TL331B,TL391B,TL331 Datasheet by Texas Instruments

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TL331B, TL391B and TL331 Single Comparators
1 Features
NEW TL331B and TL391B
Improved specifications of B-version
Maximum rating: up to 38 V
ESD rating (HBM): 2k V
Improved reverse voltage performance
Low input offset: 0.37 mV
Low input bias current: 3.5 nA
Low supply-current: 430 µA
Faster response time of 1 µsec
TL391B provides an alternate pinout
TL331B is improved drop-in replacement for
TL331
Common-mode input voltage range includes
ground
Differential input voltage range equal to maximum-
rated supply voltage: ±38 V
Low output saturation voltage
Output compatible with TTL, MOS, and CMOS
2 Applications
Vacuum robot
Single phase UPS
Server PSU
Cordless power tool
Wireless infrastructure
Appliances
Building automation
Factory automation & control
Motor drives
Infotainment & cluster
3 Description
The TL331B and TL391B devices are the next
generation versions of the industry-standard TL331
comparator. These next generation devices provide
outstanding value for cost-sensitive applications, with
features including lower offset voltage, higher supply
voltage capability, lower supply current, lower input
bias current, lower propagation delay, wider
temperature range and improved 2kV ESD
performance with drop-in replacement convenience.
The TL331B is a drop-in improved replacement for
both the TL331I and TL331K versions, while the
TL391B provides an alternate pinout of the TL331B to
replace competitive devices.
Operation from dual supplies also is possible as long
as the difference between the two supplies is within 2
V to 36 V, and VCC is at least 1.5 V more positive
than the input common-mode voltage. Current drain is
independent of the supply voltage. The outputs can
be connected to other open-collector outputs to
achieve wired-AND relationships.
Device Information
PART NUMBER(1) PACKAGE BODY SIZE (NOM)
TL331,
TL331B,
TL391B
SOT-23 (5) 2.90 mm × 1.60 mm
(1) For all available packages, see the orderable addendum at
the end of the data sheet
Family Comparison Table
Specification TL331B
TL391B TL331I TL331K Units
Supply Votlage 2 to 36 2 to 36 2 to 36 V
Total Supply Current (5V to 36V max) 0.43 0.7 0.7 mA
Temperature Range −40 to 125 -40 to 85 -40 to 105 °C
ESD (HBM) 2000 1000 1000 V
Offset Voltage (Max over temp) ± 4 ± 9 ± 9 mV
Input Bias Current (typ / max) 3.5 / 25 25 / 250 25 / 250 nA
Response Time (typ) 1 1.3 1.3 µsec
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An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
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Table of Contents
1 Features............................................................................1
2 Applications..................................................................... 1
3 Description.......................................................................1
4 Revision History.............................................................. 2
5 Pin Configuration and Functions...................................3
Pin Functions.................................................................... 3
6 Specifications.................................................................. 4
6.1 Absolute Maximum Ratings, TL331 and TL331K....... 4
6.2 Absolute Maximum Ratings, TL331B and TL391B..... 4
6.3 ESD Ratings, TL331 and TL331K...............................5
6.4 ESD Ratings, TL331B and TL391B............................ 5
6.5 Recommended Operating Conditions, TL331
and TL331K...................................................................5
6.6 Recommended Operating Conditions, TL331B
and TL391B...................................................................5
6.7 Thermal Information....................................................5
6.8 Electrical Characteristics, TL331B and TL391B......... 6
6.9 Switching Characteristics, TL331B and TL391B.........6
6.10 Electrical Characteristics, TL331 and TL331K..........7
6.11 Switching Characteristics, TL331 and TL331K......... 7
6.12 Typical Characteristics, TL331 and TL331K............. 8
6.13 Typical Characteristics, TL331B and TL391B...........9
7 Detailed Description......................................................15
7.1 Overview................................................................... 15
7.2 Functional Block Diagram......................................... 15
7.3 Feature Description...................................................15
7.4 Device Functional Modes..........................................15
8 Application and Implementation.................................. 16
8.1 Application Information............................................. 16
8.2 Typical Application.................................................... 16
9 Power Supply Recommendations................................18
10 Layout...........................................................................18
10.1 Layout Guidelines................................................... 18
10.2 Layout Example...................................................... 18
11 Device and Documentation Support..........................19
11.1 Documentation Support.......................................... 19
11.2 Receiving Notification of Documentation Updates.. 19
11.3 Support Resources................................................. 19
11.4 Trademarks............................................................. 19
11.5 Electrostatic Discharge Caution.............................. 19
11.6 Glossary.................................................................. 19
12 Mechanical, Packaging, and Orderable
Information.................................................................... 19
4 Revision History
NOTE: Page numbers for previous revisions may differ from page numbers in the current version.
