Socket Adapters

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of 11

Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Convert From (Adapter End)	Convert To (Adapter End)	Number of Pins	Pitch - Mating	Contact Finish - Mating	Mounting Type	Termination	Pitch - Post	Contact Finish - Post	Housing Material	Board Material

14-35W000-10 SOCKET ADAPT SOIC-W TO 14DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	220 : ¥96.88559 Bulk	Correct-A-Chip® 35W000	Bulk	Active	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	14	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
16-35W000-10 SOCKET ADAPT SOIC-W TO 16DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	144 : ¥97.75625 Bulk	Correct-A-Chip® 35W000	Bulk	Active	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	16	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
18-35W000-10 SOCKET ADAPT SOIC-W TO 18DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	144 : ¥98.75104 Bulk	Correct-A-Chip® 35W000	Bulk	Active	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	18	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
20-35W000-10 SOCKET ADAPT SOIC-W TO 20DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	144 : ¥99.74583 Bulk	Correct-A-Chip® 35W000	Bulk	Active	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	20	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
24-35W000-10 SOCKET ADAPT SOIC-W TO 24DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	144 : ¥100.74125 Bulk	Correct-A-Chip® 35W000	Bulk	Active	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	24	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Tin-Lead	-	FR4 Epoxy Glass
16-35W000-11-RC SOCKET ADAPT SOIC-W TO 16DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	220 : ¥141.86650 Bulk	Correct-A-Chip® 35W000	Bulk	Active	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	16	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
18-35W000-11-RC SOCKET ADAPT SOIC-W TO 18DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	144 : ¥143.30896 Bulk	Correct-A-Chip® 35W000	Bulk	Active	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	18	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
24-35W000-11-RC SOCKET ADAPT SOIC-W TO 24DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	144 : ¥146.07451 Bulk	Correct-A-Chip® 35W000	Bulk	Active	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	24	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
28-35W000-11-RC SOCKET ADAPT SOIC-W TO 28DIP 0.3 Aries Electronics	0 In Stock Check Lead Time	126 : ¥147.51738 Bulk	Correct-A-Chip® 35W000	Bulk	Active	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	28	-	-	Through Hole	Solder	0.050" (1.27mm)	Gold	-	FR4 Epoxy Glass
16-35W000-11-RC-P (220 UP) SOCKET ADAPT SOIC-W TO 16DIP 0.3 Aries Electronics	0 In Stock	Discontinued at Digi-Key	Correct-A-Chip® 35W000	Bulk	Discontinued at Digi-Key	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	16	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass
14-35W000-11-RC SOCKET ADAPT SOIC-W TO 14DIP 0.3 Aries Electronics	0 In Stock	Active	Correct-A-Chip® 35W000	Bulk	Active	SOIC-W	DIP, 0.3" (7.62mm) Row Spacing	14	0.050" (1.27mm)	-	Through Hole	Solder	0.100" (2.54mm)	Gold	-	FR4 Epoxy Glass

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Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Socket adapters allow the use of ICs and transistors of one package type to be used in place of another package type such as adapting an eight-pin DIP package to a JEDEC socket package. Popular surface mount and through-hole packages may be converted to DIP, JEDEC, PGA, PLCC, QFP, SOIC and SOWIC.