Heat Sinks

Results: 23
Manufacturer
Adafruit Industries LLCAdvanced Thermal Solutions Inc.Assmann WSW ComponentsBoyd Laconia, LLCCTS Thermal Management ProductsCUI DevicesDFRobotWakefield-VetteWatterott Electronic GmbH
Series
-APFDeltem™HSBPenguin
Packaging
BagBoxBulkTube
Type
Board LevelBoard Level, VerticalTop Mount
Package Cooled
6-Dip and 8-Dip-Assorted (BGA, LGA, CPU, ASIC...)BGARaspberry PiRaspberry Pi 3Stepper Motor Driver BoardTO-220
Attachment Method
AdhesiveBolt OnBolt On and PC PinPress FitThermal Tape, Adhesive (Included)Thermal Tape, Adhesive (Not Included)
Shape
RectangularRectangular, FinsSquare, FinsSquare, Pin Fins
Length
0.334" (8.50mm)0.335" (8.50mm)0.354" (9.00mm)0.520" (13.20mm)0.551" (14.00mm)0.591" (15.00mm)0.650" (16.51mm)0.669" (17.00mm)0.709" (18.00mm)0.748" (19.00mm)0.750" (19.05mm)0.787" (20.00mm)1.500" (38.10mm)1.575" (40.00mm)
Width
0.250" (6.35mm)0.335" (8.50mm)0.354" (9.00mm)0.476" (12.10mm)0.520" (13.21mm)0.551" (14.00mm)0.590" (15.00mm)0.591" (15.00mm)0.650" (16.51mm)0.653" (16.59mm)0.669" (17.00mm)0.709" (18.00mm)0.748" (19.00mm)0.750" (19.05mm)
Fin Height
0.189" (4.80mm)0.197" (5.00mm)0.236" (6.00mm)0.250" (6.35mm)0.315" (8.00mm)0.350" (8.89mm)0.354" (9.00mm)0.374" (9.50mm)0.375" (9.52mm)0.380" (9.65mm)0.394" (10.00mm)0.400" (10.16mm)0.453" (11.50mm)0.472" (12.00mm)
Power Dissipation @ Temperature Rise
2.0W @ 30°C2.0W @ 40°C2.1W @ 75°C2.5W @ 60°C2.5W @ 75°C3.0W @ 80°C3.1W @ 75°C3.2W @ 75°C8.0W @ 80°C20.0W @ 60°C-
Thermal Resistance @ Forced Air Flow
2.00°C/W @ 300 LFM3.00°C/W @ 500 LFM4.30°C/W @ 200 LFM7.10°C/W @ 200 LFM8.00°C/W @ 500 LFM8.40°C/W @ 200 LFM10.00°C/W @ 200 LFM12.00°C/W @ 200 LFM13.10°C/W @ 200 LFM15.80°C/W @ 200 LFM18.80°C/W @ 200 LFM24.00°C/W @ 200 LFM25.00°C/W @ 350 LFM29.50°C/W @ 200 LFM
Thermal Resistance @ Natural
2.60°C/W11.00°C/W12.00°C/W23.68°C/W23.91°C/W24.00°C/W25.90°C/W27.00°C/W29.73°C/W32.00°C/W35.98°C/W80.00°C/W-
Material
AluminumAluminum AlloyCompositeCopper
Material Finish
-Black Anodized
Stocking Options
Environmental Options
Media
Marketplace Product
23Results
Showing
of 23
Compare
Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Package Cooled
Attachment Method
Shape
Length
Width
Diameter
Fin Height
Power Dissipation @ Temperature Rise
Thermal Resistance @ Forced Air Flow
Thermal Resistance @ Natural
Material
Material Finish
507302B00000G
507302B00000G
HEATSINK TO-220 2.5W LOW PROFILE
Boyd Laconia, LLC
14,979
In Stock
1 : ¥2.46000
Bulk
-
Bulk
Active
Board Level
TO-220
Bolt On
Square, Fins
0.750" (19.05mm)
0.750" (19.05mm)
-
0.380" (9.65mm)
2.5W @ 60°C
10.00°C/W @ 200 LFM
24.00°C/W
Aluminum
Black Anodized
30,337
In Stock
11,500
Factory
1 : ¥3.86000
Bulk
-
Bulk
Active
Top Mount
6-Dip and 8-Dip
Press Fit
Rectangular, Fins
0.334" (8.50mm)
0.250" (6.35mm)
-
0.189" (4.80mm)
-
-
80.00°C/W
Aluminum
Black Anodized
577102B00000G
