HDC1080 Datasheet by Texas Instruments

V'.‘ ‘F. IE X E I TEXAS INSTRUMENTS 3.3 v 397v 3.3 v
GND
MCU
I2C
Peripheral
3.3 V
ADC
TEMPERATURE
RH
I2C
Registers
+
Logic
HDC1080
SDA
SCL
OTP
Calibration Coefficients
VDD
GND
3.3 V
VDD
3.3 V
Product
Folder
Sample &
Buy
Technical
Documents
Tools &
Software
Support &
Community
Reference
Design
HDC1080
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
HDC1080 Low Power, High Accuracy Digital Humidity Sensor with Temperature Sensor
1 Features 3 Description
The HDC1080 is a digital humidity sensor with
1• Relative Humidity Accuracy ±2% (typical) integrated temperature sensor that provides excellent
• Temperature Accuracy ±0.2°C (typical) measurement accuracy at very low power. The
• Excellent Stability at High Humidity HDC1080 operates over a wide supply range, and is
a low cost, low power alternative to competitive
• 14 Bit Measurement Resolution solutions in a wide range of common applications.
• 100 nA Sleep Mode Current The humidity and temperature sensors are factory
• Average Supply Current: calibrated.
– 710 nA @ 1sps, 11 bit RH Measurement Device Information (1)
– 1.3 µA @ 1sps, 11 bit RH and Temperature PART
Measurement PACKAGE BODY SIZE (NOM)
NUMBER
• Supply Voltage 2.7 V to 5.5 V HDC1080 PWSON (6-pin) DMB 3.00 mm x 3.00 mm
• Small 3 mm x 3 mm Device Footprint (1) For all available packages, see the orderable addendum at
• I2C Interface the end of the datasheet.
2 Applications
• HVAC
• Smart Thermostats and Room Monitors
• White Goods
• Printers
• Handheld Meters
• Medical Devices
• Wireless Sensor (TIDA: 00374,00484,00524)
4 Typical Application
1
An IMPORTANT NOTICE at the end of this data sheet addresses availability, warranty, changes, use in safety-critical applications,
intellectual property matters and other important disclaimers. PRODUCTION DATA.
l TEXAS INSTRUMENTS
HDC1080
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
www.ti.com
Table of Contents
8.4 Device Functional Modes.......................................... 9
1 Features.................................................................. 18.5 Programming........................................................... 10
2 Applications ........................................................... 18.6 Register Map .......................................................... 14
3 Description ............................................................. 19 Application and Implementation ........................ 17
4 Typical Application................................................ 19.1 Application Information............................................ 17
5 Revision History..................................................... 29.2 Typical Application ................................................. 17
6 Pin Configuration and Functions......................... 39.3 Implementation and Usage Recommendations ..... 18
7 Specifications......................................................... 410 Power Supply Recommendations ..................... 19
7.1 Absolute Maximum Ratings ...................................... 411 Layout................................................................... 19
7.2 ESD Ratings.............................................................. 411.1 Layout Guidelines ................................................ 19
7.3 Recommended Operating Conditions....................... 411.2 Layout Example .................................................... 19
7.4 Thermal Information ................................................. 412 Device and Documentation Support ................. 21
7.5 Electrical Characteristics........................................... 512.1 Documentation Support ........................................ 21
7.6 I2C Interface Electrical Characteristics..................... 612.2 Community Resources.......................................... 21
7.7 I2C Interface Timing Requirements ........................ 612.3 Trademarks........................................................... 21
7.8 Typical Characteristics.............................................. 712.4 Electrostatic Discharge Caution............................ 21
8 Detailed Description.............................................. 912.5 Glossary................................................................ 21
8.1 Overview ................................................................... 913 Mechanical, Packaging, and Orderable
8.2 Functional Block Diagram......................................... 9Information ........................................................... 21
8.3 Feature Description................................................... 9
5 Revision History
Changes from Original (November 2015) to Revision A Page
• Product Preview to Production Data Release ....................................................................................................................... 1
2Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS
Top View
1
SDA
2
GND
NC 3NC
4
VDD
5
SCL
6
RH
SENSOR
HDC1080
www.ti.com
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
6 Pin Configuration and Functions
DMB Package
6 Pin PWSON
Top View
Pin Functions
PIN I/O TYPE(1) DESCRIPTION
NAME NO.
SDA 1 I/O Serial data line for I2C, open-drain; requires a pull-up resistor to VDD
GND 2 G Ground
NC 3,4 - These pins may be left floating, or connected to GND
VDD 5 P Supply Voltage
SCL 6 I Serial clock line for I2C, open-drain; requires a pull-up resistor to VDD
DAP DAP - Die Attach Pad. Should be left floating. (On bottom of the device, not shown in the figure)
(1) P=Power, G=Ground, I=Input, O=Output
Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 3
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS
HDC1080
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
www.ti.com
7 Specifications
7.1 Absolute Maximum Ratings(1)
MIN MAX UNIT
VDD -0.3 6
Input Voltage SCL -0.3 6 V
SDA -0.3 6
Storage Temperature TSTG -65 150 °C
(1) Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings
only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended
Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.
7.2 ESD Ratings
VALUE UNIT
Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1) ±2000
V(ESD) Electrostatic discharge V
Charged-device model (CDM), per JEDEC specification JESD22- ±500
C101(2)
(1) JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.
(2) JEDEC document JEP157 states that 250-V CDM allows safe manufacturing with a standard ESD control process.
7.3 Recommended Operating Conditions
over operating range (unless otherwise noted)
MIN NOM MAX UNIT
VDD Supply Voltage 2.7 3 5.5 V
TA, Temperature sensor Ambient Operating Temperature -40 125 °C
TA, Humidity sensor(1) Ambient Operating Temperature -20 70 °C
TA, Humidity sensor(1) Functional Operating Temperature -20 85 °C
(1) See Figure 2.
