Single Eight-Bit Frame

Figure 13. b) Reading Continuous Conversion - Two Eight-Bit Frames

Figure 14. c) Writing Shutdown Control

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Application Hints

To get the expected results when measuring temperature with an integrated circuit temperature sensor like the

LM70, it is important to understand that the sensor measures its own die temperature. For the LM70, the best

thermal path between the die and the outside world is through the LM70's pins. In the VSSOP-8 package the

ground pin is connected to the back side of the LM70 die and thus has the most effect on the die temperature.

Although the other pins will also have some effect on the LM70die temperature and therefore should not be

discounted. The LM70 will provide an accurate measurement of the temperature of the printed circuit board on

which it is mounted, because the pins represent a good thermal path to the die. A less efficient thermal path

exists between the plastic package and the LM70 die. If the ambient air temperature is significantly different from

the printed circuit board temperature, it will have a small effect on the measured temperature.

In probe-type applications, the LM70 can be mounted inside a sealed-end metal tube, and can then be dipped

into a bath or screwed into a threaded hole in a tank. As with any IC, the LM70 and accompanying wiring and

circuits must be kept insulated and dry, to avoid leakage and corrosion. This is especially true if the circuit may

operate at cold temperatures where condensation can occur. Printed-circuit coatings and varnishes such as

Humiseal and epoxy paints or dips are often used to insure that moisture cannot corrode the LM70 or its

connections.

Typical Applications

Figure 15. Temperature Monitor Using Intel 196 Processor

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Figure 16. LM70 Digital Input Control Using Micro-Controller's General Purpose I/O

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REVISION HISTORY

Changes from Revision F (March 2013) to Revision G Page

• Changed layout of National Data Sheet to TI format .......................................................................................................... 13

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PACKAGE OPTION ADDENDUM

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Addendum-Page 1

PACKAGING INFORMATION

Orderable Device Status

(1)

Package Type Package

Drawing Pins Package

Qty Eco Plan

(2)

Lead finish/

Ball material

(6)

MSL Peak Temp

(3)

Op Temp (°C) Device Marking

(4/5)

Samples

LM70CILD-3/NOPB ACTIVE WSON NGK 8 1000 RoHS & Green SN Level-3-260C-168 HR -55 to 150 T33

LM70CILD-5/NOPB ACTIVE WSON NGK 8 1000 RoHS & Green SN Level-3-260C-168 HR -55 to 150 T35

LM70CILDX-3/NOPB ACTIVE WSON NGK 8 4500 RoHS & Green SN Level-3-260C-168 HR -55 to 150 T33

LM70CIMM-3 NRND VSSOP DGK 8 1000 Non-RoHS

& Green Call TI Level-1-260C-UNLIM -55 to 150 T04C

LM70CIMM-3/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 150 T04C

LM70CIMM-5 NRND VSSOP DGK 8 1000 Non-RoHS

& Green Call TI Level-1-260C-UNLIM -55 to 150 T03C

LM70CIMM-5/NOPB ACTIVE VSSOP DGK 8 1000 RoHS & Green SN Level-1-260C-UNLIM -55 to 150 T03C

LM70CIMMX-3/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -55 to 150 T04C

LM70CIMMX-5/NOPB ACTIVE VSSOP DGK 8 3500 RoHS & Green SN Level-1-260C-UNLIM -55 to 150 T03C

(1) The marketing status values are defined as follows:

ACTIVE: Product device recommended for new designs.

LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.

NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.

PREVIEW: Device has been announced but is not in production. Samples may or may not be available.

OBSOLETE: TI has discontinued the production of the device.

(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance

do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may

reference these types of products as "Pb-Free".

RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.

Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based

flame retardants must also meet the <=1000ppm threshold requirement.

(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.

(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.

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Addendum-Page 2

(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation

of the previous line and the two combined represent the entire Device Marking for that device.

(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two

lines if the finish value exceeds the maximum column width.

Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information

provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and

continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.

TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.

In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.

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PACKAGE MATERIALS INFORMATION

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TAPE AND REEL INFORMATION

Reel Width (W1)

REEL DIMENSIONS

Dimension designed to accommodate the component length

Dimension designed to accommodate the component thickness

Overall width of the carrier tape

Pitch between successive cavity centers

Dimension designed to accommodate the component width

TAPE DIMENSIONS

K0 P1

B0 W

Cavity

QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE

Pocket Quadrants

Sprocket Holes

Q1 Q1Q2 Q2

Q3 Q3Q4 Q4 User Direction of Feed

Reel

Diameter

*All dimensions are nominal

Device Package

Type Package

Drawing Pins SPQ Reel

Diameter

(mm)

Reel

Width

W1 (mm)