577102B00000G
HEAT SINK TO-220 .375" COMPACT
Boyd Laconia, LLC
13,454
In Stock
1 : ¥7.47000
Bag
-
Bag
Active
Board Level
TO-220
Bolt On
Rectangular, Fins
0.750" (19.05mm)
0.520" (13.21mm)
-
0.375" (9.52mm)
3.0W @ 80°C
12.00°C/W @ 200 LFM
25.90°C/W
Aluminum
Black Anodized
HSB05-171711
HSB05-171711
HEAT SINK, BGA, 17 X 17 X 11.5 M
CUI Devices
1,302
In Stock
1 : ¥8.87000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.453" (11.50mm)
3.1W @ 75°C
8.40°C/W @ 200 LFM
23.91°C/W
Aluminum Alloy
Black Anodized
513102B02500(G)
513102B02500G
HEATSINK TO-220 W/PINS 1.5"TALL
Boyd Laconia, LLC
15,327
In Stock
1 : ¥11.58000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
1.500" (38.10mm)
1.375" (34.93mm)
-
0.500" (12.70mm)
8.0W @ 80°C
3.00°C/W @ 500 LFM
11.00°C/W
Aluminum
Black Anodized
LTN20069-T5
LTN20069
HEAT SINK BGA/PGA 16.5X16.5X8.9
Wakefield-Vette
3,169
In Stock
1 : ¥12.23000
Bulk
Bulk
Active
Board Level
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Fins
0.650" (16.51mm)
0.653" (16.59mm)
-
0.350" (8.89mm)
-
8.00°C/W @ 500 LFM
-
Aluminum
Black Anodized
3083
3083
ALUM HEAT SINK FOR RASPBERRY PI
Adafruit Industries LLC
481
In Stock
1 : ¥12.31000
Bulk
-
Bulk
Active
Top Mount
Raspberry Pi 3
Thermal Tape, Adhesive (Included)
Square, Fins
0.551" (14.00mm)
0.551" (14.00mm)
-
0.315" (8.00mm)
-
-
-
Aluminum
-
3082
3082
ALUM HEATSINK FOR RASPBERRY PI
Adafruit Industries LLC
993
In Stock
1 : ¥16.01000
Bulk
-
Bulk
Active
Top Mount
Raspberry Pi 3
Thermal Tape, Adhesive (Included)
Square, Fins
0.591" (15.00mm)
0.591" (15.00mm)
-
0.590" (15.00mm)
-
-
-
Aluminum
-
530002B02500(G)
530002B02500G
HEATSINK TO-220 POWER W/PINS BK
Boyd Laconia, LLC
2,190
In Stock
1 : ¥17.16000
Bulk
-
Bulk
Active
Board Level, Vertical
TO-220
Bolt On and PC Pin
Rectangular, Fins
2.500" (63.50mm)
1.650" (41.91mm)
-
1.000" (25.40mm)
20.0W @ 60°C
2.00°C/W @ 300 LFM
2.60°C/W
Aluminum
Black Anodized
D10650-40
D10650-40
HEATSINK 100PQFP COMPOSITE
Wakefield-Vette
1,460
In Stock
1 : ¥38.58000
Tube
Tube
Active
Top Mount
BGA
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.650" (16.51mm)
0.650" (16.51mm)
-
0.400" (10.16mm)
2.0W @ 40°C
25.00°C/W @ 350 LFM
-
Composite
-
2,919
In Stock
1 : ¥46.96000
Box
Box
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Included)
Square, Fins
0.748" (19.00mm)
0.748" (19.00mm)
-
0.250" (6.35mm)
-
7.10°C/W @ 200 LFM
-
Aluminum
Black Anodized
1,776
In Stock
1 : ¥57.55000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Fins
0.591" (15.00mm)
0.591" (15.00mm)
-
0.374" (9.50mm)
-
29.50°C/W @ 200 LFM
-
Aluminum
Black Anodized
31,012
In Stock
4,800
Factory
1 : ¥3.20000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.335" (8.50mm)
0.335" (8.50mm)
-
0.315" (8.00mm)
-
-
32.00°C/W
Aluminum Alloy
Black Anodized
2,380
In Stock
1 : ¥5.34000
Bulk
-
Bulk
Active
Top Mount
Assorted (BGA, LGA, CPU, ASIC...)