7.4 Thermal Information
HDC1080
THERMAL METRIC(1) PWSON (DMB) UNIT
6 PINS
RθJA Junction-to-ambient thermal resistance 49.4 °C/W
RθJC(top) Junction-to-case (top) thermal resistance 29.8 °C/W
RθJB Junction-to-board thermal resistance 23.1 °C/W
ψJT Junction-to-top characterization parameter 3.3 °C/W
ψJB Junction-to-board characterization parameter 23.1 °C/W
RθJC(bot) Junction-to-case (bottom) thermal resistance 4.2 °C/W
(1) For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application
report, SPRA953.
4Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS
HDC1080
www.ti.com
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
7.5 Electrical Characteristics(1)
The electrical ratings specified in this section apply to all specifications in this document, unless otherwise noted. TA= 30°C,
RH = 40%, and VDD = 3V.
PARAMETER TEST CONDITION(2) MIN(3) TYP(4) MAX(3) UNIT
POWER CONSUMPTION
IDD Supply Current RH measurement, bit 12 of 0x02 register = 190 220 µA
0(5)
Temperature measurement, bit 12 of 0x02 160 185 µA
register = 0(5)
Sleep Mode 100 200 nA
Average @ 1 measurement/second, RH (11 710 nA
bit), bit 12 of 0x02 register = 0(5)(6)
Average @ 1 measurement/second, Temp 590 nA
(11 bit), bit 12 of 0x02 register = 0(5)(6)
Average @ 1 measurement/second, RH 1.3 µA
(11bit) +temperature (11 bit), bit 12 of 0x02
register = 1(5)(6)
Startup (average on Start-up time) 300 µA
IHEAT Heater Current(7) Peak current 7.2 mA
Average @ 1 measurement/second, RH 50 µA
(11bit) +temperature (11 bit), bit 12 of 0x02
register = 1(5)(6)
RELATIVE HUMIDITY SENSOR
RHACC Accuracy Refer to Figure 2 in Typical Characteristics ±2 %RH
section.
RHREP Repeatability(7) 14 bit resolution ±0.1 %RH
RHHYS Hysteresis (8) 10% ≤RH ≤70% ±1 %RH
RHRT Response Time(9) t63%(10) 15 s
RHCT Conversion Time(7) 8 bit resolution 2.50 ms
11 bit resolution 3.85 ms
14 bit resolution 6.50 ms
RHOR Operating Range(11) Non-condensing 0 100 %RH
RHLTD Long Term Drift(12) ±0.25 %RH/yr
TEMPERATURE SENSOR
TEMPACC Accuracy(7) 5°C < TA< 60°C ±0.2 ±0.4 °C
TEMPREP Repeatability(7) 14 bit resolution ±0.1 °C
TEMPCT Conversion Time(7) 11 bit accuracy 3.65 ms
14 bit accuracy 6.35 ms
(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
(2) Register values are represented as either binary (b is the prefix to the digits), or hexadecimal (0x is the prefix to the digits). Decimal
values have no prefix.
(3) Limits are ensured by testing, design, or statistical analysis at 30°C. Limits over the operating temperature range are ensured through
correlations using statistical quality control (SQC) method.
(4) Typical values represent the most likely parametric norm as determined at the time of characterization. Actual typical values may vary
over time and will also depend on the application and configuration. The typical values are not tested and are not guaranteed on
shipped production material.
(5) I2C read/write communication and pull-up resistors current through SCL and SDA not included.
(6) Average current consumption while conversion is in progress.
(7) This parameter is specified by design and/or characterization and it is not tested in production.
(8) The hysteresis value is the difference between an RH measurement in a rising and falling RH environment, at a specific RH point.
(9) Actual response times will vary dependent on system thermal mass and air-flow.
(10) Time for the RH output to change by 63% of the total RH change after a step change in environmental humidity.
(11) Recommended humidity operating range is 10% to 70% RH. Prolonged operation outside this range may result in a measurement
offset. The measurement offset will decrease after operating the sensor in this recommended operating range.
(12) Drift due to aging effects at typical conditions (30°C and 20% to 50% RH). This value may be impacted by dust, vaporized solvents, out-
gassing tapes, adhesives, packaging materials, etc.
Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 5
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS TTTTT
SCL
SDA
tLOW
tHIGH
START REPEATED
START
STOP START
tSP
HDC1080
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
www.ti.com
7.6 I2C Interface Electrical Characteristics
At TA=30°C, VDD=3V (unless otherwise noted)
PARAMETER TEST CONDITION MIN TYP MAX UNIT
I2C INTERFACE VOLTAGE LEVEL
VIH Input High Voltage 0.7xVDD V
VIL Input Low Voltage 0.3xVDD V
VOL Output Low Voltage Sink current 3mA 0.4 V
HYS Hysteresis (1) 0.1xVDD V
CIN Input Capacitance on all digital pins 0.5 pF
(1) This parameter is specified by design and/or characterization and it is not tested in production.
7.7 I2C Interface Timing Requirements
PARAMETER TEST CONDITION MIN NOM MAX UNIT
I2C INTERFACE VOLTAGE LEVEL
fSCL Clock Frequency 10 400 kHz
tLOW Clock Low Time 1.3 µs
tHIGH Clock High Time 0.6 µs
tSP Pulse width of spikes that must be 50 ns
suppressed by the input filter (1)
tSTART Device Start-up time From VDD ≥2.7 V to ready for a 10 15 ms
conversion(1)(2)
(1) This parameter is specified by design and/or characterization and it is not tested in production.
(2) Within this interval it is not possible to communicate to the device.
Figure 1. I2C Timing
6Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS as as :Iun as
Vdd (V)
Idd (PA)
2.7 3 3.3 3.6 3.9 4.2 4.5 4.8 5
100
125
150
175
200
225
250
275
300 T= -20°C
T= 25°C
T= 40°C
T= 85°C
T= 125°C
Vdd (V)
Idd (PA)
2.7 3 3.3 3.6 3.9 4.2 4.5 4.8 5
100
125
150
175
200
225
250
275
300 T= -20°C
T= 25°C
T= 40°C
T= 85°C
T= 125°C
RH (%)
RH Accuracy (+/- %RH)
0 10 20 30 40 50 60 70 80 90 100
0
1
2
3
4
5
6
7
8
9
10
D001
Typical
HDC1080
www.ti.com
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
7.8 Typical Characteristics
Unless otherwise noted. TA= 30°C, VDD = 3V.
