IDC SSL Connector Appl Spec Datasheet by TE Connectivity AMP Connectors

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Application Specification
114--13266
LOC B
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E2011 Tyco Electronics Corporation, a TE Connectivity Ltd. Company
All Rights Reserved
TE logo is a trademark.
*Trademark. Other product names, logos, or company names might be trademarks of their respective owners.
TOOLING ASSISTANCE CENTER 1--800--722--1111
PRODUCT INFORMATION 1--800--522--6752
This controlled document is subject to change.
For latest revision and Regional Customer Service,
visit our website at www.te.com
IDC SSL Connector 01 SEP 11 Rev H
All numerical values are in metric units [with U.S. customary units in brackets]. Dimensions are in millimeters. Unless
otherwise specified, dimensions have a tolerance of +0.13 and angles have a tolerance of +2_. Figures and
illustrations are for identification only and are not drawn to scale.
1. INTRODUCTION
This specification covers the requirements for application of IDC SSL Connectors for use on printed circuit (pc)
board based LED strip lighting typically used for sign lighting. The connector accommodates 18, 20, 22, or 24
AWG solid and stranded copper wires.
The low profile housing with flat top surface allows for vacuum pick--and--place application. The connector is
packaged in tape and reel packaging per EIA--481.
When corresponding with TE Connectivity Personnel, use the terminology provided in this specification to
facilitate your inquiries for information. Basic terms and features of this product are provided in Figure 1.
Figure 1
SMT IDC SSL Connector
SMT Contact Tine
Through--Hole IDC SSL Connector
Two--Position Shown,
Three--Position Also Available
NOTE
i
Two--Position shown, One--, Three--, and Four--Position also available.
Through--Hole
IDC Hole
for Wire
2. REFERENCE MATERIAL
2.1. Revision Summary
SUpdated document to corporate requirements
SAdded new information in Paragraph 5.3 and new artwork in Figure 18
2.2. Customer Assistance
Reference product base part numbers 2106003 and 2106431 (One thru Four Position SMT), 2106489 and
2106751 (Two-- and Three--Position Through--Hole), and product code L012 are representative of the IDC SSL
Connectors. Use of these numbers will identify the product line and expedite your inquiries through a service
network established to help you obtain product and tooling information. Such information can be obtained
through a local TE Representative or, after purchase, by calling Product Information at the number at the
bottom of this page.
2.3. Drawings
Customer drawings for product part numbers are available from the service network. If there is a conflict
between the information contained in the customer drawings and this specification or with any other technical
documentation supplied, call the Product Information number at the bottom of this page.
2.4. Manuals
Manual 402--40 is available from the service network. This manual provides information on various flux types
and characteristics along with the commercial designation and flux removal procedures. A checklist is included
in the manual as required for information on soldering problems.
NOTE
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2.5. Specifications
Design Objective 108--2404 provides expected product performance and test information for the IDC SSL
Connector; and Design Objective 108--2404--2 provides expected product performance and test information for
the Sealed IDC SSL Connector. Workmanship Specification 101--21 and Test Specification 109--11 provides
solderability requirements and evaluation methods.
3. REQUIREMENTS
3.1. Safety
Do not stack product shipping containers so high that the containers buckle or deform.
3.2. Limitations
The connectors are designed to operate in a temperature range of --40_to 105_C[--40_to 221_F]
3.3. Material
The housing is made of UL 94V--0 rated thermoplastic. The contacts are made of phosphorous bronze,
under--plated with nickel, and plated overall with tin.
3.4. Storage
A. Shelf Life
The connectors should remain in the shipping containers until ready for use to prevent deformation. The
connectors should be used on a first in, first out basis to avoid storage contamination that could adversely
affect performance.
B. Chemical Exposure
Do not store connectors near any chemical listed below as they may cause stress corrosion cracking in
the contacts.
Alkalies Ammonia Citrates Phosphates Citrates Sulfur Compounds
Amines Carbonates Nitrites Sulfur Nitrites Tartrates
3.5. Wire Selection and Preparation
These connectors will accept 18, 20, 22, and 24 AWG solid or stranded copper wire. The table in Figure 2
provides wire selection for the IDC SSL Connectors.
