172946001 MagIC Power Module Datasheet by Würth Elektronik

1/53: WfiRTH ELEK'I'RONIK
WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
4.5 - 60V / 450mA / 4.5 - 60V Output
We-online.com Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
© May 2016 1/35
DESCRIPTION
The LDHM type of the MagI³C Power Module family
provides a fully integrated constant current LED driver
including the buck switching regulator and inductor in a
package.
The 172946001 offers high efficiency and delivers up to
450mA of LED current. It operates from 4.5V input
voltage up to 60V and supports up to 16 LEDs in series. It
is designed for fast PWM dimming for no color shift.
It is available in an innovative industrial high power
density TO263-7EP (10.16 x 13.77 x 4.57mm) package
that enhances thermal performance and allows for hand
or machine soldering.
The LDHM regulator has an on-board protection circuitry
to guard against thermal overstress and electrical
damage featuring thermal shut-down, input under-voltage
lockout and LED short-circuit protections.
TYPICAL APPLICATIONS
ƒ Indoor lighting: Spot light, down light
ƒ Outdoor lighting: Street light, security light, tunnel
light
ƒ Outdoor lighting: High-bay light, low-bay light
FEATURES
ƒ Peak efficiency up to 95%
ƒ Default LED current: 350mA
ƒ Adjustable LED current up to 450mA
ƒ Current sharing in parallel operation for higher
output current
ƒ Wide input voltage range: 4.5V to 60V
ƒ Output voltage range: 4.5V to 60V
ƒ Maximum output power: 27W
ƒ PWM dimming / Analog dimming
ƒ Integrated shielded inductor
ƒ Single exposed pad for best-in-class thermal
performance
ƒ Typical LED Current Accuracy ±3.5 %
ƒ LED short circuit protections
ƒ Under voltage lockout Protection (UVLO)
ƒ Fixed switching frequency at 800kHz
ƒ Compatible with ceramic and Low ESR Capacitors
ƒ Operating ambient temp. range up to 85°C
ƒ Operating junction temp. range: -40 to 125°C
ƒ RoHS & REACH compliant
ƒ Mold compound UL 94 Class V0 (flammability
testing) certified
ƒ Complies with EN 55015 radiated emissions
standard
TYPICAL CIRCUIT DIAGRAM
CIN
LED+
DIM
PGND
ISET
IFIX
LED-
Module
AGND
1
3
EP
6
VIN
2LED+
7
5
4RIADJ
High Power LED String
COUT
EVEEZ WfiRTH ELEK'I'RONIK rking ption WE W'urlh Eleknonik trade name M Momh LLLL Lm :race was G3 Lead fimsh code per JEDEC norm (green 3 ma‘ sin) WE201 Pan \dennfier
WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
We-online.com Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
© May 2016 2/35
PACKAGE
LED+
LED+
DIM
AGND
ISET
IFIX
LED-
1
2
3
4
5
6
7
6
7
Exposed Pad = PGND
Connect to AGND
EP
Top view
MARKING DESCRIPTION
Marking
Description
WE Würth Elektronik trade name
YYear
M Month
LLLL Lot trace code
G3 Lead finish code per JEDEC norm (green 3 mat sin)
WE201 Part identifier
PIN DESCRIPTION
SYMBOL PIN # TYPE PIN DESCRIPTION
LED+ 1, 2 Power Supply input and rail connection to the anode of the LED string.
DIM 3 Input Dimming control signal input. Left floating enables the driver. Optional: apply a logic
level PWM signal to control the brightness of the LED string.
AGND 4 Supply The analog ground pin is the reference point for all stated voltages and must be
connected to the exposed pad (EP) externally.
ISET 5 Input Connect a resistor between this pin and GND to adjust the LED current up to
450mA. If the default LED current of 350mA is desired, leave this pin floating.
IFIX 6 Input Connect this pin to GND to set the default LED current of 350mA. In case a different
value of LED current is required, leave this pin floating.
LED- 7 Power The current return pin of the LED string. Connect to the cathode of the LED string.
PGND EP Power Exposed Pad. Connect to copper plane(s) with thermal vias for thermal
performance. Must be electrically connected to pin 4.
6
7
Package marking
YMLLLLG3
WE201
EVEEZ WfiRTH ELEK'I'RONIK W'unh Eleklronik eiSos GmbH & Co, KG
WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
We-online.com Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
© May 2016 3/35
ORDERING INFORMATION
ORDER CODE PART DESCRIPTION PACKAGE PACKING UNIT
172946001 WLMDU9456001JT TO263-7EP Tape and Reel with 250 Units
158998 Demonstration Board 1
178946001 Evaluation Board 1
SALES INFORMATION
SALES CONTACTS
Würth Elektronik eiSos GmbH & Co. KG
EMC & Inductive Solutions
Max-Eyth-Str. 1
74638 Waldenburg
Germany
Tel. +49 (0) 79 42 945 - 0
www.we-online.com
powermodules@we-online.com
WURTH ELEK'I'RONIK AX LED Input and LED output to GND PWM Dimmrng input to GND LED current Adjustment Pins to GND Junction temperature Assembled, non operating storage temperature Thermal shut down, junctron temperature risrng Thermal shut down hysteresrs. faHing
WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
We-online.com Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
© May 2016 4/35
ABSOLUTE MAXIMUM RATINGS
Caution:
Exceeding the listed absolute maximum ratings may affect the device negatively and may cause permanent damage.
