IC Sockets

Results: 51
Series
104110111114115116121122123124126146210214
Contact Finish - Mating
GoldTinTin-Lead
Contact Finish Thickness - Mating
10.0µin (0.25µm)30.0µin (0.76µm)100.0µin (2.54µm)200.0µin (5.08µm)
Mounting Type
Surface MountThrough Hole
Features
Carrier, Open FrameClosed FrameElevated, Open FrameOpen FrameOpen Frame, Decoupling Capacitor
Termination
Press-FitSolderWire Wrap
Contact Finish - Post
GoldTinTin-Lead
Contact Finish Thickness - Post
10.0µin (0.25µm)200.0µin (5.08µm)
Housing Material
Polycyclohexylenedimethylene Terephthalate (PCT), PolyesterThermoplastic
Operating Temperature
-55°C ~ 125°C-
Stocking Options
Environmental Options
Media
Marketplace Product
51Results
Showing
of 51
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
872
In Stock
1 : ¥16.17000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1,124
In Stock
1 : ¥25.78000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
520
In Stock
1 : ¥26.11000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1,665
In Stock
1 : ¥38.50000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
110-(44,99)-628-41-001000
110-99-628-41-001000
CONN IC DIP SOCKET 28POS TINLEAD
Mill-Max Manufacturing Corp.
499
In Stock
1 : ¥16.17000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
904
In Stock
1 : ¥22.99000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
747
In Stock
1 : ¥25.78000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
348
In Stock
1 : ¥26.11000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
112
In Stock
1 : ¥26.84000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin
100.0µin (2.54µm)
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
186
In Stock
1 : ¥30.62000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
136
In Stock
1 : ¥30.62000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
105
In Stock
1 : ¥36.04000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
218
In Stock
1 : ¥67.65000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame, Decoupling Capacitor
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
200
In Stock
1 : ¥25.28000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
1,528
In Stock
1 : ¥40.47000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Carrier, Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
142
In Stock
1 : ¥78.81000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame, Decoupling Capacitor
Solder
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
76
In Stock
1 : ¥32.26000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
214-(44,99)-628-01-670800
214-99-628-01-670800
CONN IC DIP SOCKET 28POS TINLEAD
Mill-Max Manufacturing Corp.
85
In Stock
1 : ¥26.84000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin-Lead
100.0µin (2.54µm)
Beryllium Copper
Surface Mount
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
58
In Stock
1 : ¥67.65000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame, Decoupling Capacitor
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
56
In Stock
1 : ¥91.21000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
10.0µin (0.25µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
210-99-628-41-001000
210-99-628-41-001000
CONN IC DIP SOCKET 28POS TINLEAD
Mill-Max Manufacturing Corp.
56
In Stock
1 : ¥132.83000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Tin-Lead
100.0µin (2.54µm)
Beryllium Copper
Through Hole
Closed Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
89
In Stock
1 : ¥191.44000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame, Decoupling Capacitor
Wire Wrap
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
9
In Stock
1 : ¥64.85000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Wire Wrap
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
0
In Stock
Check Lead Time
1 : ¥32.26000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Open Frame
Solder
0.100" (2.54mm)
Tin-Lead
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
8
In Stock
1 : ¥40.47000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
28 (2 x 14)
0.100" (2.54mm)
Gold
30.0µin (0.76µm)
Beryllium Copper
Through Hole
Carrier, Open Frame
Solder
0.100" (2.54mm)
Tin
200.0µin (5.08µm)
Brass Alloy
Polycyclohexylenedimethylene Terephthalate (PCT), Polyester
-55°C ~ 125°C
Showing
of 51

IC Sockets

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.