Solder

Results: 2
Series
-Smooth Flow™
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)Sn96.5Ag3Cu0.5 (96.5/3/0.5)
Melting Point
280°F (138°C)423 ~ 428°F (217 ~ 220°C)
Mesh Type
34
Form
Jar, 1.76 oz (50g)Syringe, 0.35 oz (10g), 5cc
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Marketplace Product
2Results
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Composition
Diameter
Melting Point
Flux Type
Wire Gauge
Mesh Type
Process
Form
Shelf Life
Shelf Life Start
Storage/Refrigeration Temperature
NC191LT10
NC191LT10
SMOOTH FLOW LOW TEMP SOLDER PAST
Chip Quik Inc.
90
In Stock
1 : ¥69.02000
Bulk
Bulk
Active
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
-
280°F (138°C)
No-Clean
-
4
Lead Free
Syringe, 0.35 oz (10g), 5cc
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
SMD291SNL50T3
SMD291SNL50T3
SLDR PASTE NO-CLN SAC305 50G
Chip Quik Inc.
0
In Stock
Check Lead Time
1 : ¥147.16000
Bulk
-
Bulk
Active
Solder Paste
Sn96.5Ag3Cu0.5 (96.5/3/0.5)
-
423 ~ 428°F (217 ~ 220°C)
No-Clean
-
3
Lead Free
Jar, 1.76 oz (50g)
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
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Solder

Solder is Metal Alloys that are used to join metal surfaces to each other. The types are bar solder, ribbon solder, solder paste, solder shot, solder sphere, or wire solder in diameters ranging from 0.006” (0.15mm) to 0.250” (6.35mm) with melting point ranging from 244°F (118°C) to 1983°F (1084°C) in lead free or leaded. The flux type is acid cored, no-clean, rosin activated, rosin mildly activated, or water soluble.