SYMBOL PARAMETER LIMITS UNIT
MIN
MAX
LED+, LED- LED Input and LED output to GND -0.3 67 V
DIM PWM Dimming input to GND -0.3 6 V
IFIX, ISET LED current Adjustment Pins to GND -0.3 5 V
VESD-HBM ESD, human body model (1) (All Pins except IFIX Pin 6) -2000 2000 V
TJJunction temperature 150 °C
Tstorage Assembled, non operating storage temperature 0 150 °C
TSOLR
Peak case/leads temperature during reflow soldering, max. 30sec
(2)
Maximum two cycles!
240 ±5°C °C
OPERATING CONDITIONS
Operating conditions are conditions under which operation of the device is intended to be functional. All values are
referenced to GND.
MIN and MAX limits are valid for the recommended ambient temperature range of -40°C to 85°C.
SYMBOL PARAMETER MIN (3) TYP (4) MAX (3) UNIT
LED+ Input voltage 4.5 - 60 V
DIM PWM Dimming input 0 - 5.5 V
TAAmbient temperature range -40 - 85 °C
TJJunction temperature range -40 - 125 °C
ILED Nominal LED current 450 mA
THERMAL SPECIFICATIONS
SYMBOL
PARAMETER
TYP UNIT
θJA Thermal resistance junction to ambient(5) 19.3 °C/W
θJC Thermal resistance junction to case, no air flow 1.9 °C/W
TSD Thermal shut down, junction temperature, rising 170 °C
TSD-HYST Thermal shut down hysteresis, falling 10 °C
4/53: WfiRTH ELEK'I'RONIK Vw : 4.5 I0 60V TJ TJ Vw : 60V, TJ V D : 24V. TJ V D : 24V. TJ V D : OV‘ D‘M pin :hreshold DIM pin hysteresxs walching frequency
WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
We-online.com Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
© May 2016 5/35
ELECTRICAL SPECIFICATIONS
MIN and MAX limits are valid for the recommended junction temperature range of -40°C to 125°C unless otherwise stated.
Typical values represent statistically the utmost probability at following conditions: VIN=48V, ILED = 350 mA.
VIN is the voltage applied across LED+ and GND. IIN is the input current flowing into the LED+ node. ILED is a LED current
flowing into the LED- pin. VLED is the voltage applied across LED+ and LED-. VDIM is the voltage applied across the DIM pin
to GND. Resistor RIADJ connect from ISET pin to GND.
SYMBOL PARAMETER TEST CONDITIONS MIN (3) TYP (4) MAX (3) UNIT
IIN Input current
VIN = 4.5 to 60V
VLED = 0V;
VDIM=0V
TJ = 25°C
2.1 2.65 3.0 mA
ILED LED current
VLED = 24V;
IFIX connected to GND;
RIADJ = not connected;
TJ = -40°C to 125°C
337 350 371 mA
ILED-60V LED current VIN = 60V
VIN = 60V;
VLED = 36V;
IFIX connected to GND;
RIADJ = not connected;
TJ = -40°C to 125°C
338 350 374 mA
ILED-ADJ450 Adjustment LED current
VLED = 24V;
IFIX floating;
RIADJ = 2.33kΩ;
TJ = -40°C to 125°C
437 450 483 mA
ILED-ADJ300 Adjustment LED current
VLED = 24V;
IFIX floating;
RIADJ = 3.5 kΩ;
TJ = -40°C to 125°C
282 300 316 mA
ILED-SHORT
LED short circuit current VIN
= 60V
VLED = 0V;
VIN = 60V;
DIM = open
800 920 1020 mA
ILED-LEAK “LED-“ pin leakage current
VLED = 0V;
VIN = operating max;
DIM = 0V
1.2 µA
VDIM DIM pin threshold VDIM increasing 1.0 1.3 V
VDIM-HYS DIM pin hysteresis 0.25 V
fSW Switching frequency 0.72 0.8 0.92 MHz
NOTES
(1) The human body model is a 100pF capacitor discharged through a 1.5 kΩ resistor into each pin. The pin 6 ( IFIX
pin) passes ± 1 kV. Test method is per JESD22-AI14S.
(2) JEDEC J-STD020
(3) Min and Max limits are 100% production tested at 25°C. Limits over the operating temperature range are
guaranteed through correlation using Statistical Quality Control (SQC) methods.
(4) Typical numbers are valid at 25°C ambient temperature and represent statistically the utmost probability assuming
the Gaussian distribution.
(5) θJA measured on a 43.3 mm x 76.2 mm four layer board, with 35 µm copper , thirty five 0.3 mm thermal vias, no air
flow, and 1 W power dissipation.
