IC Sockets

Results: 4
Packaging
BulkTray
Contact Finish Thickness - Mating
15.0µin (0.38µm)30.0µin (0.76µm)
Contact Material - Post
-Copper Alloy
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Marketplace Product
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Mfr Part #
Quantity Available
Price
Series
Package
Product Status
Type
Number of Positions or Pins (Grid)
Pitch - Mating
Contact Finish - Mating
Contact Finish Thickness - Mating
Contact Material - Mating
Mounting Type
Features
Termination
Pitch - Post
Contact Finish - Post
Contact Finish Thickness - Post
Contact Material - Post
Housing Material
Operating Temperature
105142013x
1051420132
CONN SOCKET LGA 2011POS GOLD
Molex
0
In Stock
Obsolete
Bulk
Obsolete
LGA
2011 (47 x 58)
0.040" (1.02mm)
Gold
15.0µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.040" (1.01mm)
-
-
-
Thermoplastic
-
105142013x
1051420133
CONN SOCKET LGA 2011POS GOLD
Molex
0
In Stock
Obsolete
Tray
Obsolete
LGA
2011 (47 x 58)
0.040" (1.02mm)
Gold
30.0µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.040" (1.01mm)
-
-
-
Thermoplastic
-
CONN SOCKET LGA 2011POS GOLD
1051420432
CONN SOCKET LGA 2011POS GOLD
Molex
0
In Stock
Obsolete
Bulk
Obsolete
LGA
2011 (47 x 58)
0.040" (1.02mm)
Gold
15.0µin (0.38µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.040" (1.01mm)
-
-
Copper Alloy
Thermoplastic
-
CONN SOCKET LGA 2011POS GOLD
1051420433
CONN SOCKET LGA 2011POS GOLD
Molex
0
In Stock
Obsolete
Bulk
Obsolete
LGA
2011 (47 x 58)
0.040" (1.02mm)
Gold
30.0µin (0.76µm)
Copper Alloy
Surface Mount
Open Frame
Solder
0.040" (1.01mm)
-
-
-
Thermoplastic
-
Showing
of 4

IC Sockets


Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.