Socket Adapters

Results: 4
Packaging
BoxTube
Convert From (Adapter End)
DIP, 0.3" (7.62mm) Row SpacingDIP, 0.6" (15.24mm) Row Spacing
Convert To (Adapter End)
DIP, 0.3" (7.62mm) Row SpacingDIP, 0.6" (15.24mm) Row Spacing
Number of Pins
164048
Termination
SolderWire Wrap
Stocking Options
Environmental Options
Media
Marketplace Product
4Results

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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Convert From (Adapter End)
Convert To (Adapter End)
Number of Pins
Pitch - Mating
Contact Finish - Mating
Mounting Type
Termination
Pitch - Post
Contact Finish - Post
Housing Material
Board Material
216-3340-09-0602J
216-3340-09-0602J
SOCKET ADAPTER 16DIP TO 16DIP
3M
111
In Stock
1 : ¥144.82000
Tube
Tube
Active
DIP, 0.3" (7.62mm) Row Spacing
DIP, 0.3" (7.62mm) Row Spacing
16
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
248-1282_29-0602J
248-1282-29-0602J
RECEPTACLE DIP SOCKET 48POS .6"
3M
129
In Stock
1 : ¥332.66000
Box
Box
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
48
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
240-1280-19-0602J
240-1280-19-0602J
RECEPTACLE DIP SOCKET 40POS .6"
3M
36
In Stock
1 : ¥371.17000
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Wire Wrap
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
240-1280-09-0602J
240-1280-09-0602J
SOCKET ADAPTER 40DIP TO 40DIP
3M
0
In Stock
Check Lead Time
30 : ¥303.96233
Tube
Tube
Active
DIP, 0.6" (15.24mm) Row Spacing
DIP, 0.6" (15.24mm) Row Spacing
40
0.100" (2.54mm)
Gold
Through Hole
Solder
0.100" (2.54mm)
Gold
Polysulfone (PSU), Glass Filled
-
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of 4

Socket Adapters


Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Socket adapters allow the use of ICs and transistors of one package type to be used in place of another package type such as adapting an eight-pin DIP package to a JEDEC socket package. Popular surface mount and through-hole packages may be converted to DIP, JEDEC, PGA, PLCC, QFP, SOIC and SOWIC.