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
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© May 2016 6/35
TYPICAL PERFORMANCE CURVES
If not otherwise specified, the following conditions apply: VIN = 48 V; CIN = 2.2 µF 100 V X7R ceramic capacitor for driving
5-13 power LEDs, ILED = 350 mA; Single LED forward voltage used is 3.2 V; TAMB = 25 °C
D
Radiated Emissions (dBλV/m)
Freqency (MHz)
Radiated Emissions EN55015 compliant:
VIN = 60V; ILED = 350mA; CIN/COUT = 2.2µF;
LEDs = 16
30 100 300
0
10
30
40
50
70
20
60
80
EMI
EN 55015 limit
Con dition s: hor i zon tal ; he igh t = 3m; r an ge = 10 m
28
D
Radiated Emissions (dBλV/m)
Freqency (MHz)
Radiated Emissions EN55015 compliant:
VIN = 60V; ILED = 350mA; CIN/COUT = 2.2µF;
LEDs = 16
30 100 300
0
10
30
40
50
70
20
60
80
EMI
EN 55015 limit
Con dition s: vertica l; he igh t = 1m; ran ge = 10 m
010 20 30 40
60
65
70
75
80
85
90
95
100
Efficiency (%)
Input Voltage(V)
1LED
2LED
3LED
4LED
Efficiency: ILED = 350mA; TAMB = 25°C
Efficiency (%)
Input Voltage(V)
Efficiency: ILED = 350mA; TAMB = 25°C
2530354045505560
75
80
85
90
95
6LED
10LED
14LED
16LED
ILED Regulation: 350mA; TAMB = 25°C
010 20 30 40
-3
-2
-1
0
1
2
3
ILED Regulation (%)
Input Voltage (V)
1LED
2LED
3LED
4 L ED
ILED Regulation: 350mA; TAMB = 25°C
-3
-2
-1
0
1
2
3
ILED Regulation (%)
Input Voltage (V)
25 30 35 40 45 50 55 60
6 L ED
10LED
14LED
16LED
EVEfi wfiRTH ELEK'IIONIK /l /I // ///
WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
We-online.com Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
© May 2016 7/35
TYPICAL PERFORMANCE CURVES
If not otherwise specified, the following conditions apply: VIN = 48 V; CIN = 2.2 µF 100 V X7R ceramic capacitor for driving
5-13 power LEDs, ILED = 350 mA; Single LED forward voltage used is 3.2 V; TAMB = 25 °C
010 20 30 40
60
65
70
75
80
85
90
95
100
Efficiency (%)
Input Voltage(V)
1LED
2LED
3LED
4LED
Efficiency: ILED = 450mA; TAMB = 25°C
Efficiency (%)
Input Voltage(V)
Efficiency: ILED = 450mA; TAMB = 25°C
2530354045505560
75
80
85
90
95
6LED
10LED
14LED
16LED
ILED Regulation: 450mA; TAMB = 25°C
010 20 30 40
-3
-2
-1
0
1
2
3
ILED Regulation (%)
Input Voltage (V)
1LED
2LED
3LED
4 L ED
ILED Regulation: 450mA; TAMB = 25°C
-3
-2
-1
0
1
2
3
ILED Regulation (%)
Input Voltage (V)
25 30 35 40 45 50 55 60
6 L ED
10LED
14LED
16LED
010 20 30 40
60
65
70
75
80
85
90
95
100
Efficiency (%)
Input Voltage(V)
1LED
2LED
3LED
4LED
Efficiency: ILED = 300mA; TAMB = 25°C
Efficiency (%)
Input Voltage(V)
Efficiency: ILED = 300mA; TAMB = 25°C
2530354045505560
75
80
85
90
95
6LED
10LED
14LED
16LED
100
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
We-online.com Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
© May 2016 8/35
TYPICAL PERFORMANCE CURVES
If not otherwise specified, the following conditions apply: VIN = 48 V; CIN = 2.2 µF 100 V X7R ceramic capacitor for driving
5-13 power LEDs, ILED = 350 mA; Single LED forward voltage used is 3.2 V; TAMB = 25 °C
ILED Regulation: 300mA; TAMB = 25°C
010 20 30 40
-3
-2
-1
0
1
2
3
ILED Regulation (%)
Input Voltage (V)
1LED
2LED
3LED
4 L ED
ILED Regulation: 300mA; TAMB = 25°C
-3
-2
-1
0
1
2
3
ILED Regulation (%)
Input Voltage (V)
25 30 35 40 45 50 55 60
6 L ED
10LED
14LED
16LED
ILED Regulation over Temperature
ILE D Regulation (%)
Temper ature (°C)
-50 -25 0 25 50 75 100 125
-3
-2
-1
0
1
2
3
11LED (V
IN
= 60V)
8LED (V
IN
= 48V)
6LED (V
IN
= 36V)
ILED vs VIN - 6LED
LED Current (mA)
Input Voltage (V)
010 20 30 40 50 60
0
50
1 00
1 50
2 00
2 50
3 00
3 50
4 00
4 50
25°C
-40°C
125°C
Input current vs V
IN; VDIM = 0V
Input Current (mA)
Input Voltage (V)
010 20 30 40 50 60
0.0
0.5
1.0
1.5
2.0
2.5
3.0
25°C
-40°C
125°C
Input current vs V IN
LED = open; DIM = open
InputCurrent(mA)
Input Voltage (V)
010 20 30 40 50 60
0.0
0.5
1.0
1.5
2.0
2.5
3.0
3.5
4.0
25°C
-40°C
125 °C
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WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
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© May 2016 9/35
TYPICAL PERFORMANCE CURVES
If not otherwise specified, the following conditions apply: VIN = 48 V; CIN = 2.2 µF 100 V X7R ceramic capacitor for driving
5-13 power LEDs, ILED = 350 mA; Single LED forward voltage used is 3.2 V; TAMB = 25 °C
ILED vs VIN
VLED = 0V; DIM = open
LEDCurrent (mA)
Input Voltage (V)
010 20 30 40 50 60
0
200
400
600
800
1000
25°C
-40°C
125 °C
IIN vs VIN
VLED = 0V; DIM = open
Input Current (mA)
Input Voltage (V)
010 20 30 40 50 60
0
20
40
60
80
100
25°C
-40°C
125 °C
1 0050
LED Current over Dimming Duty Ratio
LED Current (%)
Dimming Duty Ratio (%)
00 10 20 30 40 60 70 80 90
0
10
20
30
40
50
60
70
80
90
100
11LED (V
IN
= 60V)
8LED (VIN
= 48V)
6LED (VIN
= 36V)
20
D
LED Current over Dimming Duty
Ratio (0-1%)
LED Current (%)
Dimming Duty Ratio (%)
0.0 0.2 0.4 0.6 0.8 1.0
0.0
0.2
0.4
0.6
0.8
1.0
11LED (V
IN
= 60V)
8LED (V
IN
= 48V)
6LED (V
IN
= 36V)
Frequency Deviation vs VIN (800kHz)
