IC Sockets

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Mfr Part #	Quantity Available	Price	Series	Package	Product Status	Type	Number of Positions or Pins (Grid)	Pitch - Mating	Contact Finish - Mating	Contact Finish Thickness - Mating	Contact Material - Mating	Mounting Type	Features	Termination	Pitch - Post	Contact Finish - Post	Contact Finish Thickness - Post	Contact Material - Post	Housing Material	Operating Temperature

1-2199298-3 CONN IC DIP SOCKET 14POS TIN TE Connectivity AMP Connectors	2,274 In Stock	1 : ¥1.72000 Tube	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C
DILB8P-223TLF CONN IC DIP SOCKET 8POS TIN Amphenol ICC (FCI)	10,413 In Stock	1 : ¥2.96000 Tube	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	8 (2 x 4)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 105°C
DILB16P-223TLF CONN IC DIP SOCKET 16POS TIN Amphenol ICC (FCI)	9,358 In Stock	1 : ¥3.53000 Tube	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	16 (2 x 8)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 105°C
DILB14P-223TLF CONN IC DIP SOCKET 14POS TIN Amphenol ICC (FCI)	6,238 In Stock	1 : ¥4.43000 Tube	-	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	14 (2 x 7)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 105°C
DILB28P-223TLF CONN IC DIP SOCKET 28POS TIN Amphenol ICC (FCI)	6,710 In Stock	1 : ¥7.88000 Tube	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	28 (2 x 14)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 105°C
DILB40P-223TLF CONN IC DIP SOCKET 40POS TIN Amphenol ICC (FCI)	11,517 In Stock	1 : ¥11.16000 Tube	-	Tube	Active	DIP, 0.6" (15.24mm) Row Spacing	40 (2 x 20)	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	100.0µin (2.54µm)	Copper Alloy	Polyamide (PA), Nylon	-55°C ~ 105°C
1-2199298-6 CONN IC DIP SOCKET 20POS TIN TE Connectivity AMP Connectors	399 In Stock	1 : ¥3.86000 Tube	Diplomate DL	Tube	Active	DIP, 0.3" (7.62mm) Row Spacing	20 (2 x 10)	0.100" (2.54mm)	Tin	60.0µin (1.52µm)	Phosphor Bronze	Through Hole	Open Frame	Solder	0.100" (2.54mm)	Tin	-	Brass, Copper	Polybutylene Terephthalate (PBT), Glass Filled	-40°C ~ 105°C

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IC Sockets

Sockets provide for repeated insertion, removal, substitution and replacement of Integrated Circuits (ICs) and transistors in a circuit. Mounting types include chassis, panel, connector, board surface and through-hole. Socket features include board guides, carriers, flanges, and open and closed framing. They are differentiated by post pitch, contact material and finish, termination style and contact finish.