Solder

Results: 2
Series
-Smooth Flow™
Type
Solder PasteWire Solder
Composition
Bi57.6Sn42Ag0.4 (57.6/42/0.4)Sn60Pb40 (60/40)
Diameter
0.031" (0.79mm)-
Melting Point
280°F (138°C)361 ~ 370°F (183 ~ 188°C)
Wire Gauge
20 AWG, 21 SWG-
Process
Lead FreeLeaded
Form
Syringe, 0.35 oz (10g), 5ccTube, 0.50 oz (14.17g)
Shelf Life
6 Months-
Shelf Life Start
-Date of Manufacture
Storage/Refrigeration Temperature
37°F ~ 46°F (3°C ~ 8°C)-
Stocking Options
Environmental Options
Media
Marketplace Product
2Results
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of 2
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Composition
Diameter
Melting Point
Flux Type
Wire Gauge
Mesh Type
Process
Form
Shelf Life
Shelf Life Start
Storage/Refrigeration Temperature
NC2SW.031-0.5OZ
NC2SW.031 0.5OZ
SOLDER WIRE MINI POCKET PACK 60/
Chip Quik Inc.
256
In Stock
1 : ¥25.85000
Bulk
-
Bulk
Active
Wire Solder
Sn60Pb40 (60/40)
0.031" (0.79mm)
361 ~ 370°F (183 ~ 188°C)
No-Clean
20 AWG, 21 SWG
-
Leaded
Tube, 0.50 oz (14.17g)
-
-
-
NC191LT10
NC191LT10
SMOOTH FLOW LOW TEMP SOLDER PAST
Chip Quik Inc.
63
In Stock
1 : ¥69.02000
Bulk
Bulk
Active
Solder Paste
Bi57.6Sn42Ag0.4 (57.6/42/0.4)
-
280°F (138°C)
No-Clean
-
4
Lead Free
Syringe, 0.35 oz (10g), 5cc
6 Months
Date of Manufacture
37°F ~ 46°F (3°C ~ 8°C)
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of 2

Solder

Solder is Metal Alloys that are used to join metal surfaces to each other. The types are bar solder, ribbon solder, solder paste, solder shot, solder sphere, or wire solder in diameters ranging from 0.006” (0.15mm) to 0.250” (6.35mm) with melting point ranging from 244°F (118°C) to 1983°F (1084°C) in lead free or leaded. The flux type is acid cored, no-clean, rosin activated, rosin mildly activated, or water soluble.