Changes from Revision I (August 2020) to Revision J (November 2020) Page
Changed TL331B and TL391B minimum recommended supply voltage to 2V throughout................................1
Corrected Family Comparison Table supply voltages for "B", "K" and "I" versions.............................................1
Updated Supply Voltage vs Supply Current Typical Graph for 2V......................................................................9
Changes from Revision H (April 2020) to Revision I (August 2020) Page
Updated the numbering format for tables, figures, and cross-references throughout the document..................1
Added "B" device Typical Char graphs............................................................................................................... 9
Changes from Revision G (January 2015) to Revision H (April 2020) Page
Added TL331B and TL391B tables and pinouts, Updated front page for new B devices for APL......................1
Added Input current, IIK in Absolute Maximum Ratings ..................................................................................... 4
Changed incorrect TL331 and TL331K Temp Ranges in Recommended Operating Conditions ...................... 5
Changed text from: open-drain output to: open-collector output ..................................................................... 15
Removed sentence: This is enables much head room for modern day supplies of 3.3 V and 5.0 V. .............. 15
Changed the text 'The output NPN will sink current when the positive input voltage is higher than the negative
input voltage and the offset voltage' to 'The output NPN will sink current when the negative input voltage is
higher than the positive input voltage and the offset voltage.'.......................................................................... 15
Changed Output Current specifications from: to: in Design Parameters ......................................................... 16
Changed first paragraph of the Response Time section ................................................................................. 17
Added Receiving Notification of Documentation Updates section and Community Resources section........... 19
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5 Pin Configuration and Functions
1
2
3 4
5
OUT
VCC
IN+
IN-
GND
+
Note reversed inputs compared to similar common pinout
Figure 5-1. TL331, TL331B DBV Package, 5-Pin SOT-23, Top View
1
2
3 4
5
IN+
VCC
IN-
OUT
GND
+
Note reversed inputs compared to similar common pinout
Figure 5-2. TL391B DBV Package, 5-Pin SOT-23, Top View
Pin Functions
PIN
TYPE DESCRIPTIONTL331, TL331B TL391B
NAME NO. NO.
IN+ 3 4 I Positive Input
IN– 1 3 I Negative Input
OUT 4 1 O Open Collector/Drain Output
VCC 5 5 Power Supply Input
GND 2 2 — Ground
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6 Specifications
6.1 Absolute Maximum Ratings, TL331 and TL331K
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage(2) 0 36 V
VID Differential input voltage(3) –36 36 V
VIInput voltage range (either input) –0.3 36 V
VOOutput voltage 0 36 V
IOOutput current 0 20 mA
Duration of output short-circuit to ground(4) Unlimited
IIK Input current(5) –50 mA
TJOperating virtual junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) All voltage values, except differential voltages, are with respect to the network ground.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Input current flows thorough parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output
to be incorrect. Normal operation resumes when input current is removed.
6.2 Absolute Maximum Ratings, TL331B and TL391B
over operating free-air temperature range (unless otherwise noted)(1)
MIN MAX UNIT
VCC Supply voltage(2) -0.3 38 V
VID Differential input voltage(3) –38 38 V
VIInput voltage range (either input) –0.3 38 V
VOOutput voltage -0.3 38 V
IOOutput current 20 mA
Duration of output short-circuit to ground(4) Unlimited
IIK Input current(5) –50 mA
TJOperating virtual junction temperature –40 150 °C
Tstg Storage temperature –65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under
Recommended Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device
reliability.
(2) All voltage values, except differential voltages, are with respect to the network ground.
(3) Differential voltages are at IN+ with respect to IN–.
(4) Short circuits from outputs to VCC can cause excessive heating and eventual destruction.
(5) Input current flows thorough parasitic diode to ground and will turn on parasitic transistors that will increase ICC and may cause output
to be incorrect. Normal operation resumes when input current is removed.
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6.3 ESD Ratings, TL331 and TL331K
VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±1000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.4 ESD Ratings, TL331B and TL391B
VALUE UNIT
V(ESD) Electrostatic discharge Human body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000 V
Charged device model (CDM), per JEDEC specification JESD22-C101(2) ±750
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
6.5 Recommended Operating Conditions, TL331 and TL331K
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage 2 36 V
TJJunction temperature, TL331 –40 85 °C
TJJunction temperature, TL331K –40 105 °C
6.6 Recommended Operating Conditions, TL331B and TL391B
over operating free-air temperature range (unless otherwise noted)
MIN MAX UNIT
VCC Supply voltage 2 36 V
TJJunction temperature –40 125 °C
6.7 Thermal Information
THERMAL METRIC(1)
TL331,
TL331K
TL331B,
TL391B
UNIT
DBV (SOT-23) DBV (SOT-23)
5 PINS 5 PINS
RθJA Junction-to-ambient thermal resistance 218.3 211.7 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 87.3 133.6 °C/W
RθJB Junction-to-board thermal resistance 44.9 79.9 °C/W
ψJT Junction-to-top characterization parameter 4.3 56.4 °C/W
ψJB Junction-to-board characterization parameter 44.1 79.6 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report.