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.551" (14.00mm)
0.551" (14.00mm)
-
0.394" (10.00mm)
-
-
27.00°C/W
Aluminum Alloy
Black Anodized
HSB04-171706
HSB04-171706
HEAT SINK, BGA, 17 X 17 X 6 MM
CUI Devices
1,839
In Stock
1 : ¥6.65000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.669" (17.00mm)
0.669" (17.00mm)
-
0.236" (6.00mm)
2.5W @ 75°C
13.10°C/W @ 200 LFM
29.73°C/W
Aluminum Alloy
Black Anodized
HSB06-181810
HSB06-181810
HEAT SINK, BGA, 18 X 18 X 10 MM
CUI Devices
1,875
In Stock
1 : ¥8.37000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.709" (18.00mm)
0.709" (18.00mm)
-
0.394" (10.00mm)
3.2W @ 75°C
18.80°C/W @ 200 LFM
23.68°C/W
Aluminum Alloy
Black Anodized
V2269E1
V2269E1
CPU HEATSINK, CROSS CUT, AL6063,
Assmann WSW Components
874
In Stock
1,404
Factory
1 : ¥8.54000
Bulk
-
Bulk
Active
Top Mount
-
Thermal Tape, Adhesive (Not Included)
Square, Pin Fins
0.787" (20.00mm)
0.787" (20.00mm)
-
0.354" (9.00mm)
-
-
27.00°C/W
Aluminum Alloy
Black Anodized
375024B00032(G)
375024B00032G
HEATSINK BGA W/ADHESIVE TAPE
Boyd Laconia, LLC
1,360
In Stock
1 : ¥26.11000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Pin Fins
1.575" (40.00mm)
1.575" (40.01mm)
-
0.709" (18.00mm)
2.0W @ 30°C
4.30°C/W @ 200 LFM
12.00°C/W
Aluminum
Black Anodized
1,727
In Stock
1 : ¥59.35000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Included)
Square, Fins
0.748" (19.00mm)
0.748" (19.00mm)
-
0.374" (9.50mm)
-
24.00°C/W @ 200 LFM
-
Aluminum
Black Anodized
20188
20188
SILENTSTEPSTICK HEATSINK 9 X 9 X
Watterott Electronic GmbH
368
In Stock
1 : ¥7.63000
Bulk
-
Bulk
Active
Top Mount
Stepper Motor Driver Board
Thermal Tape, Adhesive (Included)
Square, Pin Fins
0.354" (9.00mm)
0.354" (9.00mm)
-
0.472" (12.00mm)
-
-
-
Aluminum
Black Anodized
HSB03-141406
HSB03-141406
HEAT SINK, BGA, 14 X 14 X 6 MM
CUI Devices
0
In Stock
Check Lead Time
1 : ¥6.07000
Box
Box
Active
Top Mount
BGA
Adhesive
Square, Pin Fins
0.551" (14.00mm)
0.551" (14.00mm)
-
0.236" (6.00mm)
2.1W @ 75°C
15.80°C/W @ 200 LFM
35.98°C/W
Aluminum Alloy
Black Anodized
FIT0367
FIT0367
RASPBERRY PI COPPER HEATSINK
DFRobot
0
In Stock
Check Lead Time
1 : ¥8.13000
Bulk
-
Bulk
Active
Top Mount
Raspberry Pi
Thermal Tape, Adhesive (Included)
Rectangular
0.520" (13.20mm)
0.476" (12.10mm)
-
-
-
-
-
Copper
-
17
In Stock
1 : ¥17.49000
Bulk
-
Bulk
Active
Top Mount
BGA
Thermal Tape, Adhesive (Not Included)
Square, Fins
0.591" (15.00mm)
0.590" (15.00mm)
-
0.197" (5.00mm)
-
38.56°C/W @ 200 LFM
-
Aluminum
Black Anodized
Showing
of 23

Heat Sinks

Passive heat exchangers that transfer the heat generated by an electronic component to a fluid medium, often air or a liquid coolant, dissipating it away from the device to maintain an optimal operating temperature. They are designed to maximize the surface area in contact with the medium surrounding it. They are usually made out of copper or aluminum due to their high thermal conductivity.