Frequency Deviation (%)
Input Voltage (V)
202530354045505560
-3
-2
-1
0
1
2
3
25°C
-40°C
125°C
200
250
300
350
400
450
500
2300 2500 2700 2900 3100 3300 3500
LED Current [mA]
RIADJ [Ω]
ILED vs RIADJ - 6 LEDs, VIN = 24V
EVEfi LEDr WfiRTH ELEK'I'RONIK ‘|.__ En. HR ,_ ,7
WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
We-online.com Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
© May 2016 10/35
BLOCK DIAGRAM
LED-
DIM
47µH
Power Module
Voltage
Regulator
12
3
7
Switch Control
& Logic
LED+
VIN
Current
mirror
VCC
-
+
1.25V
VCC 1λF
0.33µF
AGND
EP
IFIX
LED+
4
5
6Vref
PGND Rsense
3kΩ
GND
CIN
COUT
ISET
High Power LED array
Error
Amplifier
CIRCUIT DESCRIPTION
The MagI³C Power Module 172946001 is based on a non-synchronous floating buck regulator (simplified schematic below)
with integrated MOSFET, integrated diode and a power inductor. Note that in a floating buck topology the load (LEDs) is not
connected to GND. The control loop is based on a current mode control scheme with fixed switching frequency, assuring
accurate constant current regulation and good EMI performance. High speed dimming is implemented by direct control of
the PWM signal.
LED-
LED+
LED+
VIN
controller
CIN COUT
Rsense
PGND
Floating buck
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MagI3C Power Module
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DESIGN FLOW
The next 4 simple steps will show how to select the external components to design your power application:
Essential Steps
1. Set the LED driver module current
2. Select the appropriate number of LEDs
3. Layout and EMI considerations
Optional Steps
4. Dimming control
5. Parallel operation
CIN
LED+
DIM
PGND
ISET
IFIX
LED-
Module
AGND
1
3
EP
6
VIN
2LED+
7
5
4RIADJ
High Power LED String
1.
3.
COUT
3.
4.
2.
5.
1/53: WfiRTH ELEK'I'RONIK H H V— H . A vREF- k 1,25v - 840 [LED : : — (1) Run); Run)!
WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
We-online.com Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
© May 2016 12/35
DESIGN FLOW
Step 1 Program the LED driver module current
The LED driver module requires no external current sensing resistor for LED current regulation. If the default LED current of
350mA is desired, no external resistor is necessary. It is enough to connect the IFIX pin to GND and to leave the ISET pin
open, as shown in the picture below:
CIN
LED+
DIM
PGND
ISET
IFIX
LED-
Module
AGND
1
3
EP
6
VIN
2LED+
7
5
4
High Power LED String
COUT
Setup for fixed 350mA LED current
If a different LED current is required, it can be adjusted from 300 mA to 450 mA by varying the value of the resistor RIADJ,
connected between ISET pin and GND, leaving the IFIX pin open, according to the following equation and as shown in the
picture on the next page:
I

=
V

∙
R

=
1
,
25V
∙
840
R

(
1
)
where VREF is the internal voltage reference and k is the current mirror ratio between the LED current and the current flowing
through RIADJ. The factor k is fixed by design to 840.
|| II V— a :: o— L A (Vm *VLEDWVLED 2-L-f -v 1/53: WfiRTH ELEK'I'RONIK
WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
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© May 2016 13/35
DESIGN FLOW
CIN
LED+
DIM
PGND
ISET
IFIX
LED-
Module
AGND
1
3
EP
6
VIN
2LED+
7
5
4RIADJ
High Power LED String
COUT
Setup for full adjustable LED current
According to equation (1) LED current values lower than 300mA can be also set. The minimum value of the LED current
depends on the minimum current that keeps the device operating in CCM. This current is a function of the number of LEDs
and the input voltage:
I,_ =(V −V
)∙V

2∙L∙f
 ∙V

(2)
1/53: WfiRTH ELEK'I'RONIK ————~ :: x x \ — — - ~ \ ‘ \ \ \ \ \ \ \ \ /\ \ Number 01 LEDs Maximum Swimh Currem Limit LED 1 2 3 4 5 6 16 Max. VIN (V) 12 20 30 40 50 60
WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
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DESIGN FLOW
The picture below shows the minimum adjustable LED current according to the number of LEDs (forward voltage assumed
3,2V) and the input voltage.
Maximum Switch Current Limit
The LED Driver Module features an integrated switch current limiting mechanism to prevent the LEDs from being overdriven.
The switch current limiter is triggered when the switch current is three times exceeding the current level set by the resistor.
Once the current limiter is triggered, the internal power switch turns OFF for 3.6 μs to demagnetize the inductor until inductor
current reduces back to normal level. The current limiting feature is exceptionally important to avoid permanent damage of
the LED driver module application circuit due to short circuit of the LED string.
Step 2 Select the appropriate number of LEDs
The on-time of the internal switch should not be shorter than 400 ns. The number of LEDs (typical forward voltage at 3.2 V)
to input voltage is constrained by that as shown in the following table.