Figure 2. RH Accuracy vs. RH Figure 3. Temperature Accuracy vs. Temperature
Figure 4. Supply Current vs. Supply Voltage, RH Figure 5. Supply Current vs. Temperature, RH Measurement
Measurement Active Active
Figure 6. Supply Current vs. Supply Voltage, Temp Figure 7. Supply Current vs. Temperature, Temp
Measurement Active Measurement Active
Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 7
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS 12am mm as
Vdd (V)
Idd (nA)
2.7 3 3.3 3.6 3.9 4.2 4.5 4.8 5
0
200
400
600
800
1000
1200 T= -20°C
T= 25°C
T= 40°C
T= 85°C
T= 125°C
HDC1080
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
www.ti.com
Typical Characteristics (continued)
Unless otherwise noted. TA= 30°C, VDD = 3V.
Figure 8. Supply Current vs. Supply Voltage, Sleep Mode Figure 9. Supply Current vs. Temperature, Sleep Mode
8Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS
ADC
TEMPERATURE
RH
I2C
Registers
+
Logic
HDC1080
SDA
SCL
OTP
Calibration Coefficients
VDD
GND
HDC1080
www.ti.com
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
8 Detailed Description
8.1 Overview
The HDC1080 is a digital humidity sensor with integrated temperature sensor that provides excellent
measurement accuracy at very low power. The sensing element of the HDC1080 is placed on the top part of the
device. Measurement results can be read out through the I2C compatible interface. Resolution is based on the
measurement time and can be 8, 11, or 14 bits for humidity; 11 or 14 bits for temperature.
8.2 Functional Block Diagram
8.3 Feature Description
8.3.1 Power Consumption
One of the key features of the HDC1080 is its low power consumption, which makes the device suitable in
battery or power harvesting applications. In these applications the HDC1080 spends most of the time in sleep
mode: with a typical 100nA of current consumption in sleep mode, the averaged current consumption is minimal.
Its low consumption in measurement mode minimizes any self-heating.
8.3.2 Voltage Supply Monitoring
The HDC1080 monitors the supply voltage level and indicates when the voltage supply of the HDC1080 is less
than 2.8V. This information is useful in battery-powered systems in order to inform the user to replace the
battery. This is reported in the BTST field (register address 0x02:bit[11]) which is updated after POR and after
each measurement request.
8.3.3 Heater
The heater is an integrated resistive element that can be used to test the sensor or to drive condensation off the
sensor. The heater can be activated using HEAT, bit 13 in the Configuration Register. The heater helps in
reducing the accumulated offset after long exposure at high humidity conditions.
Once enabled the heater is turned on only in the measurement mode. To accelerate the temperature increase it
is suggested to increase the measurement data rate.
8.4 Device Functional Modes
The HDC1080 has two modes of operation: sleep mode and measurement mode. After power up, the HDC1080
is in sleep mode. In this mode, the HDC1080 waits for I2C input including commands to configure the conversion
times, read the status of the battery, trigger a measurement, and read measurements. Once it receives a
command to trigger a measurement, the HDC1080 moves from sleep mode to measurement mode. After
completing the measurement the HDC1080 returns to sleep mode.
Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 9
Product Folder Links: HDC1080
*9 TEXAS INSTRUMENTS u. .u
1 9
Ack by
Slave
Start by
Master
SCL
SDA
Frame 1
7-bit Serial Bus Address Byte
R/W
A2 A0A1A3A4A5A6
D7 D6 D5 D4 D3 D2 D1 D0
1 9
Ack by
Slave
Stop by
Master
1 9
D15 D14 D13 D12 D11 D10 D9 D8
Ack by
Slave
Frame 3
Data MSB from
MASTER
Frame 4
Data LSB from
MASTER
1 9
P7 P6 P5 P4 P3 P2 P1 P0
Ack by
Slave
Frame 2
Pointer Register Byte
SCL
SDA
HDC1080
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
www.ti.com
8.5 Programming
8.5.1 I2C Interface
The HDC1080 operates only as a slave device on the I2C bus interface. It is not allowed to have on the I2C bus
multiple devices with the same address. Connection to the bus is made via the open-drain I/O lines, SDA, and
SCL. The SDA and SCL pins feature integrated spike-suppression filters and Schmitt triggers to minimize the
effects of input spikes and bus noise. After power-up, the sensor needs at most 15 ms, to be ready to start RH
and temperature measurement. During this power-up time the HDC1080 is only able to provide the content of the
serial number registers (0xFB to 0xFF) if requested. After the power-up the sensor is in the sleep mode until a
communication or measurement is performed. All data bytes are transmitted MSB first.
8.5.1.1 Serial Bus Address
To communicate with the HDC1080, the master must first address slave devices via a slave address byte. The
slave address byte consists of seven address bits, and a direction bit that indicates the intent to execute a read
or write operation. The I2C address of the HDC1080 is 1000000 (7-bit address).
8.5.1.2 Read and Write Operations
To access a particular register on the HDC1080, write the desired register address value to the Pointer Register.
The pointer value is the first byte transferred after the slave address byte with the R/W bit low. Every write
operation to the HDC1080 requires a value for the pointer register (refer to Figure 10).
When reading from the HDC1080, the last value stored in the pointer by a write operation is used to determine
which register is accessed by a read operation. To change the pointer register for a read operation, a new value
must be written to the pointer register. This transaction is accomplished by issuing the slave address byte with
the R/W bit low, followed by the pointer byte. No additional data is required (refer to Figure 11).