Color indication markings for wire sizes are as follows: Yellow -- 18 AWG; Blue -- 20 AWG; Green -- 22 AWG
and Red -- 24 AWG.
RECOMMENDED WIRE
18 AWG UL 1007--18 Solid
18 AWG UL 1007--18 (16) Stranded
20 AWG UL 1007--20 Solid
20 AWG UL 1007--20 (7) Stranded
22 AWG UL 1007--22 Solid
22 AWG UL 1007--22 (7) Stranded
24 AWG UL 1007--24 Solid
24 AWG UL 1007--24 (7) Stranded
Figure 2
NOTE
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3.6. Wire Termination
After termination, wire shall meet the requirements specified in Figure 3.
Figure 3
Conductor
1.52 Min
Centerline
of
Conductor
Centerline
of
Conductor
Conductor
5.8 +0.13
PC Board
5.8 +0.13
PC Board
3.7. Contact Damage
There shall be no evidence of physical damage or distortion to any portion of the contact after wire termination.
3.8. Housing Damage
A. There shall be no cracks, breaks, or other visible damage to the housing due to wire termination.
B. Skiving of plastic on the inside wall of the housing cavity is permissible provided that conditions specified in
Paragraph 3.8.A are met.
3.9. Broken Strands
There shall be no broken strands in the conductor after termination.
3.10. Exposed Conductor
Exposed conductors shall not exceed the limits specified in Figure 4 after termination.
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Figure 4
Bare Wire Shall Not
be Visible Beyond
Back of Housing
Back of Housing
Bare Wires Shall
Not Extend Above
Top of Contact
Back of Housing
Back of Housing
Bare Wire Shall Not
be Visible Beyond
Back of Housing
Bare Wire Shall Not
be Visible Beyond
Back of Housing
3.11. Conductor Insulation
Conductor insulation shall be contained within the confines of the insulation strain relief as shown in Figure 5.
Figure 5
Insulation Strain Relief
Conductor Insulation
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3.12. PC Board
A. Material and Thickness
Common pc board materials may be used such as glass epoxy (FR--4 or G--10), Aluminum--clad pc
boards and flex circuits. The pc board thickness may vary to suit the end use thickness.
B. Tolerance
Maximum allowable bow of the pc board shall be 0.10 mm over the length of the connector.
Since the connector housings may rest on top of the solder mask, an excessively high mask will allow too much space
between the solder tine and pad for a good solder joint. A solder joint under these conditions would be weak, and
would not provide long--term performance for the connector.
C. Pads
The pc board circuit pads must be solderable in accordance with Test Specification 109--11
(Test Method A, non--activated rosin flux).
D. Layout
The pc board layout must be designed using the dimensions provided on the customer drawing for the
specific connector. The recommended pc board layout is shown in Figure 6.
Figure 6
1.00
7.1
(Typ)2.45
04.2
(Ref)1.75
SMT PC Board Layout 3.10 (Typ)
Housing
Outline
.00
(Typ)
4
Through--Hole PC Board Layout
Housing Outline
1.50
3.00
2.93
2.93
1.00 Plated
Through--Hole
(4 Plc)
(Two--Position Shown)
(Two--Position Shown)
CAUTION
!
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E. PC Board Hole Dimensions
The finished hole size for through--hole applications must meet the dimensional requirements provided in
Figure 7.
Figure 7
Drilled Hole Diameter (As Required)
Plating Thickness
(0.004 -- 0.010 mm HASL Tin/Lead)
(0.0005 mm Min Imersion Tin)
{0.0002 -- 0.0005 mm OSP}
(0.0001 mm Min Immersion Silver)
{0.0001 -- 0.0005 mm Immersion Gold, Over 0.004 -- 0.005 mm Nicke
l
0.025 -- 0.050
Copper Plating
(Maximum Hardness of copper to be
150 Knoop)
2.00 Min Pad
Diameter
PC Board
Thickness
1.57 +0.18
FR--4 Material
1.00 +0.10 Dia of
Finished Hole
After Plating
NOTE: Other material and thickness of plating may be used on both RoHS compliance and connector vendor’s agreement.