No. of LED
1
2
3
4
5
6
-
16
Max. VIN (V) 12 20 30 40 50 60
0
50
100
150
200
250
1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16
Minimum adjustable LED current [mA]
Number of LEDs
Vin = 12V
Vin = 24V
Vin = 36V
Vin = 48V
Vin = 60V
sz ore than you expect I EVEfi wiin'rH ELEKI'IIONIK
WLMDU9456001JT / 172946001
MagI3C Power Module
LDHM - LED Step Down High Current Module
We-online.com Würth Elektronik eiSos GmbH & Co. KG – Data Sheet Rev. 1.0
© May 2016 15/35
DESIGN FLOW
Step 3 Layout and EMI considerations
The overall performance of the LED driver module highly depends on the PCB layout. Poor board layout can disrupt the
performance of the LED driver module and surrounding circuitry by contributing to EMI, ground bounce and resistive voltage
drop in the traces. These can send incorrect signals to the LED driver module resulting in poor regulation and stability. Good
layout can be implemented by following a few simple design rules.
∂ Place CIN as close as possible to the LED+ pin (pin 1 + pin 2) and PGND exposed pad (EP).
C
IN1
C
IN2
COUT2
COUT1
Exposed pad
1
2
234567
RIADJ
VIN
GND
LED+ LED-DIM AGND ISET IFIX
Bottom
GROUND PLANE
PGND
Top layer Bottom layer
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DESIGN FLOW
∂ Place C
OUT (for reduction of LED current ripple and EMI compliance) as close as possible to the LED+ pin
(pin 1+pin 2) and LED- pin (pin 7).
CIN1 CIN2
COUT2
COUT1
Exposed pad
1
2
234567
RIADJ
VIN
GND
LED+ LED-DIM AGND ISET IFIX
Bottom
GROUND PLANE
PGND
EVEfi wiin'rH ELEKI'IIONIK x X more than you expect I
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∂ PGND exposed pad (EP) must be connected to the AGND pin (pin 4) directly.
CIN1 CIN2
COUT2
COUT1
Exposed pad
1
2
234567
RIADJ
VIN
GND
LED+ LED-DIM AGND ISET IFIX
Bottom
GROUND PLANE
PGND
From an EMI reduction standpoint, it is imperative to minimize the di/dt current paths (refer to LED driver module current
loops). Therefore, it is recommended to connect an 2.2 μF capacitor (COUT) across the LED+ pin and LED- pin. This will
minimize the ripple current so that it can reduce radiated EMI.
LED driver module current loops
ON-loop
OFF-loop
LED-
LED+LED+
VIN
Rsense
CIN COUT
controller
PGND
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The 172946001 could work properly also without any COUT. In this case the inductor ripple will be added to the LED current,
as shown in the picture below.
Considering the frequency range of the ripple oscillations (800kHz), it does not lead to any visible flickering of the emitted
light. Nevertheless the presence of a certain ripple in the LED current increases the LED junction temperature. This
accelerates the aging of the LED and reduces its lifetime. Higher LED temperature causes the efficiency of the LED to drop.
In addition, electromagnetic emissions are increased due to the presence of the current ripple along the complete LED string
and connection wires.
Therefore a small MLCC output capacitor of 2,2µF is anyway recommended.
0
100
200
300
400
500
0246810
LED Current [mA]
Time [µs]
LED current with and without output capacitor
Without Cout
With Cout
|| || fl 4 VAmM'k 1/53: WfiRTH ELEK'I'RONIK
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Step 4 Dimming Control
Two ways to implement the LED dimming are offered: the analog dimming and the PWM dimming. Both methods control the
average current flowing through the LEDs.
Analog dimming
The analog dimming can be achieved adjusting the LED current by using an external voltage source (VADIM), as shown in the
schematic below:
CIN
LED+
DIM
PGND
ISET
IFIX
LED-
Module
AGND
1
3
EP
6
VIN
2LED+
7
5
4RIADJ
RADIM
VADIM
High Power LED String
COUT
Variable
volta ge source
The LED current can be adjusted from ILEDmax to I
LEDmin by selecting the resistor RIADJ and R
ADIM, as described by the
following equations:
R =V ∙k
I
, −I
,
(3)
R =V ∙V
 ∙k
V
 ∙I
, −V
 ∙(I, −I
,)(4)
where VREF = 1.25V and k is the current mirror ratio (internally set to 840).
EVEfi. WfiRTH ELEK'I'RONIK V V] R k0 R k0 O to 3.3 18.48 (18.7 c1oses1value1% series) 2.67 0 10 5 28.00 2.55
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Example. In the following table two possible external voltage sources and the required resistors are shown. In both cases a
LED current from 300mA to 450mA can be adjusted
V
ADIM
range [V]
R
ADIM
[kΩ]
R
IADJ
[kΩ]
0 to 3.3 18.48 (18.7 closest value 1% series) 2.67
0 to 5 28.00 2.55
The picture below shows how the LED current varies according to the analog dimming voltage, using the above mentioned
resistors.
Since the color temperature of the LED depends on the current flowing through the LED, the analog dimming does not allow
to keep constant the color of the emitted light. For applications where the color of the emitted light plays a crucial role, a
PWM (following section) is strongly recommended.