(mm) B0

(mm) K0

(mm) P1

(mm) W

(mm) Pin1

Quadrant

LM70CILD-3/NOPB WSON NGK 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1

LM70CILD-5/NOPB WSON NGK 8 1000 178.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1

LM70CILDX-3/NOPB WSON NGK 8 4500 330.0 12.4 3.3 3.3 1.0 8.0 12.0 Q1

LM70CIMM-3 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM70CIMM-3/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM70CIMM-5 VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM70CIMM-5/NOPB VSSOP DGK 8 1000 178.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM70CIMMX-3/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

LM70CIMMX-5/NOPB VSSOP DGK 8 3500 330.0 12.4 5.3 3.4 1.4 8.0 12.0 Q1

Pack Materials-Page 1

PACKAGE MATERIALS INFORMATION

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TAPE AND REEL BOX DIMENSIONS

Width (mm)

*All dimensions are nominal

Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)

LM70CILD-3/NOPB WSON NGK 8 1000 367.0 367.0 35.0

LM70CILD-5/NOPB WSON NGK 8 1000 367.0 367.0 35.0

LM70CILDX-3/NOPB WSON NGK 8 4500 356.0 356.0 35.0

LM70CIMM-3 VSSOP DGK 8 1000 208.0 191.0 35.0

LM70CIMM-3/NOPB VSSOP DGK 8 1000 208.0 191.0 35.0

LM70CIMM-5 VSSOP DGK 8 1000 208.0 191.0 35.0

LM70CIMM-5/NOPB VSSOP DGK 8 1000 208.0 191.0 35.0

LM70CIMMX-3/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

LM70CIMMX-5/NOPB VSSOP DGK 8 3500 367.0 367.0 35.0

Pack Materials-Page 2

r15: 1 43x 9 51 I] mill] DIMENSIONS ARE IN NILLINEI'ERS ex 0 2514 L tax a 5 REcomEMJED LAND PATTERN T ‘ ‘ rwm ww we so rm :ws \ \ ,,7.7,, A 2; \ \m , 4 Eézzﬁsséfsz; ‘” Lﬁ, \ mum/H“, u hyé/{Ifffﬁff ié2;:;z;;:;z;2; ’ x V m, (”WM/Mm Wt ‘0/77777i7,7,7 me‘ U m [HE] E 7 JL \ ‘5 iexoawx ” 3:“ A sxozwoos ‘ ‘ (NT lay—1J0 To 1 L—+exm Lug—4 ' TEXAS INSTRUMENTS

MECHANICAL DATA

NGK0008A

www.ti.com

LDA08A (Rev C)

MECHANICAL DATA DGK (S—PDSO—GS) PLASTIC SMALL—OUTLINE PACKAGE m1 WW“: {[0 VAX % j 3,010 I 4073329/E 05/06 NO'ES' A AH imec' dimensmrs c'e m m'hmeiers 5 Th: drawing is enmec: :e change within: nciice. Body icnqth Coos mi mciucc maid Hash, protrusions or we tms Mom 'iush, aromons, ov qaw burrs shaH m exceed 015 per end b Budy mm does not wcude inierieud ﬂasi‘ inieriead ‘iush s'mii 'mi exceed 050 pe' we : FuHs wiUHn JEDEC M0487 quulion AA, except 'vievieud ricer INSTRUMENTS w. (i. com

LAND PATTERN DATA DGK (37PD30708) PLASTIC SMALL OUTLINE PACKAGE Exampie Board Layout Exampie stencii Openings Based on a stencii thickness of .127mm L005inch), (See Nate 0) (,0 65) TYP ‘ Li 5 LLLLL L, pm ,,,,, PKG PKG "\ i i 4 — ----- i — ----- i D DU D i i ’ PKG PKG Q G . / Exampie , Non Soldermusk Deﬁned Pad i , , —\ L A ~/ ‘\ Example \ Spider Musk Opening / +1 1‘(0,45) ‘ (See Note E) t 1 (1,45) < ‘="" \pud="" geometry="" ’="" (see="" note="" c)="" \="" +ii¢="" (0,05)="" \="" ah="" around="" «="" ,="" \="" e="" ’="" i="" ‘\-=""> muss/A 11/13 NOTES: A. Ali iinear dimensions are in miilimeters. a. This drawing is subject ta change without natiee, C, Publication |PCi7351 is recommended ior alternate designsu a. Laser cutting apertures with trapezoidui walls and aisa rounding corners w‘iH oﬂer eetter paste veiease. Customers snouid Contact their board ussembiy site for stencii design recommendations. Rater tn IFS—7525 for other slenci'i recummendutions. Customers should Contact their tmurd fabrication site for solder musk tolerances between and around signal pads. .r'I {I TEXAS INSTRUMENTS www.li.com

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LM70 Datasheet by Texas Instruments

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