3.13. Spacing
The connector is able to be placed side--by--side on the pc board when the pad layout for the adjacent
connectors are placed on 5.9 mm centers. See Figure 8.
Connectors should be handled only by the housing to avoid deformation, contamination, or damage to the contact
tines.
CAUTION
!
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Figure 8
SMT IDC SSL Connector Through--Hole IDC SSL Connector
NOTE
i
Two--position shown, one--position dimensions are the same.
5.90
0.20--0.00 Min
4.00
5.90
0.20--0.00 Min
4.00
3.14. Connector Placement
A. SMT Connectors
This product is packaged in tape and reel packaging per EIA--481. Robotic/gripper placement requires
total equipment accuracy of 0.13 mm to locate the connector for insertion. This includes gripper and fixture
tolerances, as well as equipment repeatability. Insertion location will be programmed by a simple
pantograph/template system or software package. Optimally, the contact solder tines should be centered
on the pc board pads. However, slight misalignment is permissible for the performance classifications
specified in Association of Connecting Electronics Industries (IPC)--S--815, “General Requirements for
Soldering Electronic Interconnection.” See Figure 9.
Figure 9
PC Board
PC Board
Optimum Placement of Contact
Solder Tine Centered on Circuit Pad Contact Solder Tine Overhang
Permissible Per IPC--S--815
B. Through- Hole Connectors
When placing connectors on the pc board, the contacts must be aligned and started into the matching
holes before seating the connector onto the pc board. After the connector is seated, the standoffs must be
flush to the pc board. Refer to Figure 10.
..........
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Rev H8of 14
Figure 10
Standoffs Flush
with PC Board
PC Board
IDC SS
L
Connector (Typ)
3.15. Soldering
Observe guidelines and procedures when soldering contacts. Solder, clean, and dry all leads to contacts
according to the following. The connectors should be soldered using vapor phase reflow (VPR), double--sided,
non--focused infrared (IR), forced air convection, or equivalent soldering techniques. All solder joints should
conform to the Workmanship Specification 101--21 and IPC--S--815.
A. Flux Selection
Contacts must be fluxed prior to soldering with a mildly active, rosin base flux. Selection of the flux will
depend on the type of pc board and other components mounted on the board. Additionally, the flux must
be compatible with the wave solder line, manufacturing, health, and safety requirements. Flux that is
compatible with the connectors is provided in Figure 11.
F
L
U
X
T
P
E
A
C
T
I
V
I
T
R
E
S
I
D
U
E
COMMERCIAL DESIGNATION
FLUX T
PE ACTIVIT
RESIDUE KESTER ALPHA
Type RMA (Mildly Activated) Mild Noncorrosive 185/197 611
Figure 11
B. Connectors with SMT Contacts
1. Solderability
The pc board pads must be solderable in accordance with Test Specification 109--11 (Test Method A,
non--activated rosin flux) and all other requirements for surface mount contacts specified in this
document.
2. Solder Paste Characteristics
a. Alloy type shall be SAC 305; Sn 96.5/Ag 3.0/Cu 0.5
b. Flux incorporated in the paste shall be rosin, mildly active (RMA) type.
c. Paste will be at least 80% solids by volume.
d. Mesh designation --200 to +325 (74 to 44 square micron openings, respectively).
e. Minimum viscosity of screen print shall be 5¢10% cp (centipoise).
f. Minimum viscosity of stencil print shall be 7.5¢10% cp (centipoise).
3. Solder Volume
Solder paste volumes are required as follows (calculated per 90% solids content). Paste volume may vary depending
on the composition.
Solder volume for each SMT IDC SSL Connector must be according to the following:
1.32 mm3per contact solder tine
KESTER and ALPHA are trademarks.
NOTE
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4.00
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4. Stencil
The stencil aperture shall be determined by the circuit pad size and stencil thickness. It may be any
shape as long as it prevents solder bridging from one pad to another. Generally, the thinner stencil will
need a larger aperture to maintain the given volume of solder paste. See Figure 12.