300
350
400
450
012345
LED current [mA]
Analog dimming voltage ADIM [V]
LED current variation through the analog dimming
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PWM Dimming
Controlling the brightness of the LED emitted light while keeping the same color can be achieved by properly driving the
LED. A well-known limitation of the human eye is not to distinguish light flickering with frequency above 100-120Hz. The idea
of the PWM dimming of LEDs means simply switching on and off the LED above this frequency. The human eye will
perceive the color corresponding to the current flowing through the LED during the switch-on phase. It will implement a kind
of integration of the perceived brightness, corresponding to the average current flowing through the LED, as described in the
picture below:
ILED
t
Average current BRIGHTNESS
ILED,peak
COLOR
The 172946001 offers the possibility to implement a PWM dimming by using the dedicated pin DIM.
The DIM pin of the LED driver module is an input with internal pull-up that accepts logic signals for average LED current
control. Applying a logic high (above 1.3 V) signal to the DIM pin or leaving the DIM pin open will enable the device. Applying
a logic low signal (below 0.7 V) to the DIM pin will disable the switching activity of the device but maintain the operation of
the internal voltage regulator (VCC).
0
100
200
300
400
500
0 4 8 12 16
LED current [mA]
time [ms]
PWM dimming
0
2
4
6
8
10
0 4 8 12 16
PWM dimming signal [V]
time [ms]
Example with PWM dimming frequency of
250
Hz
1 16ps-256 ~CR 1/53: WfiRTH ELEK'I'RONIK
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The maximum frequency of the PWM dimming signal (fDIM,max) should not exceed, as rule of thumb,1/10 of the switching
frequency:
f = 800kHz ⇒  f, = 80kHz(5)
The minimum dimming on-time pulse (tDIM,on_min) is around 16µs. The frequency of the dimming signal must be adjusted
according to the required dimming contrast ratio (CR). The contrast ratio is defined as the number of steps between the
minimum (dark) and maximum (full light) brightness of a lighting source.
The higher the CR, the lower is the frequency, as described by the equation below:
f, =1
t,_ ∙CR(6)
Example 1. If a PWM signal is generated by a 8 bit timer of a microcontroller, 256 different steps are available (the
achievable contrast ratio would be 256:1). According to the equation (6), the following dimming frequency is calculated:
f =1
16μs ∙ 256 = 244Hz(7)
A PWM dimming frequency of 250Hz can be used. Varying the duty cycle of the PWM signal, 256 different level of
brightness of the LEDs can be achieved, as shown in the picture below:
16µs
32µs
48µs
fDIM = 250Hz
fDIM = 250Hz
fDIM = 250Hz
Darker LED
Brighter LED
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Example 2. Assuming to keep the on-time of the PWM signal always equal to the tDIM,on_min, varying the frequency of the
PWM signal (PFM LED brightness control), the LED brightness can be adjusted as well as different contrast ratios can be
achieved (see picture below):
16µs
fDIM
> 250Hz
16µs
fDIM = 250Hz
16µs
fDIM < 250Hz
Darker LED
Brighter LED
Higher CR
Lower CR
The constant duration of the LED on-time limits the LED junction temperature increase during dimming. As consequence,
the efficiency of this brightness control is higher compared to the PWM control.
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Example 3. The schematic below shows a possible combination of analog and PWM dimming in order to set the color temperature of the
emitted light and, at the same time, to adjust the brightness.
CIN
LED+
DIM
PGND
ISET
IFIX
LED-
Module
AGND
1
3
EP
6
VIN
2LED+
7
5
4RIADJ
High Power LED String
RADIM
VADIM
PWM signal
BRIGHNTESS SETTING
COLOR SETTING
CIN
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Step 5 Parallel operation
When a load current higher than 450 mA is required by the application, LED driver modules can be used in parallel to deliver
higher current. With common VIN and GND pins, each LED driver module will operate as independent asynchronous current
source driving the same current. The total DC current of the modules will be additive; however, low frequency sub-harmonic
current ripple may be present and its frequency and magnitude will depend upon the phase relationship between the internal
clocks as there is no possibility for synchronizing driver clocks. Current sharing modules should have a local CIN capacitor of
minimum 2.2 μF located as close to VIN and GND as possible.
Parallel operation circuit schematic
1234567
LED+
LED+
DIM
GND
ISET
IFIX
LED-
Exposed Pad
(EP)
VIN
RIADJ
COUT
1234567
LED+
LED+
DIM
GND
ISET
IFIX
LED-
Exposed Pad
(EP)
RIADJ
COUT
High Power LED Array
Module Module
ILED1 ILED2
CIN CIN
31D
Parallel operation result; ILED = 900mA
LED Current (A)
Input Voltage (V)
010 20 30 40 50 60
0.0
0.1
0.2
0.3
0.4
0.5
0.6
0.7
0.8
0.9
1.0
1L ED
9L ED
16LED
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PROTECTIVE FEATURES
Shorted LED protection
Example
3V
LED shorted
18V 350mA 350mA
3V
3V
3V
3V
15V
3V
0V
3V
3V
3V
3V
3V
In case of a short circuit of one or more LEDs, the loop will react in order to adapt the voltage across the LED string, as
shown in the picture below.
8
10
12
14
16
18
20
22
24
0 50 100 150 200
LED Voltage [V]
Time [µs]
Shorted LED protection
LEDshorted
6 LEDs
5 LEDs
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Similarly, in case the LED is only temporary shorted and then again normally working, the voltage across the LED string will
be adapted accordingly. In any case the current through the LED string is not affected, keeping the programmed value.
