L'I IXYS
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IXYS Reserves the Right to Change Limits, Test Conditions and Dimensions.
MMIX4B20N300
Symbol Test Conditions Characteristic Values
(TJ = 25°C Unless Otherwise Specified) Min. Typ. Max.
gfS IC = 20A, VCE = 10V, Note 1 11 18 S
Cies 2230 pF
Coes VCE = 25V, VGE = 0V, f = 1MHz 92 pF
Cres 33 pF
Qg 105 nC
Qge IC = 20A, VGE = 15V, VCE = 1000V 13 nC
Qgc 45 nC
td(on) 64 ns
tr 210 ns
td(off) 300 ns
tf 504 ns
td(on) 68 ns
tr 540 ns
td(off) 300 ns
tf 395 ns
RthJC 0.83 °C/W
RthCS 0.05 °C/W
RthJA 30 °C/W
IXYS MOSFETs and IGBTs are covered 4,835,592 4,931,844 5,049,961 5,237,481 6,162,665 6,404,065 B1 6,683,344 6,727,585 7,005,734 B2 7,157,338B2
by one or more of the following U.S. patents: 4,860,072 5,017,508 5,063,307 5,381,025 6,259,123 B1 6,534,343 6,710,405 B2 6,759,692 7,063,975 B2
4,881,106 5,034,796 5,187,117 5,486,715 6,306,728 B1 6,583,505 6,710,463 6,771,478 B2 7,071,537
Resistive Switching Times, TJ = 125°C
IC = 20A, VGE = 15V
VCE = 1250V, RG = 10Ω
Resistive Switching Times, TJ = 25°C
IC = 20A, VGE = 15V
VCE = 1250V, RG = 10Ω
Reverse Diode
Symbol Test Conditions Characteristic Values
(TJ = 25°C Unless Otherwise Specified) Min. Typ. Max.
VF IF = 20A, VGE = 0V 2.1 V
trr 1.35 μs
IRM 30 A
IF = 10A, VGE = 0V, -diF/dt = 100A/μs
VR = 100V, VGE = 0V
Notes:
1. Pulse test, t ≤ 300μs, duty cycle, d ≤ 2%.
2. Device must be heatsunk for high temperature leakage current
measurements to avoid thermal runaway.
PRELIMINARY TECHNICAL INFORMATION
The product presented herein is under development. The Technical Specifications offered are derived
from data gathered during objective characterizations of preliminary engineering lots; but also may yet
contain some information supplied during a pre-production design evaluation. IXYS reserves the right
to change limits, test conditions, and dimensions without notice.