The stencil layouts illustrated apply to the top (connector) side (unless otherwise noted) of the pc board. For any other
variations, refer to the pc board mounting configurations on the appropriate customer drawing to determine
modifications necessary to the solder stencils in Figure 12.
All traces must be covered by solder mask in the solder deposit area. Exposed traces could cause bridging and create
a short, or wick solder away from the solder tines, producing a weak solder joint.
If a hold--down aperture is required other than that specified, the design must ensure that the connector housing will
not sit on the solder deposit.
Figure 12
.002
.004
2.10
Typ
3.10 +0.05
Typ
2.50 + 0.05
Typ
5. Solder Mask
Solder mask is recommended between all pads when soldering connectors with surface mount contacts
to minimize solder bridging between pads. The mask must not exceed the height of the pad by more
than 0.05 mm. If a trace is run between adjacent pads on the solder side of the pc board, a solder mask
must be applied over the trace to prevent bridging and wicking of solder away from the contact solder
tines. Those most suitable are Liquid Photo Imageable and Dry Film.
Since the connector may rest on top of the solder mask, an excessively high mask will allow too much space between
the lead and pad for a good solder joint. A solder joint under these conditions would be weak and would not provide
long--term performance for the connector.
NOTE
i
CAUTION
!
CAUTION
!
CAUTION
!
-: TE (man/HIV SOLDERING PROCESS TEMPERATURE (Max) TIME (Al Max Temperature) IR 220 C[428 F] 3Minules Figure 13
114- 13266
Rev H10 of 14
6. Process
Connectors with surface mount contacts should be soldered using vapor phase (VPR), double--sided,
non--focused infrared reflow (IR) or equivalent soldering techniques. Due to many variables involved with
the reflow process (i.e., component density, orientation, etc.), it is recommended that trial runs be
conducted under actual manufacturing conditions to ensure product and process compatibility. These
connectors will withstand the temperature and exposure time specified in Figure 13.
SOLDERING PROCESS TEMPERATURE (Max) TIME (At Max Temperature)
IR 220_C [428_F] 3 Minutes
Figure 13
The lead--free reflow profile is shown in Figure 14.
Figure 14
Reflow Zone
Time Above 217C
(90 Seconds Max)
40--70 Seconds Typ
Peak Temperature
235--255C
Soaking Zone
(2.0 Minutes Max)
60--90 Seconds Typ
Pre--Heating Zone
(2.0 --4.0 Minutes Max)
<2.5 C/Second
30 60 90 120 150 180 210 240 270 3000
Time (Seconds)
300C
250C
200C
150C
100C
50C
0C
Kester Lead- Free Reflow Profile
Alloys: Sn96.5/Ag3.0/Cu0.5 and Sn96.5/Ag3.5
C. Connectors with Through- Hole Contacts
1. Solderability
All solder joints should conform to those specified in Workmanship Specification 101--21 and all other
requirements for through--hole contacts specified in this document
2. Process
Connectors with through--hole contacts can be soldered using wave soldering or equivalent soldering
techniques. It is recommended using lead--free or SN100C solder for these connectors. The temperature
and exposure time shall be as specified in Figure 15.
114- 13266
Rev H 11 of 14
SOLDERING PROCESS TEMPERATURE (Max) TIME (At Max Temperature)
Wave 260_C [500_F] 3 Seconds
Figure 15
D. Cleaning
After soldering, removal of fluxes, residues, and activators is necessary. Consult with the supplier of the
solder and flux for recommended cleaning solvents. Common cleaning solvents that will not affect the
connectors or assemblies for the times and temperatures provided without any adverse effects on the
connector assembly are listed in Figure 16.
Consideration must be given to toxicity and other safety requirements recommended by the solvent manufacturer.
Trichloroethylene and Methylene Chloride can be used with no harmful affect to the connectors; however, TE does not
recommend them because of the harmful occupational and environmental effects. Both are carcinogenic
(cancer--causing) and Trichloroethylene is harmful to the earth’s ozone layer.
If you have a particular solvent that is not listed, contact TE Tooling Assistance Center or Product Information at the
number on the bottom of page 1.