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TEXAS INSTRUMENTS s o PULLUP CM Vs L L TA
6.8 Electrical Characteristics, TL331B and TL391B
VS = 5 V, VCM = (V–) ; TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
VIO Input offset voltage VS = 5 to 36V –2.5 ±0.37 2.5 mV
VS = 5 to 36V, TA = –40°C to +125°C –4 4
IBInput bias current –3.5 –25 nA
TA = –40°C to +125°C –50 nA
IOS Input offset current –10 ±0.5 10 nA
TA = –40°C to +125°C –25 25 nA
VCM Input voltage range VS = 3 to 36V (V–) – 0.1 (V+) – 1.5 V
VS = 3 to 36V, TA = –40°C to +125°C (V–) – 0.05 (V+) – 2.0 V
AVD
Large signal differential voltage
amplification
VS = 15V, VO = 1.4V to 11.4V;
RL ≥ 15k to (V+) 50 200 V/mV
VOL
Low level output Voltage {swing
from (V–)}
ISINK ≤ 4mA, VID = -1V 110 400 mV
ISINK ≤ 4mA, VID = -1V
TA = –40°C to +125°C 550 mV
IOH-LKG High-level output leakage current (V+) = VO = 5 V; VID = 1V 0.1 20 nA
IOH-LKG High-level output leakage current (V+) = VO = 36V; VID = 1V; TA = –40°C to +125°C 1000 nA
IOL Low level output current VOL = 1.5V; VID = -1V; VS = 5V 6 18 mA
IQQuiescent current VS = 5 V, no load 210 330 µA
VS = 36 V, no load, TA = –40°C to +125°C 275 430 µA
6.9 Switching Characteristics, TL331B and TL391B
VS = 5V, VO_PULLUP = 5V, VCM = VS/2, CL = 15pF, RL = 5.1k Ohm, TA = 25°C (unless otherwise noted).
PARAMETER TEST CONDITIONS MIN TYP MAX UNIT
tresponse
Propagation delay time, high-to-low;
Small scale input signal (1) Input overdrive = 5mV, Input step = 100mV 1000 ns
tresponse
Propagation delay time, high-to-low;
TTL input signal (1) TTL input with Vref = 1.4V 300 ns
(1) High-to-low and low-to-high refers to the transition at the input.
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6.10 Electrical Characteristics, TL331 and TL331K
at specified free-air temperature, VCC = 5 V (unless otherwise noted)
PARAMETER TEST CONDITIONS(1) TA (3) MIN TYP MAX UNIT
VIO Input offset voltage VCC = 5 V to 30 V, VO = 1.4 V, VIC = V
IC(min)
25°C 2 5 mV
Full range 9
IIO Input offset current VO = 1.4 V 25°C 5 50 nA
Full range 250
IIB Input bias current VO = 1.4 V 25°C –25 –250 nA
Full range –400
VICR
Common-mode input voltage
range(2) Full range 0 to VCC
1.5 V
AVD
Large-signal differential voltage
amplification
VCC = 15 V, VO = 1.4 V to 11.4 V, R
L ≥ 15 kΩ to VCC
25°C 50 200 V/mV
IOH High-level output current VOH = 5 V, VID = 1 V 25°C 0.1 50 nA
VOH = 30 V, VID = 1 V Full range 1 μA
VOL Low-level output voltage IOL = 4 mA, VID = –1 V 25°C 150 400 mV
Full range 700
IOL Low-level output current VOL = 1.5 V, VID = –1 V 25°C 6 mA
ICC Supply current RL = ∞, VCC = 5 V 25°C 0.4 0.7 mA
(1) All characteristics are measured with zero common-mode input voltage, unless otherwise specified.
(2) The voltage at either input or common-mode should not be allowed to go negative by more than 0.3 V. The upper end of the common-
mode voltage range is VCC+ – 1.5 V, but either or both inputs can go to 30 V without damage.
(3) Full range TA is –40°C to +85°C for I-suffix devices and –40°C to +105°C for K-suffix devices.
6.11 Switching Characteristics, TL331 and TL331K
VCC = 5 V, TA = 25°C
PARAMETER TEST CONDITIONS TYP UNIT
Response time RL connected to 5 V through 5.1 kΩ, CL = 15 pF(1) (2) 100-mV input step with 5-mV overdrive 1.3 μs
TTL-level input step 0.3
(1) CL includes probe and jig capacitance.
(2) The response time specified is the interval between the input step function and the instant when the output crosses 1.4 V.