Open LED behavior
LED or string open
0mA
VIN
18V 350mA
3V
3V
3V
3V
3V
3V 3V
3V
3V
3V
3V
When a LED becomes an open circuit or simply the LED string is disconnected by the LED driver, the current stops flowing
through the LED string. As consequence the control loop will set the voltage between LED+ and LED- to the input voltage
(VIN), as shown below:
Monitoring the LED string voltage by an external microcontroller allows the detection of defective strings.
0
0,3
0,6
0,9
1,2
1,5
0
5
10
15
20
25
30
0100 200 300 400 500 600
LED Current [A]
LED Voltage [V]
Time [µs]
Behavior of the LED driver in case of open LED or open string
LEDopen
VLED
VIN
LEDcurrent=350mA
LED current= 0mA
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APPLICATIONS
The MagI³C LED driver module for constant current is easy-to-use for current solutions capable of driving up to a 450 mA
load with exceptional power conversion efficiency. They are available in an innovative package that enhances thermal
performance and allows for hand or machine soldering. Following application circuits show possible operating
configurations.
Application Circuit
CIN
LED+
DIM
PGND
ISET
IFIX
LED-
Module
AGND
1
3
EP
6
VIN
2LED+
7
5
4RIADJ
High Power LED String
COUT
In the table below the recommended component values, under the following conditions: TA = 25°C; VIN = up to 60V; up to
16 LEDs.
I
LED
300mA
350mA
450mA
RIADJ 3.5kΩNot connected 2.33kΩ
IFIX pin open to GND open
CIN 2.2 µF ; 100 V ; X7R
COUT 2.2 µF ; 100 V ; X7R
EWEE: wfiRTH ELEK'I'IONIK Fosikion ‘herrnocouple In center of package
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HANDLING RECOMMENDATIONS
1. The power module is classified as MSL3 (JEDEC Moisture Sensitivity Level 3) and requires special handling due to
moisture sensitivity (JEDEC J-STD033).
2. The parts are delivered in a sealed bag (Moisture Barrier Bags = MBB) and should be processed within one year.
3. When opening the moisture barrier bag check the Humidity Indicator Card (HIC) for color status. Bake parts prior to
soldering in case indicator color has changed according to the notes on the card .
4. Parts must be processed after 168 hour (7 days) of floor life. Once this time has been exceeded, bake parts prior to
soldering per JEDEC J-STD033 recommendation.
SOLDER PROFILE
1. Only Pb-Free assembly is recommended according to JEDEC J-STD020.
2. Measure the peak reflow temperature of the MagI³C power module in the middle of the top view.
3. Ensure that the peak reflow temperature does not exceed 240°C ±5°C as per JEDEC J-STD020.
4. The reflow time period during peak temperature of 240°C ±5°C must not exceed 20 seconds.
5. Reflow time above liquidus (217°C) must not exceed 60 seconds.
6. Maximum ramp up is rate 3°C per second
7. Maximum ramp down rate is 6°C per second
8. Reflow time from room (25°C) to peak must not exceed 8 minutes as per JEDEC J-STD020.
9. Maximum numbers of reflow cycles is two.
10. For minimum risk, solder the module in the last reflow cycle of the PCB production.
11. For soldering process please consider lead material copper (Cu) and lead finish tin (Sn).
12. For solder paste use a standard SAC Alloy such as SAC 305, type 3 or higher.
13. Below profile is valid for convection reflow only
14. Other soldering methods (e.g.vapor phase) are not verified and have to be validated by the customer on his own risk
Temperature [°C]
Time [sec]
150
180
217
Max 245
Max 120 sec
Min 60 sec
Max 60 sec
Min 30 sec
Max 10 - 30 sec
240°C
Ramp Up Rate
Max 3°C/sec
Ramp Down Rate
Max 6°C/sec
Max 2 solder cycles !
Preheat
Liquidus
Peak
EVE—$5 WfiRTH ELEK'I'IONIK - ficavpmw 762 127 1 (0 3) [854} 9155 :0 25 I a 1 1 E L 1192:0125 1377 1035 10161025
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PHYSICAL DIMENSIONS (mm)
Package Type: TO263-7
762 0 89 W. 7305 LL54 EVEfi wfin'rH ELEKI'IIONIK r—fz 575 WP more than you expect I
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recommended soldering pad recommended stencil design
solder paste recommendation 150µm
WURTH ELEK'I'IONIK ww » [muse m cemer W1 W: w: W; .2 max mm max Have wmm [ um... 2mm 30m 2190 2140
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PACKAGING
Reel (mm)
165" 7180“ WURTH ELEK'I'IONIK Pull-ororce \ Tape mm \ 24 mm DAN-1,3N & AV“ C H DU Learearrsyrmwew$~9§~9a~93 a;We)"mrrmrrmrmwmrreyrmrl—T l :z—j r loucmev “IHI V lane 3 “3 “lHl a 3 H l n f ‘2 A0 so w P1 1 n 12 E1 :2 r P0 P2 'hpe Wilfxrauinn tolevance Iyp \yp ff gm gun max (yp m1 mm :0‘05 “11 :0‘05 E 15253.75; m‘su 14,22 24m mm 050 um 5m 1.50 L75 22,251L5n 4m 2m Palyslymne 250 mm» Em, Feedmg alrecuon mm «Aymara F i 1‘ F L z A ‘ ND CUMPDNENT COMPUNENTS N0 COMPONENT mm 150 mm mm mm cox/mm mmADUmm Packaalnu \s marred mme m|ema|mna\ mndam \EC 60286 73 20m
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Tape (mm)
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DOCUMENT HISTORY
Revision Date Description Comment
1.0 May 2016 Release of final version
CAUTIONS AND WARNINGS
The following conditions apply to all goods within the product series of MagI³C of
Würth Elektronik eiSos GmbH & Co. KG:
General:
All recommendations according to the general technical specifications of the data-sheet have to be complied with.