CLEANER TIME
(
M
i
t
)
TEMPERATURES
(Maximum)
NAME TYPE (Minutes
)
CELSIUS FAHRENHEIT
Alpha 2110 Aqueous 1132 270
Bioact EC--7 Solvent 5100 212
Butyl Carbitol Solvent 1Ambient Room
Isopropyl Alcohol Solvent 5100 212
Kester 5778 Aqueous 5100 212
Kester 5779 Aqueous 5100 212
Loncoterge 520 Aqueous 5100 212
Loncoterge 530 Aqueous 5100 212
Terpene Solvent Solvent 5100 212
Alpha, Bioact, Carbitol, Kester, and Loncoterge are trademarks.
Figure 16
E. Drying
Excessive temperatures may cause housing and plating degradation.
When drying cleaned assemblies and pc boards, temperatures to which the connectors are subject should
not exceed 220_C [492_F] for more than 3 minutes.
3.16. Checking Installed Connector
All solder joints should comply with TE Workmanship Specification 101--21. For typical fillets for surface
mount and through--hole tine requirements, refer to Figure 17.
DANGER
NOTE
i
CAUTION
!
114- 13266
Rev H12 of 14
Figure 17
PC Board (Ref)
PC Board (Ref)
Solder Joints Evenly Formed
Around Contact Tines
Solder Fillet
Pad Width
Pad Length
SMT IDC SSL Connector
Soldered on PC Board
3.17. Replacement and Repair
The contacts and housings are not repairable. DO NOT use damaged or defective contacts or housings. DO
NOT remove the wire and re--terminate contacts.
4. QUALIFICATIONS
IDC SSL Connectors are Component Recognized by Underwriters Laboratories Inc. (UL) in File E28476,
Vol. 100, and have been Investigated to CSA International by UL.
5. TOOLING
5.1. Robotic Equipment
The robotic equipment must have a true position accuracy tolerance of 0.25 mm to properly locate the
connectors. This includes gripper and fixture tolerances as well as equipment repeatability.
Automatic machine placement is recommended for connectors instead of manual placement with surface mount
contacts.
5.2. PC Board Support
For automatic machine placement and wire termination, a pc board support must be used to prevent bowing of
the pc board during the placement of connectors. It should have flat surfaces with holes or a channel large
enough and deep enough to receive any protruding components. The pc board support must be customer
made.
5.3. Wire Termination
The pc board should be supported on a flat surface. The termination force must be parallel to the pc board and
applied on the top housing until it is fully seated in it’s final stage. See Figure 18.
The force required to terminate these connectors may not be applied by hand. The use of an Arbor Press is
recommended for termination of these connectors. TE recommends a flat rock tool that concentrates the applied force
to the center of the part, as shown in Figure 18.
NOTE
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NOTE
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114- 13266
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Figure 18
Wire Insertion Test
Top Housing
Bottom Housing
Initial--Pre Stage
(Configuration of Connector Prior to Termination)
Final--Terminated Position
(Configuration of Connector After Termination)
Bottom Housing
Top Housing
Top Housing
Wire
Recommended
Flat Rock Tool
Bottom Housing
Initial -- Pre--Stage
(Configuration of Connector Prior to Termination)
1.50 (Min)
2.20 (Max)
-' TE
114- 13266
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6. VISUAL AID
Figure 19 shows a typical application of IDC SSL Connectors. This illustration should be used by production
personnel to ensure a correctly applied product. Applications which DO NOT appear correct should be
inspected using the information in the preceding pages of this specification and in the instructional material
shipped with the product or tooling.
FIGURE 19. VISUAL AID
STANDOFFS MUST BE
SEATEDONPCBOARD
CONTACT TINE SHOULD
BE VISUALLY
CENTERED ON PAD
SOLDER FILLETS MUST BE
FORMED EVENLY AROUND
SOLDER TINE
CABLE TIE AND ANCHOR
MUST BE CORRECTLY
PLACEDONWIRES
CONNECTOR HOUSING MUST
NOT BE DAMAGED OR
CRACKED
SOLDER MUST BE EVENLY
FORMED AROUND ALL
CONTACT SOLDER TINES
WITH NO VISIBLE SKIPS
OR VOIDS