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6.12 Typical Characteristics, TL331 and TL331K
0.0
0.2
0.4
0.6
0.8
1.0
0 10 20 30 40
Supply Current (mA)
Vcc (V)
-40C
0C
25C
85C
125C
Figure 6-1. Supply Current vs Supply Voltage
0
10
20
30
40
50
60
70
0 8 16 24 32 40
Input Bias Current (nA)
Vcc (V)
-40C
0C
25C
85C
125C
Figure 6-2. Input Bias Current vs Supply Voltage
0.001
0.010
0.100
1.000
10.000
0.01 0.1 1 10 100
Output Low Voltage, VOL(V)
Output Sink Current, Io(mA)
-40C
0C
25C
85C
125C
Figure 6-3. Output Low Voltage vs Output Current (IOL)
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6.13 Typical Characteristics, TL331B and TL391B
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
Supply Voltage (V)
Supply Current (PA)
2 4 6 8 10 12 14 16 18 20 22 24 26 28 30 32 34 36
100
120
140
160
180
200
220
240
260
280
300
No Load, Output High
-40°C
0°C
25°C
85°C
125°C
Figure 6-4. Supply Current vs. Supply Voltage
Input Voltage (V)
Total Supply Current (PA)
-0.2 0 0.2 0.4 0.6 0.8 1 1.2 1.4 1.6 1.8 2
50
70
90
110
130
150
170
190
210
230
250
VS=3V
-40°C
0°C
25°C
85°C
125°C
Figure 6-5. Total Supply Current vs. Input Voltage at 3V
Input Voltage (V)
Total Supply Current (PA)
-0.5 0 0.5 1 1.5 2 2.5 3 3.5 4
50
70
90
110
130
150
170
190
210
230
250
VS=5V
-40°C
0°C
25°C
85°C
125°C
Figure 6-6. Total Supply Current vs. Input Voltage at 3.3V
Input Voltage (V)
Total Supply Current (PA)
-0.5 0 0.5 1 1.5 2 2.5 3 3.5 4
50
70
90
110
130
150
170
190
210
230
250
VS=5V
-40°C
0°C
25°C
85°C
125°C
Figure 6-7. Total Supply Current vs. Input Voltage at 5V
Input Voltage (V)
Total Supply Current (PA)
-1 0 1 2 3 4 5 6 7 8 9 10 11
50
70
90
110
130
150
170
190
210
230
250
VS=12V
-40°C
0°C
25°C
85°C
125°C
Figure 6-8. Total Supply Current vs. Input Voltage at 12V
Input Voltage (V)
Total Supply Current (PA)
-1 2 5 8 11 14 17 20 23 26 29 32 35
160
180
200
220
240
260
280
300
VS=36V
-40°C
0°C
25°C
85°C
125°C
Figure 6-9. Total Supply Current vs. Input Voltage at 36V
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6.13 Typical Characteristics, TL331B and TL391B (continued)
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
Supply Voltage (V)
Input Bias Current (nA)
3 6 9 12 15 18 21 24 27 30 33 36
-5
-4.5
-4
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
VCM=0V 125°C
85°C
25°C
0°C
-40°C
Figure 6-10. Input Bias Current vs. Supply Voltage
Input Voltage (V)
Input Bias Current (nA)
-0.5 0 0.5 1 1.5 2 2.5 3 3.5
-5
-4.5
-4
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
VS=5V
125°C
85°C
25°C
0°C
-40°C
Figure 6-11. Input Bias Current vs. Input Voltage at 5V
Input Voltage (V)
Input Bias Current (nA)
-0.5 0.5 1.5 2.5 3.5 4.5 5.5 6.5 7.5 8.5 9.5 10.5
-5
-4.5
-4
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
VS=12V
125°C
85°C
25°C
0°C
-40°C
Figure 6-12. Input Bias Current vs. Input Voltage at 12V
Input Voltage (V)
Input Bias Current (nA)
0 4 8 12 16 20 24 28 32 36
-5
-4.5
-4
-3.5
-3
-2.5
-2
-1.5
-1
-0.5
0
0.5
1
VS=36V
125°C
85°C
25°C
0°C
-40°C
Figure 6-13. Input Bias Current vs. Input Voltage at 36V
Supply Voltage (V)
Input Offset Voltage (mV)
3 6 9 12 15 18 21 24 27 30 33 36
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
TA = -40°C
63 Channels
Figure 6-14. Input Offset Voltage vs. Supply Voltage at -40°C
Supply Voltage (V)
Input Offset Voltage (mV)
3 6 9 12 15 18 21 24 27 30 33 36
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
TA = 25°C
63 Channels
Figure 6-15. Input Offset Voltage vs. Supply Voltage at 25°C
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6.13 Typical Characteristics, TL331B and TL391B (continued)
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
Supply Voltage (V)
Input Offset Voltage (mV)
3 6 9 12 15 18 21 24 27 30 33 36
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
TA = 85°C
63 Channels
Figure 6-16. Input Offset Voltage vs. Supply Voltage at 85°C
Supply Voltage (V)
Input Offset Voltage (mV)
3 6 9 12 15 18 21 24 27 30 33 36
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
TA = 125°C
63 Channels
Figure 6-17. Input Offset Voltage vs. Supply Voltage at 125°C
Temperature (°C)
Input Offset Voltage (mV)
-40 -25 -10 5 20 35 50 65 80 95 110 125
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