The master can then generate a START condition and send the slave address byte with the R/W bit high to
initiate the read command. Note that register bytes are sent MSB first, followed by the LSB. A write operation in
a read-only register such as (DEVICE ID, MANUFACTURER ID, SERIAL ID) returns a NACK after each data
byte; read/write operation to unused address returns a NACK after the pointer; a read/write operation with
incorrect I2C address returns a NACK after the I2C address.
Figure 10. Writing Frame (Configuration Register)
10 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS 49-.” aw v7 119------ "'
1 9
Ack by
Slave
Start by
Master
SCL
SDA
Frame 1
7-bit Serial Bus Address Byte
R/W
A2 A0A1A3A4A5A6
D7 D6 D5 D4 D3 D2 D1 D0
1 9
Nack by
Master
Stop by
Master
1 9
D15 D14 D13 D12 D11 D10 D9 D8
Ack by
Master
Frame 4
Data MSB from
Slave
Frame 5
Data LSB from
Slave
1 9
P7 P6 P5 P4 P3 P2 P1 P0
Ack by
Slave
Frame 2
Pointer Register Byte
1 9
Start by
Master
SCL
SDA
Frame 3
7-bit Serial Bus Address Byte
R/W
A2 A0A1
A3A4A5A6
Ack by
Slave
HDC1080
www.ti.com
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
Programming (continued)
Figure 11. Reading Frame (Configuration Register)
8.5.1.3 Device Measurement Configuration
By default the HDC1080 will first perform a temperature measurement followed by a humidity measurement. On
power-up, the HDC1080 enters a low power sleep mode and is not actively measuring. Use the following steps
to perform a measurement of both temperature and humidity and then retrieve the results:
1. Configure the acquisition parameters in register address 0x02:
(a) Set the acquisition mode to measure both temperature and humidity by setting Bit[12] to 1.
(b) Set the desired temperature measurement resolution:
– Set Bit[10] to 0 for 14 bit resolution.
– Set Bit[10] to 1 for 11 bit resolution.
(c) Set the desired humidity measurement resolution:
– Set Bit[9:8] to 00 for 14 bit resolution.
– Set Bit[9:8] to 01 for 11 bit resolution.
– Set Bit[9:8] to 10 for 8 bit resolution.
2. Trigger the measurements by executing a pointer write transaction with the address pointer set to 0x00.
Refer to Figure 12.
3. Wait for the measurements to complete, based on the conversion time (refer to Electrical Characteristics(1)
for the conversion time).
4. Read the output data:
Read the temperature data from register address 0x00, followed by the humidity data from register address
0x01 in a single transaction as shown in Figure 14. A read operation will return a NACK if the contents of the
registers have not been updated as shown in Figure 13.
To perform another acquisition with the same measurement configuration simply repeat steps 2 through 4.
If only a humidity or temperature measurement is desired, the following steps will perform a measurement and
retrieve the result:
1. Configure the acquisition parameters in register address 0x02:
(a) Set the acquisition mode to independently measure temperature or humidity by setting Bit[12] to 0.
(b) For a temperature measurement, set the desired temperature measurement resolution:
– Set Bit[10] to 0 for 14 bit resolution.
– Set Bit[10] to 1 for 11 bit resolution.
(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 11
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS s no "mm R’ by i
1 9
Start by
Master
SCL
SDA
Frame 3
7-bit Serial Bus Address Byte
R/W
A2 A0A1
A3A4A5A6
Nack by
Slave
1 9
Ack by
Slave
Start by
Master
SCL
SDA
Frame 1
7-bit Serial Bus Address Byte
R/W
A2 A0A1
A3A4A5A6
1 9
P7 P6 P5 P4 P3 P2 P1 P0
Ack by
Slave
Frame 2
Pointer Register Byte
HDC1080
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
www.ti.com
Programming (continued)
(c) For a humidity measurement, set the desired humidity measurement resolution:
– Set Bit[9:8] to 00 for 14 bit resolution.
– Set Bit[9:8] to 01 for 11 bit resolution.
– Set Bit[9:8] to 10 for 8 bit resolution.
2. Trigger the measurement by executing a pointer write transaction. Refer to Figure 12
– Set the address pointer to 0x00 for a temperature measurement.
– Set the address pointer to 0x01 for a humidity measurement.
3. Wait for the measurement to complete, based on the conversion time (refer to Electrical Characteristics(1) for
the conversion time).
4. Read the output data:
Retrieve the completed measurement result from register address 0x00 or 0x01, as appropriate, as shown in
Figure 11. A read operation will return a NACK if the measurement result is not yet available, as shown in
Figure 13.
To perform another acquisition with the same measurement configuration repeat steps 2 through 4.
It is possible to read the output registers (addresses 0x00 and 0x01) during a Temperature or Relative Humidity
measurement without affecting any ongoing measurement. Note that a write to address 0x00 or 0x01 while a
measurement is ongoing will abort the ongoing measurement.
Figure 12. Trigger Humidity/Temperature Measurement
Figure 13. Read Humidity/Temperature Measurement (Data Not Ready)
12 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS s on -m------ D7 man-“rm slave Slave
D7 D6 D5 D4 D3 D2 D1 D0
1 9
Ack by
Master
1 9
D15 D14 D13 D12 D11 D10 D9 D8
Ack by
Master
Frame 4
Data MSB from
Slave
Frame 5
Data LSB from
Slave
1 9
Start by
Master
SCL
SDA
Frame 3
7-bit Serial Bus Address Byte
R/W
A2 A0A1A3A4A5A6
Ack by
Slave
SCL
SDA D7 D6 D5 D4 D3 D2 D1 D0
1 9
Nack by
Master
Stop by
Master
1 9
D15 D14 D13 D12 D11 D10 D9 D8
Ack by
Master
Frame 6
Data MSB from
Slave
Frame 7
Data LSB from
Slave
HDC1080
www.ti.com
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
Programming (continued)
Figure 14. Read Humidity and Temperature Measurement (Data Ready)
Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 13
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS R #] 100%RH /
> @
100%RH*
2
00:15HUMIDITY
RH)Humidity(% Relative 16 ¸
¹
·
¨
©
§
> @
C40-C165*
2
00:15ETEMPERATUR
C)e(Temperatur 16 qq
¸
¹
·
¨
©
§
q
HDC1080
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
www.ti.com
8.6 Register Map
The HDC1080 contains data registers that hold configuration information, temperature and humidity
measurement results, and status information.
