EXB-SN63PB37 Datasheet by Chip Quik Inc.

Chipouik® Super Low Dross" BARSN63FB37 Silver (Ag) 0.100 % < 0.100="" %="" aluminum="" (ai)="" 0.005="" "/0="">< 0.005="" %="" arsenic="" (as)="" 0.030="" "/0="">< 0.030="" %="" gold="" (au)="" 0.050="" "/0="">< 0.050="" %="" bismuth="" (bi)="" 0.100="" "/0="">< 0.100="" %="" cadmium="" (cd)="" 0.002="" "/0="">< 0.002="" %="" copper="" (cu)="" 0.080="" "/0="">< 0.080="" %="" iron="" (fe)="" 0.020="" "/0="">< 0.020="" %="" indium="" (in)="" 0.100%=""><0.100% nickel="" (ni)="" 0.010="" "/0="">< 0.010="" %="" lead="" (pb)="" 0.070="" "/0="" 37.000="" %="" tin="" (sn)="" 0.250="" "/0="" 63.000="" %="" zinc="" (zn)="" 0.003="" "/0="">< 0.003="" %="" antimony="" (sb)="" 0.200="" "/0="">< 0.200="" %="" test="" j="" std-004="" or="" other="" requlrements="" as="" stated="" coalition="" (eicc)="">
Datasheet revision 1.0 www.chipquik.com
Super Low Dross™ Solder Bar Sn63/Pb37 1lb (454g) Extruded
Product Highlights
Extruded High Reliability Solder Bar
Manufactured Specifically for High Quality Electronics Manufacturing (EMS, ECM, OEMs)
Designed for Solder Pots, Wave Solder Machines and Selective Solder Machines
Chip Quik® Super Low Dross™ Solder Bar is Ideal for Through Hole and Surface Mount Soldering
High Purity
Specifications
Alloy: Sn63/Pb37
Melting Point: 183°C (361°F)
Packaging: 1 lb (454 +/-20 g) bar (Ships bagged. To ensure weight tolerance is met: Full bar and/or
fractional bar segments may be combined in each bag.)
Shelf Life: Indefinite
Purity
Element IPC J-STD-006C ChipQuik® Super Low Dross™
BARSN63PB37
Silver
(
A
g)
0.100 % < 0.100 %
A
luminum
(
Al
)
0.005 % < 0.005 %
A
rsenic
(
As
)
0.030 % < 0.030 %
Gold
(
Au
)
0.050 % < 0.050 %
Bismuth
(
Bi
)
0.100 % < 0.100 %
Cadmium
(
Cd
)
0.002 % < 0.002 %
Copper
(
Cu
)
0.080 % < 0.080 %
Iron
(
Fe
)
0.020 % < 0.020 %
Indium
(
In
)
0.100 % < 0.100 %
Nickel
Ni
0.010 % < 0.010 %
Lead
(
Pb
)
0.070 % 37.000 %
Tin
(
Sn
)
0.250 % 63.000 %
Zinc
(
Zn
)
0.003 % < 0.003 %
A
ntimon
y
(
Sb
)
0.200 % < 0.200 %
Tolerances: +/-0.100% (Composition ≤ 1.000%), +/-0.200% (1.000% < Composition ≤ 5.000%), +/-0.500% (Composition > 5.000%)
Storage and Handling
Store in a dry non-corrosive environment.
Transportation
This product has no shipping restrictions.
Test Results
Test J-STD-004 or other
requirements as stated
Test Requirement Result
Conflict Minerals Compliance Electronic Industry Citizenship
Coalition
(
EICC
)
Compliant
REACH Compliance Articles 33 and 67 of Regulation (EC)
No 1907/2006
Contains Lead (Pb) CAS# 7439-92-1
No other SVHC presen
t
Conforms to the following Industry Standards:
J-STD-006C, Amendments 1 & 2 (Solder Alloys and Fluxed/Non-Fluxed Solders): Yes
RoHS 3 Directive (EU) 2015/863: No [Contains Lead (Pb)]
1 © 1994-2020 Chip Quik® Inc.
E
EX
XB
B-
-S
SN
N6
63
3P
PB
B3
37
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