VS = 3V
63 Units
Figure 6-18. Input Offset Voltage vs. Temperature at 3V
Temperature (°C)
Input Offset Voltage (mV)
-40 -25 -10 5 20 35 50 65 80 95 110 125
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
VS = 5V
63 Units
Figure 6-19. Input Offset Voltage vs. Temperature at 5V
Temperature (°C)
Input Offset Voltage (mV)
-40 -25 -10 5 20 35 50 65 80 95 110 125
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
VS = 12V
63 Units
VS = 12V
63 Units
Figure 6-20. Input Offset Voltage vs. Temperature at 12V
Temperature (°C)
Input Offset Voltage (mV)
-40 -25 -10 5 20 35 50 65 80 95 110 125
-2
-1.5
-1
-0.5
0
0.5
1
1.5
2
VS = 36V
63 Units
Figure 6-21. Input Offset Voltage vs. Temperature at 36V
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6.13 Typical Characteristics, TL331B and TL391B (continued)
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
Output Sinking Current (A)
Output Voltage to GND (V)
10P100P1m 10m 100m
1m
10m
100m
1
10
VS = 3V
125°C
85°C
25°C
0°C
-40°C
Figure 6-22. Output Low Voltage vs. Output Sinking Current at
3V
Output Sinking Current (A)
Output Voltage to GND (V)
10P100P1m 10m 100m
1m
10m
100m
1
10
VS = 5V
125°C
85°C
25°C
0°C
-40°C
Figure 6-23. Output Low Voltage vs. Output Sinking Current at
5V
Output Sinking Current (A)
Output Voltage to GND (V)
10P100P1m 10m 100m
1m
10m
100m
1
10
VS = 12V
125°C
85°C
25°C
0°C
-40°C
Figure 6-24. Output Low Voltage vs. Output Sinking Current at
12V
Output Sinking Current (A)
Output Voltage to GND (V)
10P100P1m 10m 100m
1m
10m
100m
1
10
VS = 36V
125°C
85°C
25°C
0°C
-40°C
Figure 6-25. Output Low Voltage vs.Output Sinking Current at
36V
Temperature (°C)
Output High Leakage to GND (nA)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0.01
0.02
0.05
0.1
0.2
0.5
1
2
5
10
20
50
100
Output set high
VOUT = VS
Figure 6-26. Output High Leakage Current vs.Temperature at 5V
Temperature (°C)
Output High Leakage to GND (nA)
-40 -25 -10 5 20 35 50 65 80 95 110 125
0.01
0.02
0.05
0.1
0.2
0.5
1
2
5
10
20
50
100
Output set high
VOUT = VS
Figure 6-27. Output High Leakage Current vs. Temperature at
36V
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6.13 Typical Characteristics, TL331B and TL391B (continued)
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
Input Overdrive (mV)
Propagation Delay, High to Low (ns)
5 6 7 8 10 20 30 4050 70 100 200 300 500 1000
0
100
200
300
400
500
600
700
800
900
1000
VS = 5V
VCM = 0V
CL = 15pF
RP = 5.1k
125°C
85°C
25°C
-40°C
Figure 6-28. High to Low Propagation Delay vs. Input Overdrive
Voltage, 5V
Input Overdrive (mV)
Propagation Delay, Low to High (ns)
5 6 7 8 10 20 30 4050 70 100 200 300 500 1000
0
100
200
300
400
500
600
700
800
900
1000
VS = 5V
VCM = 0V
CL = 15pF
RP = 5.1k
125°C
85°C
25°C
-40°C
Figure 6-29. Low to High Propagation Delay vs. Input Overdrive
Voltage, 5V
Input Overdrive (mV)
Propagation Delay, High to Low (ns)
5 6 7 8 10 20 30 4050 70 100 200 300 500 1000
0
100
200
300
400
500
600
700
800
900
1000
VS = 12V
VCM = 0V
CL = 15pF
RP = 5.1k
125°C
85°C
25°C
-40°C
Figure 6-30. High to Low Propagation Delay vs. Input Overdrive
Voltage, 12V
Input Overdrive (mV)
Propagation Delay, Low to High (ns)
5 6 7 8 10 20 30 4050 70 100 200 300 500 1000
0
100
200
300
400
500
600
700
800
900
1000
VS = 12V
VCM = 0V
CL = 15pF
RP = 5.1k
125°C
85°C
25°C
-40°C
Figure 6-31. Low to High Propagation Delay vs. Input Overdrive
Voltage, 12V
Input Overdrive (mV)
Propagation Delay, High to Low (ns)
5 6 7 8 10 20 30 4050 70 100 200 300 500 1000
0
100
200
300
400
500
600
700
800
900
1000
VS = 36V
VCM = 0V
CL = 15pF
RP = 5.1k
125°C
85°C
25°C
-40°C
Figure 6-32. High to Low Propagation Delay vs. Input Overdrive
Voltage, 36V
Input Overdrive (mV)
Propagation Delay, Low to High (ns)
5 6 7 8 10 20 30 4050 70 100 200 300 500 1000
0
100
200
300
400
500
600
700
800
900
1000
VS = 36V
VCM = 0V
CL = 15pF
RP = 5.1k
125°C
85°C
25°C
-40°C
Figure 6-33. Low to High Propagation Delay vs. Input Overdrive
Voltage, 36V
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6.13 Typical Characteristics, TL331B and TL391B (continued)
TA = 25°C, VS = 5 V, RPULLUP = 5.1k, CL = 15 pF, VCM = 0 V, VUNDERDRIVE = 100 mV, VOVERDRIVE = 100 mV unless otherwise
noted.