Table 1. Register Map
Pointer Name Reset value Description
0x00 Temperature 0x0000 Temperature measurement output
0x01 Humidity 0x0000 Relative Humidity measurement output
0x02 Configuration 0x1000 HDC1080 configuration and status
0xFB Serial ID device dependent First 2 bytes of the serial ID of the part
0xFC Serial ID device dependent Mid 2 bytes of the serial ID of the part
0xFD Serial ID device dependent Last byte bit of the serial ID of the part
0xFE Manufacturer ID 0x5449 ID of Texas Instruments
0xFF Device ID 0x1050 ID of the device
Registers addresses 0x03 to 0xFA are reserved and should not be written.
The HDC1080 has an 8-bit pointer used to address a given data register. The pointer identifies which of the data
registers should respond to a read or write command on the two-wire bus. This register is set with every write
command. A write command must be issued to set the proper value in the pointer before executing a read
command. The power-on reset (POR) value of the pointer is 0x00, which selects a temperature measurement.
8.6.1 Temperature Register
The temperature register is a 16-bit result register in binary format (the 2 LSBs D1 and D0 are always 0). The
result of the acquisition is always a 14 bit value. The accuracy of the result is related to the selected conversion
time (refer to Electrical Characteristics(1)). The temperature can be calculated from the output data with:
Table 2. Temperature Register Description (0x00)
Name Bits Description
TEMPERATURE [15:02] Temperature Temperature measurement (read only)
[01:00] Reserved Reserved, always 0 (read only)
(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
8.6.2 Humidity Register
The humidity register is a 16-bit result register in binary format (the 2 LSBs D1 and D0 are always 0). The result
of the acquisition is always a 14 bit value, while the accuracy is related to the selected conversion time (refer to
Electrical Characteristics(1)). The humidity can be calculated from the output data with:
Table 3. Humidity Register Description (0x01)
Name Bits Description
HUMIDITY [15:02] Relative Relative Humidity measurement (read only)
Humidity
[01:00] Reserved Reserved, always 0 (read only)
(1) Electrical Characteristics Table values apply only for factory testing conditions at the temperature indicated. Factory testing conditions
result in very limited self-heating of the device such that TJ = TA. No guarantee of parametric performance is indicated in the electrical
tables under conditions of internal self-heating where TJ > TA. Absolute Maximum Ratings indicate junction temperature limits beyond
which the device may be permanently degraded, either mechanically or electrically.
14 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS
HDC1080
www.ti.com
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
8.6.3 Configuration Register
This register configures device functionality and returns status.
Table 4. Configuration Register Description (0x02)
NAME Bits DESCRIPTION
RST [15] Software reset 0 Normal Operation, this bit self clears
bit 1 Software Reset
Reserved [14] Reserved 0 Reserved, must be 0
HEAT [13] Heater 0 Heater Disabled
1 Heater Enabled
MODE [12] Mode of 0 Temperature or Humidity is acquired.
acquisition 1 Temperature and Humidity are acquired in sequence, Temperature first.
BTST [11] Battery Status 0 Battery voltage > 2.8V (read only)
1 Battery voltage < 2.8V (read only)
TRES [10] Temperature 0 14 bit
Measurement 1 11 bit
Resolution
HRES [9:8] Humidity 00 14 bit
Measurement 01 11 bit
Resolution 10 8 bit
Reserved [7:0] Reserved 0 Reserved, must be 0
8.6.4 Serial Number Registers
These registers contain a 40bit unique serial number for each individual HDC1080.
Table 5. Serial Number Register Description (0xFB)
Name Bits Description
SERIAL ID[40:25] [15:0] Serial Id bits Device Serial Number bits from 40 to 25 (read only)
Table 6. Serial Number Register Description (0xFC)
Name Bits Description
SERIAL ID[24:9] [15:0] Serial Id bits Device Serial Number bits from 24 to 9(read only)
Table 7. Serial Number Register Description (0xFD)
Name Bits Description
SERIAL ID[8:0] [15:7] Serial Id bits Device Serial Number bits from 8 to 0 (read only)
[6:0] Reserved Reserved, always 0 (read only)
8.6.5 Manufacturer ID Register
This register contains a factory-programmable identification value that identifies this device as being
manufactured by Texas Instruments. This register distinguishes this device from other devices that are on the
same I2C bus. The manufacturer ID reads 0x5449.
Table 8. Manufacturer ID Register Description (0xFE)
Name Bits Description
MANUFACTURER [15:0] Manufacturer 0x5449 Texas instruments ID (read only)
ID ID
Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 15
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS
HDC1080
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
www.ti.com
8.6.6 Device Register ID
This register contains a factory-programmable identification value that identifies the device. This register
distinguishes this device from other devices that are on the same I2C bus. A reading of the Device ID register
returns 0x1050.
Table 9. Device ID Register Description (0xFF)
Name Bits Description
DEVICE ID [15:0] Device ID 0x1050 Device ID (read only)
16 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS mmum Inn Bauery MU
I2C
Peripheral
I2C
Registers
+
Logic
OTP
Calibration Coefficients
GND
MCU
ADC
Temperature
RH HDC1080
SDA
SCL
VDD
GND
VDD
- +
GPIO
GPIO
GPIO
GPIO
Button
Button
Button
Keyboard
GPIO
To Airconditioning
System
Temp 29°C
RH 40%
TIME xx:xx
Date xx/xx/xxxx
Display
Lithium Ion
Battery TPL5110
GPIO
VDD
GND
DELAY/
M_DRIVE
DRV
EN/
ONE_SHOT
DONE
HDC1080
www.ti.com
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
9 Application and Implementation
NOTE
Information in the following applications sections is not part of the TI component
specification, and TI does not warrant its accuracy or completeness. TI’s customers are
responsible for determining suitability of components for their purposes. Customers should
validate and test their design implementation to confirm system functionality.
