BK2-M Series Datasheet by YAGEO

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DATA SHEET
SPARK GAP PROTECTORS
POWER SUPPLIES
BK2-M series
RoHS compliant & Halogen free
Product specification February 23, 2021 V.1
YAGEO Circuit Protection \ srnnxunr A T ®®®GD
Product Specification
BK2-M SERIES
SPARK GAP
Circuit Protection
www.yageo.com
Feb. 23, 2021 V.0
Spark Gap (SPG) Data Sheet
Features
Approximately zero leaking current before clamping voltage
Less decay at on/off state.
High capability to withstand repeated lightning strikes.
Low electrode capacitance(≤0.8pF) and high isolation(≥100MΩ).
RoHS compliant.
Bilateral symmetrical.
Temperature, humidity and lightness insensitive.
Operating temperature: -40 ~ +85
Storage temperature: -40 ~ +125
Meets MSL level 1, per J-STD-020
Safety certification: UL
Applications
Power Supplies
Motor sparks eliminating
Relay switching spark absorbing
Data line pulse guarding
Electronic devices requiring UL497A and UL497B compliant
Telephone/Fax/Modem
High frequency signal transmitters/receivers
Satellite antenna
Radio amplifiers
Alarm systems
Cathode ray tubes in Monitors/TVs
Dimensions
Dd
t
LRecommended Pad Size(mm)
2.0 2.8
2.0
2.0
Symbol
Dimension (mm)
L
5.0±0.5
D
Φ2.8±0.5
d
Φ2.6±0.5
t
0.4±0.1
YAGEO Circuit Protection \ srnnxnnr 500V/S(V521000V). temperature/2 HRS. temperature/2 HRS. 11000 HRS & normal temperature/2 HRS. ®®©® W
Product Specification
BK2-M SERIES
SPARK GAP
Circuit Protection
www.yageo.com
Feb. 23, 2021 V.0
Electrical Characteristics
Part Number
DC
Spark-over
Voltage
Minimum
Insulation Resistance
Maximum
Capacitance
(1KHz-6VMAX)
Surge Current
Capacity
(8/20μs)
Vs(V)
Test Voltage(V)
IROHM(MΩ)
C(pf)
BK22000702-M
140±20%
50
100
0.8
1000A
BK23000702-M
140±30%
50
100
0.8
1000A
BK22001002-M
200±20%
100
100
0.8
1000A
BK22001102-M
220±20%
100
100
0.8
1000A
BK22001502-M
300±20%
100
100
0.8
1000A
BK22002002-M
400±20%
250
100
0.8
1000A
BK22002502-M
500±20%
250
100
0.8
1000A
BK22003002-M
600±20%
250
100
0.8
1000A
BK22003502-M
700±20%
250
100
0.8
1000A
BK22005002-M
1000±20%
500
100
0.8
1000A
Test Methods and Results
Items
Test Method
Standard
DC Spark-over
Voltage
Measure starting discharge voltage (Vs) by
gradually increasing applied DC voltage. Test
current is 0.5mA max. And the DC voltage
ascends up within 100V/s(Vs1000V) or
500V/s(Vs≥1000V).
Meet specified value.
Insulation
Resistance
Measure the insulation resistance across the
terminal at regular voltage. But the test voltage
doesn’t over the DC spark-over voltage.
Capacitance
Measure the electrostatic capacitance by
applying a voltage of less than 6V (at 1KHz)
between terminals.
Static Life
10KV with 1500pf condenser is discharged
through 0Ω resistor. 200 times at an interval of
10sec.
Rate-of-change, within ±30%
insulation resistance & capacitance,
conformed to rated spec.
Surge Current
Capacity
1.2/50μs & 8/20μs, 1000A, electrically
connected with a resistor (1~2Ω), ±5 times,
each time interval 60 seconds. Thereafter,
outer appearance shall be visually examined.
No crack and no failures
Cold Resistance
Measurement after -40/1000 HRS & normal
temperature/2 HRS.
Features are conformed to rated
spec.
Heat Resistance
Measurement after 125/1000 HRS & normal
temperature/2 HRS.
Humidity Resistance
Measurement after humidity 90~95(45)
/1000 HRS & normal temperature/2 HRS.
Temperature Cycle
10 times repetition of cycle -40/30min
normal, temp/2 min 125/30min,
measurement after normal temp/2 HRS.
Solder Ability
Apply flux and immerse in molten solder
230±5 for 3sec up to the point of 1.5mm
from body. Check for solder adhesion.
Lead wire is evenly covered by
solder.
Solder Heat
Measurement after lead wire is dipped up to
the point of 1.5mm from body into 260±5
solder for 10sec.
Conformed to rated spec.
YAGEO Circuit Protection an 4 \ srnnxunr r T ‘/ 1 A L—J L—J ®®®GD
Product Specification
BK2-M SERIES
SPARK GAP
Circuit Protection
www.yageo.com
Feb. 23, 2021 V.0
Recommended Soldering Conditions
Flow Soldering Conditions
Reflow Soldering Conditions
Air Priheat Soldering Cooling
Temperature ()
250
200
150
100
50
0
60~120 sec 3~4 sec
150~180
T
260
Air Priheat Soldering Cooling
Temperature ()
250
200
150
100
50
0
60~120 sec 10 sec. or less
150~180
T
260
60 sec. or less
1) Time shown in the above figures is measured from the point when chip surface reaches temperature.
2) Temperature difference in high temperature part should be within 110.
3) After soldering, do not force cool, allow the parts to cool gradually.
Hand Soldering
Solder iron temperature: 350±5
Heating time: 3 seconds max.
General attention to soldering
High soldering temperatures and long soldering times can cause leaching of the termination, decrease in
adherence strength, and the change of characteristic may occur.
For soldering, please refer to the soldering curves above. However, please keep exposures to temperatures
exceeding 200 to fewer than 50 seconds.
Please use a mild flux (containing less than 0.2wt% CI). Also, if the flux is water soluble, be sure to wash
thoroughly to remove any residue from the underside of components that could affect resistance.
Cleaning
When using ultrasonic cleaning, the board may resonate if the output power is too high. Since this vibration
can cause cracking or a decrease in the adherence of the termination, we recommend that you use the
conditions below.
Frequency: 40kHz max.
Output power: 20W/liter
Cleaning time: 5 minutes max.
YAGEO Circuit Protection \ srnnuunr \ m ®®®®
Product Specification
BK2-M SERIES
SPARK GAP
Circuit Protection
www.yageo.com
Feb. 23, 2021 V.0
Packaging
Tape
P0 P1 D0 E
FW
T
B0
K0D1
B
B
SECTION B-B
A A
A0
SECTION A-A
P2
Symbol
Dimension (mm)
W
12.00±0.20
P0
4.00±0.10
P1
4.00±0.10
P2
2.00±0.10
D0
Φ1.5±0.10
D1
Φ1.5±0.10
E
1.75±0.10
F
5.50±0.05
A0
3.00±0.10
B0
6.00±0.10
K0
3.00±0.10
T
0.30±0.05
Reel
DL
d
D
178.0±3.0
d
13.0±1.0
L
15.0±3.0
Quantity: 1500PCS