Time (Ps)
Output Voltage (V)
-0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1
-1
0
1
2
3
4
5
6
VREF = VCC/2
20mV Overdrive
5mV
Overdrive
100mV
Overdrive
Figure 6-34. Response Time for Various Overdrives, High-to-
Low Transition
Time (Ps)
Output Voltage (V)
-0.1 0 0.1 0.2 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1 1.1
-1
0
1
2
3
4
5
6
20mV Overdrive
5mV Overdrive
100mV
Overdrive
VREF = VCC/2
Figure 6-35. Response Time for Various Overdrives, Low-to-
High Transition
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7 Detailed Description
7.1 Overview
The TL331 family is a single comparator with the ability to operate up to 36 V on the supply pin. This standard
device has proven ubiquity and versatility across a wide range of applications. This is due to its very wide supply
voltages range (2 V to 36 V), low Iq, and fast response.
The open-collector output allows the user to configure the output's logic low voltage (VOL) and can be utilized to
enable the comparator to be used in AND functionality.
The TL331B and TL391B are performance upgrades to standard TL331 using the latest process technologies
allowing for lower offset voltages, lower input bias and supply currents and faster response time over an
extended temperature range. The TL331B can drop-in replace the "I" or "K" versions of TL331. The TL391B is
an alternate pinout for replacing competitive devices.
7.2 Functional Block Diagram
80- Am
Current Regulator
80 mA
60 mA 10 mA
VCC
10 mA
OUT
GND
IN+
IN−
Epi-FET
Diodes
Resistors
Transistors
COMPONENT COUNT
1
2
1
20
Current values shown are nominal.
7.3 Feature Description
TL331x family consists of a PNP Darlington pair input, allowing the device to operate with very high gain and fast
response with minimal input bias current. The input Darlington pair creates a limit on the input common mode
voltage capability, allowing TL331x to accurately function from ground to VCC – 1.5 V differential input.
The output consists of an open collector NPN (pull-down or low side) transistor. The output NPN will sink current
when the negative input voltage is higher than the positive input voltage and the offset voltage. The VOL is
resistive and will scale with the output current. Please see Figure 6-3 for VOL values with respect to the output
current.
7.4 Device Functional Modes
7.4.1 Voltage Comparison
The TL331x operates solely as a voltage comparator, comparing the differential voltage between the positive
and negative pins and outputting a logic low or high impedance (logic high with pull-up) based on the input
differential polarity.
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8 Application and Implementation
Note
Information in the following applications sections is not part of the TI component specification, and TI
does not warrant its accuracy or completeness. TI’s customers are responsible for determining
suitability of components for their purposes. Customers should validate and test their design
implementation to confirm system functionality.
8.1 Application Information
TL331x will typically be used to compare a single signal to a reference or two signals against each other. Many
users take advantage of the open drain output to drive the comparison logic output to a logic voltage level to an
MCU or logic device. The wide supply range and high voltage capability makes TL331x optimal for level shifting
to a higher or lower voltage.
8.2 Typical Application
+
TL331
5 V
5 V
Vref
Input 0 V to 30 V
Figure 8-1. Typical Application Schematic
8.2.1 Design Requirements
For this design example, use the parameters listed in Table 8-1 as the input parameters.
Table 8-1. Design Parameters
DESIGN PARAMETER EXAMPLE VALUE
Input Voltage Range 0 V to VCC – 1.5 V
Supply Voltage 2 V to 36 V
Logic Supply Voltage (RPULLUP Voltage) 2 V to 36 V
Output Current (VLOGIC/RPULLUP) 1 µA to 4 mA
Input Overdrive Voltage 100 mV
Reference Voltage 2.5 V
Load Capacitance (CL) 15 pF
8.2.2 Detailed Design Procedure
When using TL331x in a general comparator application, determine the following:
Input voltage range
Minimum overdrive voltage
Output and drive current
Response time
8.2.2.1 Input Voltage Range
When choosing the input voltage range, the input common mode voltage range (V ICR) must be taken in to
account. If temperature operation is above or below 25°C the VICR can range from 0 V to VCC1.5 V. This limits
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the input voltage range to as high as VCC 1.5 V and as low as 0 V. Operation outside of this range can yield
incorrect comparisons.
Below is a list of input voltage situation and their outcomes:
1. When both IN- and IN+ are both within the common mode range:
a. If IN- is higher than IN+ and the offset voltage, the output is low and the output transistor is sinking current
b. If IN- is lower than IN+ and the offset voltage, the output is high impedance and the output transistor is not
conducting
2. When IN- is higher than common mode and IN+ is within common mode, the output is low and the output
transistor is sinking current
3. When IN+ is higher than common mode and IN- is within common mode, the output is high impedance and
the output transistor is not conducting
4. When IN- and IN+ are both higher than common mode, the output is low and the output transistor is sinking
current
8.2.2.2 Minimum Overdrive Voltage
Overdrive Voltage is the differential voltage produced between the positive and negative inputs of the
comparator over the offset voltage (VIO). In order to make an accurate comparison the Overdrive Voltage (VOD)
should be higher than the input offset voltage (VIO). Overdrive voltage can also determine the response time of
the comparator, with the response time decreasing with increasing overdrive. Figure 8-2 and Figure 8-3 show
positive and negative response times with respect to overdrive voltage.