9.1 Application Information
An HVAC system thermostat control is based on environmental sensors and a micro-controller. The
microcontroller acquires data from humidity sensors and temperature sensors and controls the heating/cooling
system. The collected data are then shown on a display that can be easily controlled by the micro controller.
Based on data from the humidity and temperature sensor, the heating/cooling system then maintains the
environment at customer-defined preferred conditions.
9.2 Typical Application
In a battery-powered HVAC system thermostat, one of the key parameters in the selection of components is the
power consumption. The HDC1080, with 1.3μA of current consumption (average consumption over 1s for RH
and Temperature measurements), in conjunction with an MSP430, represents an excellent choice for low power
consumption, which extends the battery life. A system block diagram of a battery powered thermostat is shown in
Figure 15.
Figure 15. Typical Application Schematic HVAC
9.2.1 Design Requirements
In order to correctly sense the ambient temperature and humidity, the HDC1080 should be positioned away from
heat sources on the PCB. Generally, it should not be close to the LCD and battery. Moreover, to minimize any
self-heating of the HDC1080 it is recommended to acquire at a maximum sample rate of 1sps (RH + Temp). In
home systems, humidity and the temperature monitoring rates of less than 1sps (even 0.5sps or 0.2sps) can be
still effective.
Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 17
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS w — mm _ mm m \ f m 5 40 ‘ X m 20 0 mm 03mm mum 13mm 20mm 23mm mm 33mm 40mm 13mm hm:
HDC1080
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
www.ti.com
Typical Application (continued)
9.2.2 Detailed Design Procedure
When a circuit board layout is created from the schematic shown in Figure 15 a small circuit board is possible.
The accuracy of a RH and temperature measurement depends on the sensor accuracy and the setup of the
sensing system. The HDC1080 samples relative humidity and temperature in its immediate environment, it is
therefore important that the local conditions at the sensor match the monitored environment. Use one or more
openings in the physical cover of the thermostat to obtain a good airflow even in static conditions. Refer to the
layout below ( Figure 18) for a PCB layout which minimizes the thermal mass of the PCB in the region of the
HDC1080, which can improve measurement response time and accuracy.
9.2.3 Application Curve
The data shown below was acquired with the HDC1080EVM. A humidity chamber was used to control the
environment.
Figure 16. RH vs. Time
9.3 Implementation and Usage Recommendations
9.3.1 Soldering
When soldering the HDC1080 use the standard soldering profile IPC/JEDEC J-STD-020 with peak temperatures
of 260 °C.
When soldering the HDC1080 it is mandatory to use no-clean solder paste and no board wash should be
applied. The HDC1080 should be limited to a single IR reflow and no rework is recommended.
9.3.2 Chemical Exposure and Sensor Protection
The humidity sensor is not a standard IC and therefore should not be exposed to particulates or volatile
chemicals such as solvents or other organic compounds. If any type of protective coating must be applied to the
circuit board, the sensor must be protected during the coating process.
9.3.3 High Temperature and Humidity Exposure
Long exposure outside the recommended operating conditions may temporarily offset the RH output. Table 10
shows the RH offset values that can be expected for exposure to 85 °C and 85 % RH for durations between 12
and 500 hours (continuous).
18 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS
±6%
100
90
80
70
60
50
40
30
20
10
0
70605040302010
±4%
±4%
±3%
±3%
±2%
Temperature (°C)
RH Offset (%)
±5%
HDC1080
www.ti.com
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
Table 10. Induced RH Offset Due to Extended Exposure to High Humidity and High Temperature
(85°C/85% RH)
85°C/85% RH Duration (hours) 12 24 168 500
RH Offset (%) 3 6 12 15
When the sensor is exposed to less severe conditions, Figure 17 shows the typical RH offset at other
combinations of temperature and RH.
Figure 17. Relative Humidity Accuracy vs Temperature
10 Power Supply Recommendations
The HDC1080 requires a voltage supply within 2.7V and 5.5V. A multilayer ceramic bypass X7R capacitor of
0.1µF between the VDD and GND pins is recommended.
11 Layout
11.1 Layout Guidelines
The Relative Humidity sensor element is located on the top side of the package.
It is recommended to isolate the sensor from the rest of the PCB by eliminating copper layers below the device
(GND, VDD) and creating a slot into the PCB around the sensor to enhance thermal isolation.
11.2 Layout Example
The only component next to the device is the supply bypass capacitor. Since the relative humidity is dependent
on the temperature, the HDC1080 should be positioned away from hot spots present on the board, such as a
battery, display or micro-controller. Slots around the device can be used to reduce the thermal mass, for a
quicker response to environmental changes. The DAP may be soldered to a floating pad on the board, but the
board pad should NOT be connected to GND.
Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 19
Product Folder Links: HDC1080
HDC1080
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
www.ti.com
Layout Example (continued)
Figure 18. Layout
20 Submit Documentation Feedback Copyright © 2015–2016, Texas Instruments Incorporated
Product Folder Links: HDC1080
l TEXAS INSTRUMENTS
HDC1080
www.ti.com
SNAS672A –NOVEMBER 2015–REVISED JANUARY 2016
12 Device and Documentation Support
12.1 Documentation Support
12.1.1 Related Documentation
Texas Instruments Humidity Sensors,SNAA216, provides a general description of humidity sensing and
important design guidelines.