The usage and operation of the product within ambient conditions which probably alloy or harm the component surface has
to be avoided.
The responsibility for the applicability of customer specific products and use in a particular customer design is always within
the authority of the customer. All technical specifications for standard products do also apply for customer specific products.
Residual washing varnish agent that is used during the production to clean the application might change the characteristics
of the body, pins or termination. The washing varnish agent could have a negative effect on the long term function of the
product.
Direct mechanical impact to the product shall be prevented as the material of the body, pins or termination could flake or in
the worst case it could break. As these devices are sensitive to electrostatic discharge customer shall follow proper IC
Handling Procedures.
Customer acknowledges and agrees that it is solely responsible for compliance with all legal, regulatory and safety-related
requirements concerning its products, and any use of Würth Elektronik eiSos GmbH & Co. KG components in its
applications, notwithstanding any applications-related information or support that may be provided by Würth Elektronik eiSos
GmbH & Co. KG. Customer represents and agrees that it has all the necessary expertise to create and implement
safeguards which anticipate dangerous consequences of failures, monitor failures and their consequences lessen the
likelihood of failures that might cause harm and take appropriate remedial actions. Customer will fully indemnify Würth
Elektronik eiSos and its representatives against any damages arising out of the use of any Würth Elektronik eiSos GmbH &
Co. KG components in safety-critical applications.
Product specific:
Follow all instructions mentioned in the datasheet, especially:
∂ The solder profile has to comply with the technical reflow or wave soldering specification, otherwise this will void the
warranty.
∂ All products are supposed to be used before the end of the period of 12 months based on the product date-code.
∂ Violation of the technical product specifications such as exceeding the absolute maximum ratings will void the warranty.
∂ It is also recommended to return the body to the original moisture proof bag and reseal the moisture proof bag again.
∂ ESD prevention methods need to be followed for manual handling and processing by machinery.
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IMPORTANT NOTES
The following conditions apply to all goods within the product range of Würth Elektronik eiSos GmbH & Co. KG:
1. General Customer Responsibility
Some goods within the product range of Würth Elektronik eiSos GmbH & Co. KG contain statements regarding general
suitability for certain application areas. These statements about suitability are based on our knowledge and experience of
typical requirements concerning the areas, serve as general guidance and cannot be estimated as binding statements about
the suitability for a customer application. The responsibility for the applicability and use in a particular customer design is
always solely within the authority of the customer. Due to this fact it is up to the customer to evaluate, where appropriate to
investigate and decide whether the device with the specific product characteristics described in the product specification is
valid and suitable for the respective customer application or not. Accordingly, the customer is cautioned to verify that the
datasheet is current before placing orders.
2. Customer Responsibility related to Specific, in particular Safety-Relevant Applications
It has to be clearly pointed out that the possibility of a malfunction of electronic components or failure before the end of the
usual lifetime cannot be completely eliminated in the current state of the art, even if the products are operated within the
range of the specifications. In certain customer applications requiring a very high level of safety and especially in customer
applications in which the malfunction or failure of an electronic component could endanger human life or health it must be
ensured by most advanced technological aid of suitable design of the customer application that no injury or damage is
caused to third parties in the event of malfunction or failure of an electronic component.
3. Best Care and Attention
Any product-specific notes, warnings and cautions must be strictly observed.
4. Customer Support for Product Specifications
Some products within the product range may contain substances which are subject to restrictions in certain jurisdictions in
order to serve specific technical requirements. Necessary information is available on request. In this case the field sales
engineer or the internal sales person in charge should be contacted who will be happy to support in this matter.
5. Product R&D
Due to constant product improvement product specifications may change from time to time. As a standard reporting
procedure of the Product Change Notification (PCN) according to the JEDEC-Standard we inform about minor and major
changes. In case of further queries regarding the PCN, the field sales engineer or the internal sales person in charge should
be contacted. The basic responsibility of the customer as per Section 1 and 2 remains unaffected.
6. Product Life Cycle
Due to technical progress and economical evaluation we also reserve the right to discontinue production and delivery of
products. As a standard reporting procedure of the Product Termination Notification (PTN) according to the JEDEC-
Standard we will inform at an early stage about inevitable product discontinuance. According to this we cannot guarantee
that all products within our product range will always be available. Therefore it needs to be verified with the field sales
engineer or the internal sales person in charge about the current product availability expectancy before or when the product
for application design-in disposal is considered. The approach named above does not apply in the case of individual
agreements deviating from the foregoing for customer-specific products.
7. Property Rights
All the rights for contractual products produced by Würth Elektronik eiSos GmbH & Co. KG on the basis of ideas,
development contracts as well as models or templates that are subject to copyright, patent or commercial protection
supplied to the customer will remain with Würth Elektronik eiSos GmbH & Co. KG. Würth Elektronik eiSos GmbH & Co. KG
does not warrant or represent that any license, either expressed or implied, is granted under any patent right, copyright,
mask work right, or other intellectual property right relating to any combination, application, or process in which Würth
Elektronik eiSos GmbH & Co. KG components or services are used.
8. General Terms and Conditions
Unless otherwise agreed in individual contracts, all orders are subject to the current version of the “General Terms and
Conditions of Würth Elektronik eiSos Group”, last version available at www.we-online.com.