8.2.2.3 Output and Drive Current
Output current is determined by the load/pull-up resistance and logic/pull-up voltage. The output current will
produce a output low voltage (VOL) from the comparator. In which VOL is proportional to the output current. Use
Figure 6-3 to determine VOL based on the output current.
The output current can also effect the transient response. More is explained in the next section.
8.2.2.4 TL331B & TL391B ESD Protection
The "B" versions add dedicated ESD protections on all the pins for improved ESD performance. Please see
Application Note SNOAA35 for more information.
8.2.2.5 Response Time
Response time is a function of input over drive. See Section 8.2.3 for typical response times. The rise and fall
times can be determined by the load capacitance (C L), load/pullup resistance (R PULLUP), and equivalent
collector-emitter resistance (RCE).
The rise time (τR) is approximately τR ~ RPULLUP × CL
The fall time (τF) is approximatelyτF ~ RCE × CL
– RCE can be determined by taking the slope of Figure 6-3 in its linear region at the desired temperature, or
by dividing the VOL by Iout
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8.2.3 Application Curves
The following curves were generated with 5 V on VCC and VLogic, RPULLUP = 5.1 kΩ, and 50 pF scope probe.
±1
0
1
2
3
4
5
6
-0.25 0.25 0.75 1.25 1.75 2.25
Output Voltage, Vo(V)
Time (usec)
5mV OD
20mV OD
100mV OD
Figure 8-2. Response Time for Various Overdrives
(Positive Transition)
±1
0
1
2
3
4
5
6
±0.25 0.00 0.25 0.50 0.75 1.00 1.25 1.50 1.75 2.00
Output Voltage (Vo)
Time (usec)
5mV OD
20mV OD
100mV OD
Figure 8-3. Response Time for Various Overdrives
(Negative Transition)
9 Power Supply Recommendations
For fast response and comparison applications with noisy or AC inputs, it is recommended to use a bypass
capacitor on the supply pin to reject any variation on the supply voltage. This variation can eat into the
comparator's input common mode range and create an inaccurate comparison.
10 Layout
10.1 Layout Guidelines
For accurate comparator applications without hysteresis it is important maintain a stable power supply with
minimized noise and glitches, which can affect the high level input common mode voltage range. In order to
achieve this, it is best to add a bypass capacitor between the supply voltage and ground. This should be
implemented on the positive power supply and negative supply (if available). If a negative supply is not being
used, do not put a capacitor between the IC's GND pin and system ground.
10.2 Layout Example
OUT
1
IN
2
IN+ 34
VCC
5
0.1 Fμ
GND
0.1 Fμ
Ground
Bypass
Capacitor
Positive Supply
Negative Supply or Ground
Ground
Only needed
for dual power
supplies
Figure 10-1. TL331 Layout Example
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11 Device and Documentation Support
11.1 Documentation Support
11.1.1 Related Documentation
Application Design Guidelines for LM339, LM393, TL331 Family Comparators - SNOAA35
Analog Engineers Circuit Cookbook: Amplifiers (See Comparators section) - SLYY137
Precision Design, Comparator with Hysteresis Reference Design- TIDU020
Window comparator circuit - SBOA221
Reference Design, Window Comparator Reference Design- TIPD178
Comparator with and without hysteresis circuit - SBOA219
Inverting comparator with hysteresis circuit - SNOA997
Non-Inverting Comparator With Hysteresis Circuit - SBOA313
Zero crossing detection using comparator circuit - SNOA999
PWM generator circuit - SBOA212
How to Implement Comparators for Improving Performance of Rotary Encoder in Industrial Drive Applications -
SNOAA41
A Quad of Independently Func Comparators - SNOA654
11.2 Receiving Notification of Documentation Updates
To receive notification of documentation updates, navigate to the device product folder on ti.com. In the upper
right corner, click on Alert me to register and receive a weekly digest of any product information that has
changed. For change details, review the revision history included in any revised document.
11.3 Support Resources
TI E2E support forums are an engineer's go-to source for fast, verified answers and design help straight
from the experts. Search existing answers or ask your own question to get the quick design help you need.
Linked content is provided "AS IS" by the respective contributors. They do not constitute TI specifications and do
not necessarily reflect TI's views; see TI's Terms of Use.
11.4 Trademarks
TI E2E is a trademark of Texas Instruments.
All trademarks are the property of their respective owners.
11.5 Electrostatic Discharge Caution
This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled
with appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.
ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may
be more susceptible to damage because very small parametric changes could cause the device not to meet its published
specifications.
11.6 Glossary
TI Glossary This glossary lists and explains terms, acronyms, and definitions.