Humidity and Temp Sensor Node for Star Networks Enabling 10+ Year Coin Cell Battery Life Ref Design TIDA-
00374
Humidity and Temp Sensor Node for Sub-1GHz Star Networks Enabling 10+ Year Coin Cell Battery Life TIDA-
00484
Ultralow Power Multi-sensor Data Logger with NFC Interface Reference Design TIDA-00524
12.2 Community Resources
The following links connect to TI community resources. Linked contents are provided "AS IS" by the respective
contributors. They do not constitute TI specifications and do not necessarily reflect TI's views; see TI's Terms of
Use.
TI E2E™ Online Community TI's Engineer-to-Engineer (E2E) Community. Created to foster collaboration
among engineers. At e2e.ti.com, you can ask questions, share knowledge, explore ideas and help
solve problems with fellow engineers.
Design Support TI's Design Support Quickly find helpful E2E forums along with design support tools and
contact information for technical support.
12.3 Trademarks
E2E is a trademark of Texas Instruments.
All other trademarks are the property of their respective owners.
12.4 Electrostatic Discharge Caution
These devices have limited built-in ESD protection. The leads should be shorted together or the device placed in conductive foam
during storage or handling to prevent electrostatic damage to the MOS gates.
12.5 Glossary
SLYZ022 —TI Glossary.
This glossary lists and explains terms, acronyms, and definitions.
13 Mechanical, Packaging, and Orderable Information
The following pages include mechanical, packaging, and orderable information. This information is the most
current data available for the designated devices. This data is subject to change without notice and revision of
this document. For browser-based versions of this data sheet, refer to the left-hand navigation.
Copyright © 2015–2016, Texas Instruments Incorporated Submit Documentation Feedback 21
Product Folder Links: HDC1080
I TEXAS INSTRUMENTS Sample: Sample:
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 1
PACKAGING INFORMATION
Orderable Device Status
(1)
Package Type Package
Drawing Pins Package
Qty Eco Plan
(2)
Lead finish/
Ball material
(6)
MSL Peak Temp
(3)
Op Temp (°C) Device Marking
(4/5)
Samples
HDC1080DMBR ACTIVE WSON DMB 6 3000 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 1R
HDC1080DMBT ACTIVE WSON DMB 6 250 RoHS & Green NIPDAU Level-1-260C-UNLIM -40 to 125 1R
(1) The marketing status values are defined as follows:
ACTIVE: Product device recommended for new designs.
LIFEBUY: TI has announced that the device will be discontinued, and a lifetime-buy period is in effect.
NRND: Not recommended for new designs. Device is in production to support existing customers, but TI does not recommend using this part in a new design.
PREVIEW: Device has been announced but is not in production. Samples may or may not be available.
OBSOLETE: TI has discontinued the production of the device.
(2) RoHS: TI defines "RoHS" to mean semiconductor products that are compliant with the current EU RoHS requirements for all 10 RoHS substances, including the requirement that RoHS substance
do not exceed 0.1% by weight in homogeneous materials. Where designed to be soldered at high temperatures, "RoHS" products are suitable for use in specified lead-free processes. TI may
reference these types of products as "Pb-Free".
RoHS Exempt: TI defines "RoHS Exempt" to mean products that contain lead but are compliant with EU RoHS pursuant to a specific EU RoHS exemption.
Green: TI defines "Green" to mean the content of Chlorine (Cl) and Bromine (Br) based flame retardants meet JS709B low halogen requirements of <=1000ppm threshold. Antimony trioxide based
flame retardants must also meet the <=1000ppm threshold requirement.
(3) MSL, Peak Temp. - The Moisture Sensitivity Level rating according to the JEDEC industry standard classifications, and peak solder temperature.
(4) There may be additional marking, which relates to the logo, the lot trace code information, or the environmental category on the device.
(5) Multiple Device Markings will be inside parentheses. Only one Device Marking contained in parentheses and separated by a "~" will appear on a device. If a line is indented then it is a continuation
of the previous line and the two combined represent the entire Device Marking for that device.
(6) Lead finish/Ball material - Orderable Devices may have multiple material finish options. Finish options are separated by a vertical ruled line. Lead finish/Ball material values may wrap to two
lines if the finish value exceeds the maximum column width.
Important Information and Disclaimer:The information provided on this page represents TI's knowledge and belief as of the date that it is provided. TI bases its knowledge and belief on information
provided by third parties, and makes no representation or warranty as to the accuracy of such information. Efforts are underway to better integrate information from third parties. TI has taken and
continues to take reasonable steps to provide representative and accurate information but may not have conducted destructive testing or chemical analysis on incoming materials and chemicals.
TI and TI suppliers consider certain information to be proprietary, and thus CAS numbers and other limited information may not be available for release.
In no event shall TI's liability arising out of such information exceed the total purchase price of the TI part(s) at issue in this document sold by TI to Customer on an annual basis.