12 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
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PACKAGE OPTION ADDENDUM
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Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
TL331BIDBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 331B
TL331IDBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 (T1IG, T1IL, T1IS)
TL331IDBVRE4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 T1IG
TL331IDBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 T1IG
TL331IDBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 (T1IG, T1IL, T1IU)
TL331IDBVTG4 ACTIVE SOT-23 DBV 5 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 85 T1IG
TL331KDBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU | SN Level-1-260C-UNLIM -40 to 105 (T1KG, T1KJ, T1KL)
TL331KDBVRG4 ACTIVE SOT-23 DBV 5 3000 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 (T1KG, T1KJ, T1KL)
TL331KDBVT ACTIVE SOT-23 DBV 5 250 RoHS & Green SN Level-1-260C-UNLIM -40 to 105 (T1KG, T1KJ, T1KL)
TL391BIDBVR ACTIVE SOT-23 DBV 5 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 391B
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 13-Aug-2021
Addendum-Page 2
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
OTHER QUALIFIED VERSIONS OF TL331 :
Automotive : TL331-Q1
Enhanced Product : TL331-EP
NOTE: Qualified Version Definitions:
Automotive - Q100 devices qualified for high-reliability automotive applications targeting zero defects
Enhanced Product - Supports Defense, Aerospace and Medical Applications
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS ’ I‘KO '«Pt» Reel DlameIer A0 Dimension designed to accommodate the component Width Bo Dimension designed to accommodate the component Iength K0 Dimension designed to accommodate the component thickness 7 w Overau Wiotn onhe carrier Iape i P1 Pitch between successive cawty centers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE QOODOOOO ,,,,,,,,,,, ‘ User DIreCIIOn 0' Feed SprockeI Hoies Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
TL331BIDBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
TL331IDBVR SOT-23 DBV 5 3000 180.0 8.4 3.23 3.17 1.37 4.0 8.0 Q3
TL331IDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TL331IDBVRG4 SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TL331IDBVT SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3
TL331IDBVTG4 SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3
TL331KDBVR SOT-23 DBV 5 3000 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TL331KDBVR SOT-23 DBV 5 3000 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3
TL331KDBVT SOT-23 DBV 5 250 178.0 9.0 3.23 3.17 1.37 4.0 8.0 Q3
TL331KDBVT SOT-23 DBV 5 250 178.0 9.0 3.3 3.2 1.4 4.0 8.0 Q3
TL391BIDBVR SOT-23 DBV 5 3000 180.0 8.4 3.2 3.2 1.4 4.0 8.0 Q3
PACKAGE MATERIALS INFORMATION
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Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
TL331BIDBVR SOT-23 DBV 5 3000 210.0 185.0 35.0
TL331IDBVR SOT-23 DBV 5 3000 202.0 201.0 28.0
TL331IDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TL331IDBVRG4 SOT-23 DBV 5 3000 180.0 180.0 18.0
TL331IDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TL331IDBVTG4 SOT-23 DBV 5 250 180.0 180.0 18.0
TL331KDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TL331KDBVR SOT-23 DBV 5 3000 180.0 180.0 18.0
TL331KDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TL331KDBVT SOT-23 DBV 5 250 180.0 180.0 18.0
TL391BIDBVR SOT-23 DBV 5 3000 210.0 185.0 35.0
PACKAGE MATERIALS INFORMATION
www.ti.com 9-Oct-2020
Pack Materials-Page 2
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PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.9
1.45
0.90
0.15
0.00 TYP
5X 0.5
0.3
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.15 mm per side.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
5X (1.1)
5X (0.6)
(2.6)
(1.9)
2X (0.95)
(R0.05) TYP
4214839/E 09/2019
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
(1.9)
2X(0.95)
5X (1.1)
5X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/E 09/2019
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
www.ti.com
PACKAGE OUTLINE
C
0.22
0.08 TYP
0.25
3.0
2.6
2X 0.95
1.9
1.45
0.90
0.15
0.00 TYP
5X 0.5
0.3
0.6
0.3 TYP
8
0 TYP
1.9
A
3.05
2.75
B
1.75
1.45
(1.1)
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/F 06/2021
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. Refernce JEDEC MO-178.
4. Body dimensions do not include mold flash, protrusions, or gate burrs. Mold flash, protrusions, or gate burrs shall not
exceed 0.25 mm per side.
0.2 C A B
1
34
5
2
INDEX AREA
PIN 1
GAGE PLANE
SEATING PLANE
0.1 C
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MAX
ARROUND 0.07 MIN
ARROUND
5X (1.1)
5X (0.6)
(2.6)
(1.9)
2X (0.95)
(R0.05) TYP
4214839/F 06/2021
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
NOTES: (continued)
5. Publication IPC-7351 may have alternate designs.
6. Solder mask tolerances between and around signal pads can vary based on board fabrication site.
SYMM
LAND PATTERN EXAMPLE
EXPOSED METAL SHOWN
SCALE:15X
PKG
1
34
5
2
SOLDER MASK
OPENING
METAL UNDER
SOLDER MASK
SOLDER MASK
DEFINED
EXPOSED METAL
METAL
SOLDER MASK
OPENING
NON SOLDER MASK
DEFINED
(PREFERRED)
SOLDER MASK DETAILS
EXPOSED METAL
www.ti.com
EXAMPLE STENCIL DESIGN
(2.6)
(1.9)
2X(0.95)
5X (1.1)
5X (0.6)
(R0.05) TYP
SOT-23 - 1.45 mm max heightDBV0005A
SMALL OUTLINE TRANSISTOR
4214839/F 06/2021
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
8. Board assembly site may have different recommendations for stencil design.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
SCALE:15X
SYMM
PKG
1
34
5
2
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