I TEXAS INSTRUMENTS
PACKAGE OPTION ADDENDUM
www.ti.com 10-Dec-2020
Addendum-Page 2
I TEXAS INSTRUMENTS REEL DIMENSIONS TAPE DIMENSIONS 7 “K0 '«m» Reel Diame|er AD Dimension deswgned to accommodate the componem wwdlh E0 Dimension desxgned to accommodate the componenl \ength KO Dimenslun deswgned to accommodate the componem thickness 7 w OveraH wwdm loe earner cape i p1 Pitch between successwe cavuy cemers f T Reel Width (W1) QUADRANT ASSIGNMENTS FOR PIN 1 ORIENTATION IN TAPE O O O D O O D O Sprockemoles ,,,,,,,,,,, ‘ User Direcllon 0' Feed Pockel Quadrams
TAPE AND REEL INFORMATION
*All dimensions are nominal
Device Package
Type Package
Drawing Pins SPQ Reel
Diameter
(mm)
Reel
Width
W1 (mm)
A0
(mm) B0
(mm) K0
(mm) P1
(mm) W
(mm) Pin1
Quadrant
HDC1080DMBR WSON DMB 6 3000 330.0 15.4 3.3 3.3 1.1 8.0 12.0 Q2
HDC1080DMBT WSON DMB 6 250 178.0 12.4 3.3 3.3 1.1 8.0 12.0 Q2
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Aug-2016
Pack Materials-Page 1
I TEXAS INSTRUMENTS TAPE AND REEL BOX DIMENSIONS
*All dimensions are nominal
Device Package Type Package Drawing Pins SPQ Length (mm) Width (mm) Height (mm)
HDC1080DMBR WSON DMB 6 3000 335.0 335.0 32.0
HDC1080DMBT WSON DMB 6 250 336.6 336.6 41.3
PACKAGE MATERIALS INFORMATION
www.ti.com 20-Aug-2016
Pack Materials-Page 2
GENERIC PACKAGE VIEW DMB 6 WSON - 0.8 mm max heigm PLASTIC SMALL OUTLINE , N0 LEAD Images above are jusl a represenlalion of the package family, aclual package may vary Refel lo the product dala sheel for package details. 4212623/D I TEXAS INSTRI IMFNTS
6/) 5® ‘
www.ti.com
PACKAGE OUTLINE
C
6X 0.45
0.35
2.4 0.1
6X 0.5
0.3
2X
2
1.5 0.1
4X 1
0.8 MAX
0.05
0.00
(1.2)
(1.3)
B3.1
2.9 A
3.1
2.9
(0.2) TYP
(0.45)
(0.22)
(0.9)
WSON - 0.8 mm max heightDMB0006A
PLASTIC SMALL OUTLINE - NO LEAD
4221225/C 12/2018
PIN 1 INDEX AREA
PICK AREA
NOTE 4
SEATING PLANE
0.08 C
1
34
6
(OPTIONAL)
PIN 1 ID 0.1 C A B
0.05 C
THERMAL PAD
EXPOSED
7
NOTES:
1. All linear dimensions are in millimeters. Any dimensions in parenthesis are for reference only. Dimensioning and tolerancing
per ASME Y14.5M.
2. This drawing is subject to change without notice.
3. The package thermal pad must be soldered to the printed circuit board for thermal and mechanical performance.
4. Pick and place nozzle 0.9 mm or smaller recommended.
SCALE 4.000
www.ti.com
EXAMPLE BOARD LAYOUT
0.07 MIN
ALL AROUND
0.07 MAX
ALL AROUND
(1.5)
4X (1)
(2.8)
6X (0.4)
6X (0.6)
(2.4)
(R0.05) TYP ( 0.2)
TYP
(0.95) TYP
(1) TYP
WSON - 0.8 mm max heightDMB0006A
PLASTIC SMALL OUTLINE - NO LEAD
4221225/C 12/2018
SYMM
1
3
4
6
SYMM
LAND PATTERN EXAMPLE
SCALE:20X
7
NOTES: (continued)
5. This package is designed to be soldered to a thermal pad on the board. For more information, see Texas Instruments literature
number SLUA271 (www.ti.com/lit/slua271).
6. Vias are optional depending on application, refer to device data sheet. If any vias are implemented, refer to their locations shown
on this view. It is recommended that vias under paste be filled, plugged or tented.
SOLDER MASK
OPENING
SOLDER MASK
METAL UNDER
SOLDER MASK
DEFINED
METAL
SOLDER MASK
OPENING
SOLDER MASK DETAILS
NON SOLDER MASK
DEFINED
(PREFERRED)
www.ti.com
EXAMPLE STENCIL DESIGN
6X (0.4)
6X (0.6)
4X (1) 2X (1.06)
2X (1.38)
(0.63)
(2.8)
(R0.05) TYP
WSON - 0.8 mm max heightDMB0006A
PLASTIC SMALL OUTLINE - NO LEAD
4221225/C 12/2018
NOTES: (continued)
7. Laser cutting apertures with trapezoidal walls and rounded corners may offer better paste release. IPC-7525 may have alternate
design recommendations.
SOLDER PASTE EXAMPLE
BASED ON 0.125 mm THICK STENCIL
EXPOSED PAD 7:
81% PRINTED SOLDER COVERAGE BY AREA UNDER PACKAGE
SCALE:20X
SYMM
1
34
6
SYMM
METAL
TYP
7
IMPORTANT NOTICE AND DISCLAIMER
TI PROVIDES TECHNICAL AND RELIABILITY DATA (INCLUDING DATASHEETS), DESIGN RESOURCES (INCLUDING REFERENCE
DESIGNS), APPLICATION OR OTHER DESIGN ADVICE, WEB TOOLS, SAFETY INFORMATION, AND OTHER RESOURCES “AS IS”
AND WITH ALL FAULTS, AND DISCLAIMS ALL WARRANTIES, EXPRESS AND IMPLIED, INCLUDING WITHOUT LIMITATION ANY
IMPLIED WARRANTIES OF MERCHANTABILITY, FITNESS FOR A PARTICULAR PURPOSE OR NON-INFRINGEMENT OF THIRD
PARTY INTELLECTUAL PROPERTY RIGHTS.
These resources are intended for skilled developers designing with TI products. You are solely responsible for (1) selecting the appropriate
TI products for your application, (2) designing, validating and testing your application, and (3) ensuring your application meets applicable
standards, and any other safety, security, or other requirements. These resources are subject to change without notice. TI grants you
permission to use these resources only for development of an application that uses the TI products described in the resource. Other
reproduction and display of these resources is prohibited. No license is granted to any other TI intellectual property right or to any third
party intellectual property right. TI disclaims responsibility for, and you will fully indemnify TI and its representatives against, any claims,
damages, costs, losses, and liabilities arising out of your use of these resources.
TI’s products are provided subject to TI’s Terms of Sale (www.ti.com/legal/termsofsale.html) or other applicable terms available either on
ti.com or provided in conjunction with such TI products. TI’s provision of these resources does not expand or otherwise alter TI’s applicable
warranties or warranty disclaimers for TI products.
Mailing Address: Texas Instruments, Post Office Box 655303, Dallas, Texas 75265
Copyright © 2020, Texas Instruments Incorporated